Feb.

2011

DDR3 SDRAM Memory

Product Guide

SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND

SPECIFICATIONS WITHOUT NOTICE.

Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or otherwise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2011 Samsung Electronics Co., Ltd. All rights reserved.

-1-

Feb. 2011

Product Guide

DDR3 SDRAM Memory

1. DDR3 SDRAM MEMORY ORDERING INFORMATION

1

10

11

K 4 B X X X X X X X - X X X X
Speed

SAMSUNG Memory
DRAM

Temp & Power

DRAM Type

Package Type

Density

Revision
Interface (VDD, VDDQ)

Bit Organization

# of Internal Banks

1. SAMSUNG Memory : K

7. Interface ( VDD, VDDQ)

6 : SSTL (1.5V, 1.5V)

2. DRAM : 4
8. Revision
M
A
B
C
D
E
F
G
H

3. DRAM Type
B : DDR3 SDRAM

4. Density
51 : 512Mb
1G :
1Gb
2G :
2Gb
4G :
4Gb

: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen.
: 8th Gen.
: 9th Gen.

9. Package Type
Z
H
J
M
B

5. Bit Organization
04 : x 4
08 : x 8
16 : x16

:
:
:
:
:

FBGA (Lead-free)
FBGA (Halogen-free & Lead-free)
FBGA (Lead-free, DDP)
FBGA (Halogen-free & Lead-free, DDP)
FBGA (Halogen-free & Lead-free, Flip Chip)

10. Temp & Power

C : Commercial Temp.( 0C ~ 85C) & Normal Power
Y : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)

6. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks

11. Speed
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600
MA : DDR3-1866

-2-

(400MHz @ CL=6, tRCD=6, tRP=6)

(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
(933MHz @ CL=13, tRCD=13, tRP=13)

Feb. 2011

Product Guide

DDR3 SDRAM Memory

2. DDR3 SDRAM Component Product Guide

Density

1Gb F-die

1Gb G-die

2Gb C-die

2Gb D-die

4Gb A-die

4Gb B-die

DDP 4Gb C-die

DDP 4Gb D-die

DDP 8G A-die

DDP 8G B-die

Banks

8Banks

8Banks

8Banks

8Banks

8Banks

8Banks

8Banks

8Banks

8Banks

8Banks

Part Number

Package & Power,

Temp. & Speed

Org.

K4B1G0446F

HCF8/H9/K0

256M x 4

K4B1G0846F

HCF8/H9/K0

128M x 8

K4B1G0446F

HYF8/H9

256M x 4

K4B1G0846F

HYF8/H9

128M x 8

K4B1G0446G

BCF8/H9/K0/MA

256M x 4

K4B1G0846G

BCF8/H9/K0/MA

128M x 8

K4B1G0446G

BYF8/H9/K0

256M x 4

K4B1G0846G

BYF8/H9/K0

128M x 8

K4B2G0446C

HCF8/H9/K0

512M x 4

K4B2G0846C

HCF8/H9/K0

256M x 8

K4B2G0446C

HYF8/H9

512M x 4

K4B2G0846C

HYF8/H9

256M x 8

K4B2G0446D

HCF8/H9/K0/MA

512M x 4

K4B2G0846D

HCF8/H9/K0/MA

256M x 8

K4B2G0446D

HYF8/H9/K0

512M x 4

K4B2G0846D

HYF8/H9/K0

256M x 8

K4B4G0446A

HCF8/H9/K0

1G x 4

K4B4G0846A

HCF8/H9/K0

512M x 8

K4B4G0446A

HYF8/H9/K0

1G x 4

K4B4G0846A

HYF8/H9/K0

512M x 8

K4B4G0446B

HCF8/H9/K0/MA

1G x 4

K4B4G0846B

HCF8/H9/K0/MA

512M x 8

K4B4G0446B

HYF8/H9/K0

1G x 4
512M x 8

K4B4G0846B

HYF8/H9/K0

K4B4G0446C

MCF7/F8/H9

1G x 4

K4B4G0846C

MCF7/F8/H9

512M x 8

K4B4G0446D

MCF8/H9/K0/MA

K4B4G0846D

MCF8/H9/K0

512M x 8

1G x 4

K4B4G0446D

MYF8/H9/K0

1G x 4

K4B4G0846D

MYF8/H9/K0

512M x 8

K4B8G0446A

MCF8/F9/K0

1G x 4

K4B8G0846A

MCF8/F9/K0

512M x 8

K4B8G0446A

MYF8/F9/K0

1G x 4

K4B8G0846A

MYF8/F9/K0

512M x 8

K4B8G0446B

MCF8/F9/K0/MA

1G x 4

K4B8G0846B

MCF8/F9/K0/MA

512M x 8

K4B8G0446B

MYF8/F9/K0

1G x 4

K4B8G0846B

MYF8/F9/K0

512M x 8

* NOTE
1. 1.35V product is 1.5V operatable.

