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  • (P D M S) : Oly I Ethyl Iloxane

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    The document discusses the properties and processing of polydimethylsiloxane (PDMS). PDMS is a transparent polymer with a low elastic modulus and density. It can be processed by mixing monomers and curing agents, casting the mixture into a mold, and curing it. PDMS has high gas permeability, can be cast into structures smaller than 10 nm, and layers can be bonded with oxygen plasma treatment. However, it is not commercially photo-patternable and has high permeability to air and water vapor.

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    DLIIPDMS

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    DLIIPDMS

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    The document discusses the properties and processing of polydimethylsiloxane (PDMS). PDMS is a transparent polymer with a low elastic modulus and density. It can be processed by mixing monomers and curing agents, casting the mixture into a mold, and curing it. PDMS has high gas permeability, can be cast into structures smaller than 10 nm, and layers can be bonded with oxygen plasma treatment. However, it is not commercially photo-patternable and has high permeability to air and water vapor.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pdf or txt
    34 views9 pages

    (P D M S) : Oly I Ethyl Iloxane

    Uploaded by

    enjoyguruji
    The document discusses the properties and processing of polydimethylsiloxane (PDMS). PDMS is a transparent polymer with a low elastic modulus and density. It can be processed by mixing monomers and curing agents, casting the mixture into a mold, and curing it. PDMS has high gas permeability, can be cast into structures smaller than 10 nm, and layers can be bonded with oxygen plasma treatment. However, it is not commercially photo-patternable and has high permeability to air and water vapor.

    Copyright:

    Attribution Non-Commercial (BY-NC)
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    of 9

    DL II Institute of Microsystem Technology

    PDMS
    (PolyDiMethylSiloxane)
    D. Strohmeier, F. Schneider*
    University of Freiburg IMTEK, Department of Microsystems Engineering, Laboratory of Simulation, *Laboratory for Microactuators,

    Designlab II

    DPMS

    D.Strohmeier, F.Schneider

    DL II Institute of Microsystem Technology

    Outline

    Definition: PDMS Material properties Application Processing Summary

    Designlab II

    DPMS

    D.Strohmeier, F.Schneider

    DL II Institute of Microsystem Technology

    Physical properties (RTV 615)


    Color: Viscosity: Poisson Ratio: Elastic modulus: Thermal conductivity: Density: transparent 4300 mPas 4.8 1.5 MPa 0.2 W/mK 1.05 g/cm3

    Dielectric breakdown strength: 20 kV/mm Dielectric constant: 2.7 Working temperature: Minimum structure size: Gas permeability: 50C to 200C < 10 nm air, water vapor

    Designlab II

    DPMS

    D.Strohmeier, F.Schneider

    DL II Institute of Microsystem Technology

    Processing

    Designlab II

    DPMS

    D.Strohmeier, F.Schneider

    DL II Institute of Microsystem Technology

    Application

    Designlab II

    DPMS

    D.Strohmeier, F.Schneider

    DL II Institute of Microsystem Technology

    General process
    Monomer (M)

    Curing agent (C)

    Demolding
    (E 2 MPa)

    10:1

    Air

    Hardening in a oven Mix M & C in a weight ration of 10: 1


    ( 4000 mPa s)

    Fill mixture into the mold

    Debubble mixture in a exsiccator

    (24h @ 23C 4h @ 65C 1h @ 100C 15 min @ 150C)

    Designlab II

    DPMS

    D.Strohmeier, F.Schneider

    DL II Institute of Microsystem Technology

    Multilayer (PDMS bonding on wafer level)


    Gluing with thin PDMS interface layer: Does not work without problems Adhesion problems

    O2-Plasma: Bond withstand 3.5 bar

    Different Monomer:Curing agent weight ratio: Diffusion of curing agent

    Designlab II

    DPMS

    D.Strohmeier, F.Schneider

    DL II Institute of Microsystem Technology

    Summary

    Positive: High working temperature range (50C to 200C) Casting (minimum structure size < 10 nm) () PDMS bonding (O2-plasma) Negative: No commercial photo-patterable PDMS Gas permeability (air, water vapor)

    Designlab II

    DPMS

    D.Strohmeier, F.Schneider

    DL II Institute of Microsystem Technology

    Contact for datasheet dirk.strohmeier@imtek.uni-freiburg.de Tel: +49-761-203-7385

    Thank you for your atention!

    Designlab II

    DPMS

    D.Strohmeier, F.Schneider

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