M I D for LDS 技術

„ MID 即為 Molded Interconnect Device 的簡稱。

„ 塑膠射出成形的元件，表面作出有三次元立體電線回路。主要取其
節省空間、組裝容易、高良率的優點。

„ 一個塑膠元件同時也是電路板，很明顯的， MID 成品零件少，體

積小，免除某些組合步驟，而材料需求也相對減少。

„ LDS技術 - Laser-Direct-Structuring
華宏新技股份有限公司
WAH HONG INDUSTRIAL CORP.
劉高佑 Johnny Liu
Tel.: 886-3-270-9955 ext: 63150
Mobile: 886-925-526619
E-Mail: johnny.liu@wahhong.com.tw
Web-site: www.wahhong.com.tw
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 LDS MID技術優點-(1)

„ Full Additive Process:

Selective metallization of thermoplastic injection molded parts by

Laser-Direct-Structuring

„ in only three Process Steps:

„ Injection Moulding
„ Laser Processing / Activation
„ Metallization

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 LDS MID技術優點-(2)
Flexibility by Laser Processing
„ Flexible Process
„ no extra tool, no mask

„ processing directly from the CAD data

„ Fast 3-D Structuring

„ high dynamic laser beam deflection

„ contactless processing

„ High Resolution
„ laser spot size < 100 µm

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 LDS MID技術優點-(3)

¾只需開塑膠模具，且打樣成本低.

¾可因應天線開發過程中多次修改需求.

¾採塑件電鍍，不影響天線之電氣特性與穩定度.

¾微小化程度佳，最小線路可達0.1mm, 最小間格達0.15mm.

¾天線體積較小，符合手機薄型化的趨勢.

¾設計&開發時間較短.

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 MID for LDS製程
only three Process
Steps

„ Injection Molding

„ Laser Processing

„ Plating

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 Injection Molding
„ Injection Molding of LDS-Polymers:

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 Laser Processing

„ LDS MicroLine 3D Industrial

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 Chemical Metallization of the
Laser-activated parts
„ Plating Line:

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 Principle – Generation of
a micro-rough Surface

Sketch: modified polymer

Laser

Activated additive by
laser ablation

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 Principle – Adhesive Metallization
laser processed area
partly embedded tracks

Bild mit strukturierter

Oberfläche und
Cu un-processed
unstrukturierter Oberfläche
area

modified polymer

Adhesive „anchoring“
of plated Cu

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 Summary

„ More flexibility in product design.

„ Only three process steps (1Kshot molding, surface processing,

metallization).

„ Maximum function integration in minimum space.

„ Cost savings in production.

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Thanks & Comments

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