-3-

VDD Voltage1

PKG

Avail.

78 ball
FBGA

Now

78 ball
FBGA

Now

78 ball
FBGA

Now

78 ball
FBGA

Now

1.5V

1.35V

1.5V

1.35V

1.5V

1.35V

1.5V

1.35V

1.5V

78 ball
FBGA

Now

78 ball
FBGA

3Q11

1.35V

1.5V

1.35V

1.5V

78 ball
FBGA

Now

78 ball
FBGA

2Q11

78 ball
FBGA

Now

78 ball
FBGA

3Q11

1.5V

1.35V

1.5V

1.35V

1.5V

1.35V

NOTE

Feb. 2011

Product Guide

DDR3 SDRAM Memory

3. DDR3 SDRAM Module Ordering Information

1

10

11

131

12

M X X X B X X X X X X X - X X X X
Memory Module
DIMM Type
Data bits

Memory Buffer
Speed

DRAM Component Type

Temp & Power

Depth

PCB Revision
Package

# of Banks in Comp. & Interface

Component Revision

Bit Organization
1. Memory Module : M

8. Component Revision
M : 1st Gen.
B : 3rd Gen.
D : 5th Gen.
F : 7th Gen.

2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
71 :
78 :
86 :
91 :
92 :
93 :

x64
x64
x72
x72
x72
x72

204pin Unbuffered SODIMM

240pin Unbuffered DIMM
240pin LR DIMM
240pin ECC unbuffered DIMM
240pin VLP Registered DIMM
240pin Registered DIMM

A
C
E
G

:
:
:
:

2nd Gen.
4th Gen.
6th Gen.
8th Gen.

9. Package
Z : FBGA(Lead-free)
H : FBGA(Lead-free & Halogen-free)
J : FBGA(Lead-free, DDP)
M : FBGA(Lead-free & Halogen-free, DDP)
B : FBGA (Halogen-free & Lead-free, Flip Chip)

10. PCB Revision

4. DRAM Component Type

0 : None
2 : 2nd Rev.
4 : 4th Rev.

B : DDR3 SDRAM (1.5V VDD)

5. Depth
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G: 1G
2G: 2G
4G: 4G

33 : 32M (for 128Mb/512Mb)

65 : 64M (for 128Mb/512Mb)
29 : 128M (for 128Mb/512Mb)
57 : 256M (for 512Mb/2Gb)
52 : 512M (for 512Mb/2Gb)
1K : 1G (for 2Gb)
2K : 2G (for 2Gb)

1 : 1st Rev.
3 : 3rd Rev.
S : Reduced Layer

11. Temp & Power

C : Commercial Temp.( 0C ~ 85C) & Normal Power
Y : Commercial Temp.( 0C ~ 85C) & Low VDD(1.35V)

12. Speed
F7 : DDR3-800
F8 : DDR3-1066
H9 : DDR3-1333
K0 : DDR3-1600
MA: DDR3-1866

(400MHz @ CL=6, tRCD=6, tRP=6)

(533MHz @ CL=7, tRCD=7, tRP=7)
(667MHz @ CL=9, tRCD=9, tRP=9)
(800MHz @ CL=11, tRCD=11, tRP=11)
(933MHz @ CL=13, tRCD=13, tRP=13)

6. # of Banks in comp. & Interface

7 :

8Banks & SSTL-1.5V

13. Memory Buffer

0 : Inphi iMB02-GS02A
1 : IDT MB3 B0

7. Bit Organization
0 : x4
3 : x8
4 : x16

NOTE:
1. Only used for LRDIMM
2. PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
PC3-14900(DDR3-1866)

-4-

Feb. 2011

Product Guide

DDR3 SDRAM Memory

4. DDR3 SDRAM Module Product Guide

4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Org.

