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  • SOIC8 / SO8 Adapter Board DIL Converter For Prototyping in Breadboards.

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    teix9360
    193 views2 pages
    Adapter Board for prototyping with devices with SOIC8 / SO8 package. Can be used as a DIL converter or for breadboard testing. Have ground connection to bottom copper for lower noise. Have a solder mask layer to avoid bridges of solder when hand soldered.

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    SOIC8 / SO8 adapter board DIL converter for prototyping in breadboards.

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    Adapter Board for prototyping with devices with SOIC8 / SO8 package. Can be used as a DIL converter or for breadboard testing. Have ground connection to bottom copper for lower noise. Have a solder mask layer to avoid bridges of solder when hand soldered.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pdf or txt
    193 views2 pages

    SOIC8 / SO8 Adapter Board DIL Converter For Prototyping in Breadboards.

    Uploaded by

    teix9360
    Adapter Board for prototyping with devices with SOIC8 / SO8 package. Can be used as a DIL converter or for breadboard testing. Have ground connection to bottom copper for lower noise. Have a solder mask layer to avoid bridges of solder when hand soldered.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pdf or txt
    of 2

    SOIC8 / SO8 BOARD ADAPTER

    1. Package SOIC8 dimensions


    SOIC8 p (pitch) 1,27 mm HE 5,8 6,2 mm E 3,8 4 mm D 4,8 - 5 mm b (pad width) 0,36 0,5 mm

    2. Other packages that have the same pad layout: SOIC8 = SO8 = SOT96 ; SOP8 Links:
    http://www.nxp.com/documents/other/Package_x-ref_packing_outlines.pdf http://www.analog.com/en/pcb-design-resources/content/pcb_design_resources/fca.html http://www.onsemi.com/pub_link/Collateral/751-07.PDF http://www.microchip.com/stellent/groups/techpub_sg/documents/packagingspec/en012702.pdf

    3. Our PCB board DIL compatible


    Pitch Spacing: Distance between connectors Board Material: Hole Diameter: Board Height: Board Width: Board Thickness: Copper Coating : Copper Thickness: No. of Copper Sides: Solder mask ROHS 2.54mm 7,61 mm FR4 Epoxy Fibreglass 0,95 mm 11mm 11mm 1.5mm chem. Niquel Gold 35m 2 yes Conform

    CAD drawing of top and bottom layers Bottom copper layer have a pad for easy ground connection

    OUR SITE OUR E-SHOP

    www.breadboard-adapters.com

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