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EE518 - Top Down and Bottom Up1
EE518 - Top Down and Bottom Up1
Presented by:
Steven Price
Outline of Presentation
Top-down approach Bottom-up approach Why will it be needed? Applications Challenges of Bottom-up processing The future of top-down and bottom-up processing Summary
Top-Down Approach
Uses the traditional methods to pattern a bulk wafer as in EE 418 lab. Is limited by the resolution of lithography.
http://pages.unibas.ch/phys-meso/Education/Projektstudien/Lithographie/Litho-M1-Lithography.html
Adding a layer of material over the entire wafer and patterning that layer through photolithography. Patterning bulk silicon by etching away certain areas.
www.nanoscience.at/ aboutnano_en.html
Use of 193 excimer laser with phase shift masks to for features 65 nm in size. Phase shift masks and complex optics are used to achieve this resolution.
http://www.lrsm.upenn.edu/~frenchrh/lithography.htm
Cost of new machines and clean room environments grows exponentially with newer technologies. Physical limits of photolithography are becoming a problem. With smaller geometries and conventional materials, heat dissipation is a problem.
http://www.cit.gu.edu.au/~s55086/qucomp/gifs/intro.moore1.gif
Bottom-Up Approach
The opposite of the top-down approach. Instead of taking material away to make structures, the bottomup approach selectively adds atoms to create structures. http://idol.union.edu/~malekis/ESC24/KoskywebModules/sa_topd.htm
Crystals
Humans
http://www.csacs.mcgill.ca/selfassembly.htm
Bottom Up Process
Start with bulk wafer
Alter area of wafer where structure is to be created by adding polymer or seed crystals or other techniques.
Grow or assemble the structure on the area determined by the seed crystals or polymer. (self assembly)
Allows smaller geometries than photolithography. Certain structures such as Carbon Nanotubes and Si nanowires are grown through a bottom-up process. New technologies such as organic semiconductors employ bottom-up processes to pattern them. Can make formation of films and structures much easier. Is more economical than top-down in that it does not waste material to etching.
Self Assembly
The principle behind bottom-up processing. Self assembly is the coordinated action of independent entities to produce larger, ordered structures or achieve a desired shape. Found in nature. Start on the atomic scale.
Self-organizing deposition of silicon nanodots. Formation of Nanowires. Nanotube transistor. Self-assembled monolayers. Carbon nanotube interconnects.
http://web.ics.purdue.edu/~mmaschma/bias_image_gallery1.htm
Making Nanodots
Process for making nanodots 1. Apply layer of selfassembled polymer film. 2. Grow layer of desired material to create nanodot.
65 billion nanodots per square cm
http://news.bbc.co.uk/1/hi/sci/tech/33010241.stm
Nanodots
Each nanodot can hold one bit of information.
Stronger than steel Multiple tubes slide inside of each other with minimal effects of friction. Electrical current density 1000 times greater than silver or copper. Can range from having metallic properties to semiconductor properties based on its configuration.
http://en.wikipedia.org/wiki/Nanotubes
metallic
http://www.tipmagazine.com/tip/INPHFA/vol-10/iss1/p24.html
Deposit few particles of Iron (most common) to act as catalyst. Apply a hot environment of carbon containing gas (typically CH4) The particle catalyzes the decomposition of the gas and carbon dissolves in the particle. When the particle is supersaturated with carbon, it extrudes the excess carbon in the form of a tube.
http://www.phys.hawaii.edu/~sattler/Archives/archives91-94Apr7-2.htm
Nanotube Transistor
Basic diagram for a nanotube transistor Benefits of transistor over conventional designs:
Smaller
Faster Less material used Many of the problems
www.nanotech-now.com/ news.cgi?story_id=06788
DNA strands connect to gold electrodes on top of silicon. DNA strands connect to ends of carbon nanotube. Silicon and nanotubes are mixed and the DNA makes the connections to form nanotube transistors.
http://www.trnmag.com/Photos/2004/12150 4/DNA%20makes%20nanotube%20transist ors%20Image.html
Interface between metal electrodes and carbon nanotube is very sensitive. Changing just one atom can significantly affect transistor performance. Self-assembling nanotubes is not efficient. Growing nanotubes in place has had little success.
http://www.thomas-swan.co.uk/pages/nano_images.html
http://www.mtl.kyotou.ac.jp/english/laboratory/nanoscopic/nanoscopic.htm
Molecules are deposited moleculeby-molecule to form a self-assembled monolayer. Creates a high quality layer of material. Layers are deposited one layer at a time.
Monolayers
http://www.orfid.com/images/img-vofet1.gif
Organic molecules cant be deposited using extreme conditions because it would damage the organic molecules. SAMS technique does not damage organic molecules. SAMS films are nearly defect free. Used to deposit organic semiconductors.
Metal contact acts as a catalyst to promote one-dimensional crystal growth. Can one day be implemented as interconnects.
Silicon Nanowire Diameter <1nm
http://www.iht.rwth-aachen.de/en/Forschung/nano/bottomup/nanowires.php
http://www.nasa.gov/centers/ames/research/technology-onepagers/carbon_nanotubes_vertical.html
http://www.nasa.gov/centers/ames/research/technologyonepagers/carbon_nanotubes_vertical.html
Can have a much greater conductivity than copper. Is more heat resistant than copper. Carries a much larger current than copper. Orientation of carbon nanotubes remains a problem. Technology is not reliable enough to be used in device manufacturing.
Making sure that the structures grow and assemble in the correct way. Forming complex patterns and structures using self assembly. Contamination has a significant impact on devices with such small geometries. Fabricating robust structures.
Combination of topdown and bottom-up processes to simplify construction. Use catalysts and stresses to achieve more one-directional growth.
http://www.isnm2005.org/_metacanvas/attach_handler.uhtml?attach_id=296&c ontent_type=application/pdf&filename=Paper%2036.pdf
http://www.imec.be/wwwinter/business/nanotechnology.pdf
Carbon nanotube transistor (Stanford U.) Organic monolayers for organic transistor (Yale U.) Nanotube based circuit constructed (IBM) Nanomotors and gears created (NASA)
http://snf.stanford.edu/Education/Nanotechnology.SNF.ppt
Vias and interconnects being implemented with carbon nanotubes. Nanotube transistors replacing conventional designs. SAMS being used to create organic semiconductor based devices. Carbon nanotubes becoming more and more prevalent as their growth is controlled.
http://www.engin.brown.edu/Faculty/Xu/
Conclusion
Top-down processing has been and will be the dominant process in semiconductor manufacturing. Newer technologies such as nanotubes and organic semiconductors will require a bottom-up approach for processing. Self-assembly eliminates the need for photolithography. Bottom-up processing will become more and more prevalent in semiconductor manufacturing.