Density

128Mx 64

1GB

128Mx 72

1GB

256Mx 64

256Mx 72

2GB

2GB

512Mx 64

4GB

512Mx 72

4GB

1Gx 64

8GB

1Gx 72

8GB

Part Number

Speed

M378B2873FH0

CF8/H9/K0

M378B2873GB0

CF8/H9/K0/MA

M391B2873FH0

CF8/H9/K0

M391B2873GB0

CF8/H9/K0/MA

M378B5673FH0

CF8/H9/K0

M378B5673GB0

CF8/H9/K0/MA

M378B5773CH0

CF8/H9/K0

M378B5773DH0

CF8/H9/K0/MA

M391B5673FH0

CF8/H9/K0

M391B5773CH0

CF8/H9/K0

M391B5773DH0

CF8/H9/K0/MA

M378B5273CH0

CF8/H9/K0

M378B5273DH0

CF8/H9/K0/MA

M391B5273CH0

CF8/H9/K0

M391B5273DH0

CF8/H9/K0/MA

M378B1G73AH0

CF8/H9/K0

M378B1G73BH0 CF8/H9/K0/MA
M391B1G73AH0

CF8/H9/K0

M391B1G73BH0 CF8/H9/K0/MA

Raw Card
A(1Rx8)

D(1Rx8)

B(2Rx8)

A(1Rx8)
E(2Rx8)
D(1Rx8)

B(2Rx8)

E(2Rx8)

B(2Rx8)

E(2Rx8)

Composition

Comp.
Version

128M x 8 * 8 pcs

1Gb

F-die

128M x 8 * 8 pcs

1Gb

G-die

128M x 8 * 9 pcs

1Gb

F-die

128M x 8 * 9 pcs

1Gb

G-die

128M x 8 * 16 pcs

1Gb

F-die

128M x 8 * 16 pcs

1Gb

G-die

256M x 8 * 8 pcs

2Gb

C-die

256M x 8 * 8 pcs

2Gb

D-die

128M x 8 * 18 pcs

1Gb

F-die

256M x 8 * 9 pcs

2Gb

C-die

256M x 8 * 9 pcs

2Gb

D-die

256M x 8 * 16 pcs

2Gb

C-die

256M x 8 * 16 pcs

2Gb

D-die

256M x 8 * 18 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

D-die

512M x 8 * 16 pcs

4Gb

A-die

512M x 8 * 16 pcs

4Gb

B-die

512M x 8 * 18 pcs

4Gb

A-die

512M x 8 * 18 pcs

4Gb

B-die

Internal
Banks

Rank

PKG

Height

78 ball
FBGA

30mm

78 ball
FBGA

30mm

NOTE

Now
Now
Now
Now
Now

78 ball
FBGA
8

Avail.

30mm

Now
Now
Now
Now

78 ball
FBGA

30mm

78 ball
FBGA

30mm

78 ball
FBGA

30mm

78 ball
FBGA

30mm

78 ball
FBGA

30mm

Internal
Banks

Rank

PKG

Height

78 ball
FBGA

30mm

78 ball
FBGA

30mm

78 ball
FBGA

30mm

78 ball
FBGA

30mm

78 ball
FBGA

30mm

Now
Now
Now
Now
Now
Now
Now
2Q11
Now
2Q11

4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)

240Pin DDR3 Unbuffered DIMM
Org.

Density

128Mx 72

1GB

256Mx 72

2GB

512Mx 72

4GB

1Gx 72

8GB

Part Number

Speed

M391B2873FH0

YF8/H9

M391B2873GB0

YF8/H9/K0

M391B5673FH0

YF8/H9

M391B5773CH0

YF8/H9

M391B5773DH0

YF8/H9/K0

M391B5273CH0

YF8/H9

M391B5273DH0

YF8/H9/K0

M391B1G73AH0

YF8/H9

M391B1G73BH0

YF8/H9/K0

Raw Card
D(1Rx8)
E(2Rx8)
D(1Rx8)

E(2Rx8)

E(2Rx8)

Composition

Comp.
Version

128M x 8 * 9 pcs

1Gb

F-die

128M x 8 * 9 pcs

1Gb

G-die

128M x 8 * 18 pcs

1Gb

F-die

256M x 8 * 9 pcs

2Gb

C-die

256M x 8 * 9 pcs

2Gb

D-die

256M x 8 * 18 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

D-die

512M x 8 * 18 pcs

4Gb

A-die

512M x 8 * 18 pcs

4Gb

B-die

* NOTE : 1.35V product is 1.5V operatable.

-5-

Avail.
Now
Now
Now
Now
Now
Now
Now
Now
2Q11

NOTE

Feb. 2011

Product Guide

DDR3 SDRAM Memory

4.3 204Pin DDR3 SoDIMM (1.5V Product)

204Pin DDR3 SODIMM
Org.

