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HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE9216-A


Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 1/3

HTIF127
PNP EPITAXIAL PLANAR TRANSISTOR

Description
The HTIF127 is designed for use in general purpose amplifier and
low-speed switching applications.

Absolute Maximum Ratings (Ta=25C)


Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 C
Junction Temperature ................................................................................... +150 C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25C) .................................................................................... 45 W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage ................................................................................... -100 V
BVCEO Collector to Emitter Voltage................................................................................ -100 V
BVEBO Emitter to Base Voltage .......................................................................................... -5 V
IC Collector Current (Pulse)................................................................................................. -8 A
IC Collector Current (Continuous)........................................................................................ -5 A
IB Base Current ............................................................................................................ -120 mA

Characteristics (Ta=25C)
Symbol
BVCBO
*BVCEO
ICBO
ICEO
IEBO
*VCE(sat)1
*VCE(sat)2
*VBE(on)
*hFE1
*hFE2

Min.
-100
-100
1
1

Typ.
-

Max.
-200
-500
-2
-2
-4
-2.5
-

Unit
V
V
uA
uA
mA
V
V
V
K
K

Test Conditions
IC=-1mA
IC=-100mA
VCB=-100V
VCE=-50V
VEB=-5V
IC=-3A, IB=-12mA
IC=-5A, IB=-20mA
IC=-3A, VCE=-3V
IC=-0.5A, VCE=-3V
IC=-3A, VCE=-3V
*Pulse Test : Pulse Width 380us, Duty Cycle2%

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE9216-A


Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 2/3

MICROELECTRONICS CORP.
Characteristics Curve

Saturation Voltage & Collector Current

Current Gain & Collector Current


10000

10000

hFE

Saturation Voltage (mV)

hFE @ VCE=4V

1000

100

10

VBE(sat) @ IC=100IB

1000

VCE(sat) @ IC=100IB

100
1

10

100

1000

10000

10

100

Collector Current (mA)

1000

10000

Collector Current (mA)

On Voltage & Collector Current

Switching Time & Collector Current

10000

10

1000

VBE(on)

Switching Times (us)

On Voltage (mV)

VCC=30V, IC=250IB1=-250IB2

VCE=4V

Tstg
1
Tf
Ton

0.1

100
1

10

100

1000

10000

10

Collector Current (mA)

Collector Current (A)

Capacitance & Reverse-Biased Voltage

Safe Operating Area

1000

100000

PT=1ms

Collector Current-IC (mA)

Capacitance (pF)

10000

100

Cob

PT=100ms
1000
PT=1s
100

10

10

1
0.1

10

Reverse-Biased Voltage (V)

100

10

100

Forward Voltage-V CE (V)

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE9216-A


Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 3/3

MICROELECTRONICS CORP.
TO-220FP Dimension
Marking :

E O

Product Series
Rank

Style : Pin 1.Base 2.Collector 3.Emitter

HSMC Logo
Part Number
Date Code

3
N
2

K
1
M

3-Lead TO-220FP Plastic Package


HSMC Package Code : F
*:Typical

Inches

DIM

Min.
0.2480
0.3386
0.1673
0.1043
0.0230
0.3980
0.1083
0.3386
-

A
B
C
D
E
F
G
H
I
J

Max.
0.2520
0.3425
0.1870
0.1083
0.0242
0.4039
0.1122
0.3425
*0.1496
*0.0236

Millimeters
Min.
Max.
6.30
6.40
8.60
8.70
4.25
4.75
2.65
2.75
0.58
0.61
10.11
10.26
2.75
2.85
8.60
8.70
*3.80
*0.60

DIM
K
L
M
N
O
1
2
3
4
5

Inches
Min.
0.5118
0.5886
0.1098
-

Millimeters
Min.
Max.
*2.55
13.00
15.00
14.95
15.05
*1.70
2.79
2.83
*2
*5
*15
*5
*5

Max.
*0.1004
0.5906
0.5925
*0.0669
0.1114
-2
*5
*15
*5
*5

Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory :


Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220

HSMC Product Specification

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