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    Reiview On MPICS3719

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    rockmanx182
    The document discusses various issues with a manufacturing process including solder paste bridging, questions about pick and place programs and CAD data, identifying bottom sides of components for SMT, definitions needed for shop floor data systems, differences between solder paste and solder core, when inspection stamps are added, and requesting an electronic component specification copy and clarification on its relation to another specification.

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    Reiview On MPICS3719

    Uploaded by

    rockmanx182
    20 views1 page
    The document discusses various issues with a manufacturing process including solder paste bridging, questions about pick and place programs and CAD data, identifying bottom sides of components for SMT, definitions needed for shop floor data systems, differences between solder paste and solder core, when inspection stamps are added, and requesting an electronic component specification copy and clarification on its relation to another specification.

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    Reiview on MPICS3719

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    Reiview on MPICS3719

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    The document discusses various issues with a manufacturing process including solder paste bridging, questions about pick and place programs and CAD data, identifying bottom sides of components for SMT, definitions needed for shop floor data systems, differences between solder paste and solder core, when inspection stamps are added, and requesting an electronic component specification copy and clarification on its relation to another specification.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as DOCX, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as docx, pdf, or txt
    20 views1 page

    Reiview On MPICS3719

    Uploaded by

    rockmanx182
    The document discusses various issues with a manufacturing process including solder paste bridging, questions about pick and place programs and CAD data, identifying bottom sides of components for SMT, definitions needed for shop floor data systems, differences between solder paste and solder core, when inspection stamps are added, and requesting an electronic component specification copy and clarification on its relation to another specification.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as DOCX, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as docx, pdf, or txt
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    Reiview on MPICS3719

    1) Solder paste bridging


    2) Pick & Place program?; CAD Data?; Go over First Article. 3) SMT? How do you know it is the bottom side 4) Shop Floor Data System? 10) Please explain? S/b defined? Im guessing should be? 11) Solder Paste vs. Solder Core? If solder paste is not used, does this conflict with the solder paste bridging comment made in #1? 12) Explain # 12 14) Inspection stamp/sticker always added after final quality check is peformed? 15) Can I get an electronic copy of the component specification? CS3917. Is CS 3917 different from CS3722 (the one you gave me)?

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