Density

128Mx 64

1GB

256Mx 64

2GB

512Mx 64

4GB

1Gx 64

8GB

Part Number

Speed

M471B2873FHS

CF8/H9/K0

M471B2873GB0

CF8/H9/K0/MA

M471B5673FH0

CF8/H9/K0

M471B5673GB0

CF8/H9/K0/MA

M471B5773CHS

CF8/H9/K0

M471B5773DH0

CF8/H9/K0/MA

M471B5273CH0

CF8/H9/K0

M471B5273DH0

CF8/H9/K0/MA

M471B1G73AH0

CF8/H9

M471B1G73BH0

CF8/H9/K0/MA

Raw Card
B(1Rx8)

F(2Rx8)

B(1Rx8)

F(2Rx8)

F(2Rx8)

Comp.
Version

Composition
128M x 8 * 8 pcs

1Gb

F-die

128M x 8 * 8 pcs

1Gb

G-die

128M x 8 * 16 pcs

1Gb

F-die

128M x 8 * 16 pcs

1Gb

G-die

256M x 8 * 8 pcs

2Gb

C-die

256M x 8 * 8 pcs

2Gb

D-die

256M x 8 * 16 pcs

2Gb

C-die

256M x 8 * 16 pcs

2Gb

D-die

512M x 8 * 16 pcs

4Gb

A-die

512M x 8 * 16 pcs

4Gb

B-die

Internal
Banks

Rank

PKG

Height

78 ball
FBGA

30mm

78 ball
FBGA

30mm

78 ball
FBGA

30mm

78 ball
FBGA

30mm

78 ball
FBGA

30mm

Internal
Banks

Rank

PKG

Height

78 ball
FBGA

30mm

Avail.

NOTE

Now
Now
Now
Now
Now
Now
Now
Now
Now
2Q11

4.4 204Pin DDR3 SoDIMM (1.35V Product)

204Pin DDR3 SODIMM
Org.

Density

128Mx 64

1GB

256Mx 64

512Mx 64

1Gx 64

2GB

4GB

8GB

Part Number

Speed

M471B2873FHS

YF8/H9

M471B2873GB0

YF8/H9/K0

M471B5673FH0

YF8/H9

M471B5673GB0

YF8/H9/K0

M471B5773CHS

YF8/H9

M471B5773DH0

YF8/H9/K0

M471B5273CH0

YF8/H9

M471B5273DH0

YF8/H9/K0

M471B1G73AH0

YF8/H9

M471B1G73BH0

YF8/H9/K0

Raw Card
B(1Rx8)

F(2Rx8)

B(1Rx8)

F(2Rx8)

F(2Rx8)

Composition

Comp.
Version

128M x 8 * 8 pcs

1Gb

F-die

128M x 8 * 8 pcs

1Gb

G-die

128M x 8 * 16 pcs

1Gb

F-die

128M x 8 * 16 pcs

1Gb

G-die

256M x 8 * 8 pcs

2Gb

C-die

256M x 8 * 8 pcs

2Gb

D-die

256M x 8 * 16 pcs

2Gb

C-die

256M x 8 * 16 pcs

2Gb

D-die

512M x 8 * 16 pcs

4Gb

A-die

512M x 8 * 16 pcs

4Gb

B-die

* NOTE : 1.35V product is 1.5V operatable.

-6-

Avail.
Now
Now
Now

78 ball
FBGA

30mm

78 ball
FBGA

30mm

78 ball
FBGA

30mm

Now
Now
Now
Now
Now
Now
2Q11

NOTE

Feb. 2011

Product Guide

DDR3 SDRAM Memory

4.5 240Pin DDR3 Registered DIMM (1.5V Product)

240Pin DDR3 Registered DIMM
Org.

Density

128Mx 72

1GB

256Mx 72

512Mx 72

1Gx 72

2GB

4GB

8GB

Part Number

Speed

M393B2873FH0

CF8/H9/K0

M393B2873GB0

CF8/H9/K0/MA

M393B5673FH0

CF8/H9/K0

M393B5673GB0

CF8/H9/K0/MA

M393B5670FH0

CF8/H9/K0

M393B5670GB0

CF8/H9/K0/MA

M393B5773CH0

CF8/H9/K0

M393B5773DH0

CF8/H9/K0/MA

M393B5173FH0

CF8/H9/K0

M393B5173GB0

CF8/H9

M393B5170FH0

CF8/H9/K0

M393B5170GB0

CF8/H9/K0/MA

M393B5273CH0

CF8/H9/K0

M393B5273DH0

CF8/H9/K0/MA

M393B5270CH0

CF8/H9/K0

M393B5270DH0

CF8/H9/K0/MA

M393B1K73CH0

CF8/H9

Raw Card
A(1Rx8)

