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www.soldertec.

com
Tel: 0044 (0) 1727 875 544
Fax: 0044 (0) 1727 871 341
Email: info@soldertec.com

Soldertec
Unit 3, Curo Park
Frogmore
St. Albans
Destructive Testing
Hertfordshire of PCBs, electronic components,
AL2 2DD
United Kingdom Soldertec Global is part of ITRI Innovation assemblies and materials
“Tests can be carried out to investigate
a part’s failure, in order to understand
its structural performance or material
behavior. These tests are generally
much easier to carry out, yield more
information, and are easier to interpret
than nondestructive testing. Sometimes
they are the only option to enable us to Soldertec Manager,
Dr Wayne Lam

offer a definitive answer.”

Microsection Tin whiskers

Our Solutions Decapping LBGA

PCB laminates Testing Electronic Assemblies

IPC6012 Failure analysis using


Solderability testing Dye & Pry, SEM &EDX
using wetting balance Cleanliness checked using
Cleanliness checked contaminometer
using contaminometer RoHS compliance
Tin Whiskering China-RoHS compliance
Failure analysis using SEM &EDX Salt spray & corrosion testing
Testing for black pad on ENIG Tin Whiskering

Electronic Components testing Materials

Solderability testing Surface Insulation Resistance


using wetting balance and Electromigration
Cleanliness checked using RoHS compliance
contaminometer China-RoHS compliance
intermetallic
Failure analysis using SEM &EDX Wet chemical analysis
Bond wire testing IR, UV/Vis spectroscopy
Tin Whiskering Metals analysis using ICP & AAS
Counterfeit detection Particle size measurements
De-capping of ICs Crystal structure analysis
using XRD

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