Techno

logy

( 1)

Underwater Laser Machining Process

Heat-Affected Zone (HAZ)
1

1 (HAZ) (silicon)

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2



(ultra-short pulsed laser)
1 (picosecond) 10-12

(material removal rate)




Ultra-short Pulsed Laser

Production Techno

logy

(liquid-assisted laser material processing)
..2513

(thermal-sensitive materials)




(KOH)


Wetability



2
(underwater laser machining process)
(waterjet-guided laser machining process)

>>

(underwater laser
machining process)

(underwater laser machining process)

1-3

2
Cavitation (shock wave)
(plasma)

Shock
Processing Shock Preening

4-10

Exothermic Reaction

(quartz)

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logy

Keyhole
3

(redeposition)

4

LCD MEMS

3 Keyhole

Keyhole

500
Nd:YAG
1064
30
63.2

(taper angle)
U V

(a) (b)

(femtosecond laser) Ultra-Short Pulsed Laser

Shock Wave

(CW laser) (pulsed laser)
CO2 Nd:YAG

(waterjet-guided laser machining process)

()

Tangwarodomnukun, V., Wang, J. and Mathew, P. (2010). A Comparison

of Dry and Underwater Laser Micromachining of Silicon Substrates. Key Engineering
Materials, 443, pp.693-698.

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