B(2Rx8)

C(1Rx4)

A(1Rx8)

H(4Rx8)

E(2Rx4)

B(2Rx8)

C(1Rx4)

H(4Rx8)

1Gb

F-die

128M x 8 * 9 pcs

1Gb

G-die

128M x 8 * 18 pcs

1Gb

F-die

128M x 8 * 18 pcs

1Gb

G-die

256M x 4 * 18 pcs

1Gb

F-die

256M x 4 * 18 pcs

1Gb

G-die

256M x 8 * 9 pcs

2Gb

C-die

256M x 8 * 9 pcs

2Gb

D-die

128M x 8 * 36 pcs

1Gb

F-die

128M x 8 * 36 pcs

1Gb

G-die

256M x 4 * 36 pcs

1Gb

F-die

256M x 4 * 36 pcs

1Gb

G-die

256M x 8 * 18 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

D-die

512M x 4 * 18 pcs

2Gb

C-die

512M x 4 * 18 pcs

2Gb

D-die

256M x 8 * 36 pcs

2Gb

C-die

256M x 8 * 36 pcs

2Gb

D-die

512M x 4 * 36 pcs

2Gb

C-die

512M x 4 * 36 pcs

2Gb

D-die

Rank

PKG

Height

78 ball
FBGA

30mm

Now
Now
Now
Now

78 ball
FBGA

30mm

Now
Now
Now
Now
Now
Now
Now

78 ball
FBGA
8

Avail.

30mm

Now
Now
Now
Now
Now
Now

CF8/H9
CF8/H9/K0

M393B1K70DH0

CF8/H9/K0/MA

M393B1G73BH0

CF8/H9/K0/MA

B(2Rx8)

512M x 8 * 18 pcs

4Gb

B-die

2Q11

M393B1G70BH0

CF8/H9/K0/MA

C(1Rx4)

1G x 4 * 18 pcs

4Gb

B-die

2Q11

DDP
x 4 * 36 pcs
1G

2Gb

C-die

DDP
x 4 * 36 pcs
1G

2Gb

1G x 4 * 36 pcs

4Gb

M393B2K70DM0

4Gx 72

128M x 8 * 9 pcs

Internal
Banks

M393B1K70CH0

E(2Rx4)

CF8/H9
AB(4Rx4)

16GB

Comp.
Version

M393B1K73DH0

M393B2K70CM0

2Gx 72

Composition

CF8/H9

M393B2G70AH0

CF8/H9

M393B2G70BH0

CF8/H9

M393B2G73AH0

CF8/H9

M393B2G73BH0

CF8/H9

M393B4G70AM0

CF8/H9

32GB

E(2Rx4)

H(4Rx8)

AB(4Rx4)
M393B4G70BM0

CF8/H9

78 ball
FBGA

30mm

A-die

1G x 4 * 36 pcs

4Gb

B-die

4Gb

A-die

512M x 8 * 36 pcs

4Gb

B-die

DDP
x 4 * 36 pcs
2G

4Gb

A-die

DDP
x 4 * 36 pcs
2G

4Gb

B-die

Now
Now

Now

D-die

512M x 8 * 36 pcs

-7-

Now

Now
8

78 ball
FBGA

30mm

Now
2Q11
Now
2Q11

78 ball
FBGA

Now
30mm
2Q11

NOTE

Feb. 2011

Product Guide

DDR3 SDRAM Memory

4.6 240Pin DDR3 Registered DIMM (1.35V Product)

240Pin DDR3 Registered DIMM
Org.

Density

128Mx 72

1GB

256Mx 72

512Mx 72

1Gx 72

2GB

4GB

8GB

Raw Card

4Gx 72

PKG

Height

78 ball
FBGA

30mm

YF8/H9

M393B2873GB0

YF8/H9/K0

M393B5673FH0

YF8/H9

M393B5673GB0

YF8/H9/K0

M393B5670FH0

YF8/H9

M393B5670GB0

YF8/H9/K0

M393B5773CH0

YF8/H9

M393B5773DH0

YF8/H9/K0

M393B5173FH0

YF8/H9

M393B5173GB0

YF8/H9

M393B5170FH0

YF8/H9

M393B5170GB0

YF8/H9/K0

M393B5273CH0

YF8/H9

M393B5273DH0

YF8/H9/K0

M393B5270CH0

YF8/H9

M393B5270DH0

YF8/H9/K0

M393B1K73CH0

YF8/H9

M393B1K73DH0

YF8/H9

M393B1K70CH0

YF8/H9

M393B1K70DH0

YF8/H9/K0

M393B1G73BH0

YF8/H9/K0

B(2Rx8)

