Plastic Packages for Integrated Circuits

Package Outline Drawing

P6.064B
6 LEAD THIN SMALL OUTLINE TRANSISTOR (TSOT) PLASTIC PACKAGE Rev 1, 4/10
1.90 0.95 D A 6 5 4 0-8 0.120-0.197

PIN 1 INDEX AREA 2.80 3 1.60 3 0.15 C D 2x 8 (0.60) 1 2 3 0.25 C 2x 0.38 0.07 3 SEE DETAIL X END VIEW

0.20 M C A-B D TOP VIEW

2.90

0.15 C A-B 2x 0.87 0.03 C 1.00 MAX

(0.25) GAUGE PLANE 0.10 C SEATING PLANE

SIDE VIEW

0.00-0.10

DETAIL "X"

0.400.1

(0.60)

(1.20) NOTES: 1. Dimensions and tolerances are as per ASME Y14.5M-1994 (2.40) 2. Dimensions are in mm. Dimensions in ( ) are for reference only. 3. Dimension is exclusive of mold flash, protrusions or gate burrs. 4. Foot length is measured at reference to gauge plane. 5. This dimension is measured at Datum "H". 6. Package conforms to JEDEC MO-178AA. (0.95) (1.90) TYPICAL RECOMMENDED LAND PATTERN 7. Plastic or metal protrusions of 0.15mm max per side are not included. 8. Plastic interlead protrusions of 0.15mm max per side are not included.