512M x 8 * 18 pcs

4Gb

B-die

2Q11

M393B1G70BH0

YF8/H9/K0

C(1Rx4)

1G x 4 * 18 pcs

4Gb

B-die

2Q11

M393B2K70CM0

YF8/H9

DDP
x 4 * 36 pcs
1G

2Gb

C-die

DDP
x 4 * 36 pcs
1G

2Gb

1G x 4 * 36 pcs

4Gb

M393B2K70DM0
16GB

Rank

M393B2873FH0

B(2Rx8)

C(1Rx4)

A(1Rx8)

H(4Rx8)

E(2Rx4)

B(2Rx8)

C(1Rx4)

H(4Rx8)

E(2Rx4)

AB(4Rx4)

2Gx 72

Internal
Banks

Speed

A(1Rx8)

YF8/H9

M393B2G70AH0

YF8/H9

M393B2G70BH0

YF8/H9/K0

M393B2G73AH0

YF8/H9

M393B2G73BH0

YF8/H9

M393B4G70AM0

YF8/H9

E(2Rx4)

H(4Rx8)
AB(4Rx4)

32GB
M393B4G70BM0

YF8/H9

AB(4Rx4)

Composition

Comp.
Version

Part Number

128M x 8 *

9 pcs

1Gb

F-die

128M x 8 *

9 pcs

1Gb

G-die

128M x 8 * 18 pcs

1Gb

F-die

128M x 8 * 18 pcs

1Gb

G-die

256M x 4 * 18 pcs

1Gb

F-die

256M x 4 * 18 pcs

1Gb

G-die

256M x 8 *

9 pcs

2Gb

C-die

256M x 8 *

9 pcs

2Gb

D-die

128M x 8 * 36 pcs

1Gb

F-die

128M x 8 * 36 pcs

1Gb

G-die

256M x 4 * 36 pcs

1Gb

F-die

256M x 4 * 36 pcs

1Gb

G-die

256M x 8 * 18 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

D-die

512M x 4 * 18 pcs

2Gb

C-die

512M x 4 * 18 pcs

2Gb

D-die

256M x 8 * 36 pcs

2Gb

C-die

256M x 8 * 36 pcs

2Gb

D-die

512M x 4 * 36 pcs

2Gb

C-die

512M x 4 * 36 pcs

2Gb

D-die

A-die

1G x 4 * 36 pcs

4Gb

B-die

4Gb

A-die

512M x 8 * 36 pcs

4Gb

B-die

DDP
x 4 * 36 pcs
2G

4Gb

A-die

DDP
x 4 * 36 pcs
2G

4Gb

-8-

78 ball
FBGA

30mm

B-die

Now
Now
Now

Now
Now

Now
Now

2
30mm

Now
Now
Now
Now

Now
Now

Now

Now

78 ball
FBGA
8

Now

Now

Now
78 ball
FBGA

30mm

Now
Now

Now

D-die

512M x 8 * 36 pcs

* NOTE : 1.35V product is 1.5V operatable.

Avail.

Now
8

78 ball
FBGA

30mm

Now
2Q11
Now
2Q11

78 ball
FBGA

Now
30mm
2Q11

NOTE

Feb. 2011

Product Guide

DDR3 SDRAM Memory

4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)

240Pin DDR3 VLP Registered DIMM
Org.

Density

128Mx 72

1GB

256Mx 72

512Mx 72

2GB

4GB

Part Number

Speed

M392B2873FH0

CF8/H9

M392B2873GB0

CF8/H9/K0/MA

M392B5673FH0

CF8/H9

M392B5673GB0

CF8/H9/K0/MA

M392B5670FH0

CF8/H9

M392B5670GB0

CF8/H9/K0/MA

M392B5773CH0

CF8/H9/K0

M392B5773DH0

CF8/H9/K0/MA

M392B5170FM0

CF8/H9

M392B5273CH0

CF8/H9/K0

M392B5273DH0

CF8/H9/K0/MA

M392B5270CH0

CF8/H9/K0

M392B5270DH0

CF8/H9/K0/MA

M392B1K73CM0

CF8/H9

Raw Card
K(1Rx8)

L(2Rx8)

M(1Rx4)

K(1Rx8)
N(2Rx4)
L(2Rx8)

M(1Rx4)

V(4Rx8)

1Gx 72

8GB

128M x 8 *

9 pcs

128M x 8 *

Comp.
Version
1Gb

F-die

9 pcs

1Gb

G-die

128M x 8 * 18 pcs

1Gb

F-die

128M x 8 * 18 pcs

1Gb

G-die

256M x 4 * 18 pcs

1Gb

F-die

256M x 4 * 18 pcs

1Gb

G-die

256M x 8 *

9 pcs

2Gb

C-die

256M x 8 *

9 pcs

2Gb

D-die

DDP
x 4 * 18 pcs
512M

1Gb

F-die

256M x 8 * 18 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

D-die

512M x 4 * 18 pcs

2Gb

C-die

512M x 4 * 18 pcs

2Gb

D-die

DDP
x 8 * 18 pcs
512M

2Gb

C-die

M392B1K73DM0

CF8/H9

DDP
x 8 * 18 pcs
512M

2Gb

D-die

M392B1K70CM0

CF8/H9/K0

DDP
x 4 * 18 pcs
1G

2Gb

C-die

DDP
x 4 * 18 pcs
1G

2Gb

D-die

N(2Rx4)

Internal
Banks

Rank

PKG

Height

78 ball
FBGA

18.75mm

CF8/H9/K0/MA

L(1Rx8)

512M x8 * 18 pcs

4Gb

B-die

M392B1G70BH0

CF8/H9/K0/MA

M(1Rx4)

1G x4 * 18 pcs

4Gb

B-die

M392B2G70AM0

CF8/H9

DDP
x4 * 18 pcs
2G

4Gb

A-die

DDP
x4 * 18 pcs
2G

4Gb

DDP
x8 * 18 pcs
1G

4Gb

DDP
x8 * 18 pcs
1G

4Gb

CF8/H9/K0/MA

M392B2G73AM0

CF8/H9
V(4Rx8)

M392B2G73BM0

CF8/H9

-9-

Now
78 ball
FBGA

18.75mm

Now
Now
Now
Now
Now

78 ball
FBGA

18.75mm

Now
Now
Now

78 ball
FBGA

18.75mm

Now
Now
2Q11
Now

B-die

78 ball
FBGA

A-die
8
B-die

Now

Now

M392B1G73BH0

M392B2G70BM0

Now

Now

CF8/H9/K0/MA

16GB

Avail.

Now

M392B1K70DM0

N(2Rx4)
2Gx 72

Composition

2Q11
18.75mm
Now

4
2Q11

NOTE

Feb. 2011

Product Guide

DDR3 SDRAM Memory

4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)

240Pin DDR3 VLP Registered DIMM
Org.

Density

128Mx 72

1GB

256Mx 72

512Mx 72

2GB

4GB

Part Number

Speed

M392B2873FH0

YF8/H9

M392B2873GB0

YF8/H9/K0

M392B5673FH0

YF8/H9

M392B5673GB0

YF8/H9/K0

M392B5670FH0

YF8/H9

M392B5670GB0

YF8/H9/K0

M392B5773CH0

YF8/H9

M392B5773DH0

YF8/H9/K0

M392B5170FM0

YF8/H9

M392B5273CH0

YF8/H9

M392B5273DH0

YF8/H9/K0

M392B5270CH0

YF8/H9

M392B5270DH0

YF8/H9/K0

M392B1K73CM0

YF8/H9

Raw Card
K(1Rx8)

L(2Rx8)

M(1Rx4)

K(1Rx8)
N(2Rx4)
L(2Rx8)

M(1Rx4)

V(4Rx8)

1Gx 72

8GB

128M x 8 * 9 pcs

Comp.
Version
1Gb

F-die

128M x 8 * 9 pcs

1Gb

G-die

128M x 8 * 18 pcs

1Gb

F-die

128M x 8 * 18 pcs

1Gb

G-die

256M x 4 * 18 pcs

1Gb

F-die

256M x 4 * 18 pcs

1Gb

G-die

512M x 4 * 9 pcs

2Gb

C-die

512M x 4 * 9 pcs

2Gb

D-die

DDP
x 4 * 18 pcs
512M

1Gb

F-die

256M x 8 * 18 pcs

2Gb

C-die

256M x 8 * 18 pcs

2Gb

D-die

512M x 4 * 18 pcs

2Gb

C-die

512M x 4 * 18 pcs

2Gb

D-die

DDP
x 8 * 18 pcs
512M

2Gb

C-die

M392B1K73DM0

YF8/H9

DDP
x 8 * 18 pcs
512M

2Gb

D-die

M392B1K70CM0

YF8/H9

DDP
x 4 * 18 pcs
1G

2Gb

C-die

DDP
x 4 * 18 pcs
1G

2Gb

D-die

N(2Rx4)

Internal
Banks

Rank

M392B1G73BH0

YF8/H9/K0

L(1Rx8)

512M x8 * 18 pcs

4Gb

B-die

M392B1G70BH0

YF8/H9/K0

M(1Rx4)

1G x4 * 18 pcs

4Gb

B-die

M392B2G70AM0

YF8/H9

DDP
x4 * 18 pcs
2G

4Gb

A-die

DDP
x4 * 18 pcs
2G

4Gb

B-die

DDP
x8 * 18 pcs
1G

4Gb

A-die

DDP
x8 * 18 pcs
1G

4Gb

M392B2G70BM0

YF8/H9/K0

M392B2G73AM0

YF8/H9
V(4Rx8)

M392B2G73BM0

YF8/H9

Height

78 ball
18.75mm
FBGA

Avail.

NOTE

Now
Now
Now
Now

78 ball
18.75mm
FBGA

Now
Now
Now
Now
Now

78 ball
18.75mm
FBGA

Now
Now
Now

Now

YF8/H9/K0

16GB

PKG

Now

M392B1K70DM0

N(2Rx4)
2Gx 72

Composition

78 ball
18.75mm
FBGA

Now
Now
2Q11
Now

78 ball
18.75mm
FBGA
8

2Q11
Now

B-die

2Q11

* NOTE : 1.35V product is 1.5V operatable.

4.9 240Pin DDR3 LRDIMM (1.35V Product)

240Pin DDR3 LDIMM
Org.

Density

Part Number

Speed

2G x 72

16GB

M386B2G70DM0

YH9/K0

Raw Card

C(4Rx4)
4G x 72

32GB

M386B4G70BM0

YH9//K0

Composition

Comp.
Version

DDP
x 4 * 36 pcs
1G

2Gb

DDP
x 4 * 36 pcs
2G

4Gb

* NOTE
1) LRDIMM Part Number includes memory buffer digit, which is 13th.
For more information, please refer to 12page.

- 10 -

D-die

Internal
Banks

Rank

8
4

B-die

PKG

Height

78 ball
18.75mm
FBGA

Avail.

NOTE

Mar11
1)
2Q11

Feb. 2011

Product Guide

DDR3 SDRAM Memory

5. RDIMM RCD Information

5.1 RCD Identification in JEDEC Description in Module Label
5.2 Label Example

4GB 2Rx8 PC3 - 12800R - 11 - 11 - B1 - P2

Made in Korea

M393B5270DH0-CK0

1102

5.3 RCD Information

- Example
JEDEC Description

PKG

RCD Vendor

RCD Version(Rev.)

1Gb F-die
2Gb C-die
4Gb A-die

IDT

HLB(B0)

D2

Inphi

GS04(1.5V)/LV-GS02(1.35V)

P1

IDT

A1(evergreen)

D3

Inphi

UV-GS02

P2

1Gb G-die
2Gb D-die
4Gb B-die

(Example - 4GB 2Rx8 PC3(L)1 - 12800R - 11 - 11 - B1 - XX)

* NOTE
1) PC3L is used for 1.35V
2)RCD information is subject to change.

- 11 -

Feb. 2011

Product Guide

DDR3 SDRAM Memory

6. LRDIMM Memory Buffer Information

6.1 Label Example

16GB 4Rx4 PC3L - 10600L - 09 - 11 - C0

Made in Korea

M386B2K70DM0-YH90 1102

6.2 Memory Buffer Information

- Example
Voltage

Vendor

Revision

Module P/N

JEDEC Description On Label

Inphi

iMB02-GS02A

M386B2K70DM0-YH901

16GB 4Rx4 PC3L-10600L-09-11-C0

IDT

MB3 B0

M386B2K70DM0-YH911

16GB 4Rx4 PC3L-10600L-09-11-C0

1.35V

* NOTE
1) The 16th digit refers memory buffer vendor and revision.
0: Inphi iMB02-GS02A
1: IDT MB3 B0
2) Memory buffer information is subject to change.

- 12 -

Feb. 2011

Product Guide

DDR3 SDRAM Memory

7. Package Dimension

7.50 0.10

0.80 x 8 = 6.40

#A1 INDEX MARK

3.20

#A1

0.50 0.05

0.80

0.80 x 12 = 9.60

4.80

A
B
C
D
E
F
G
H
J
K
L
M
N

0.80

(Datum B)

7.50 0.10

9 8 7 6 5 4 3 2 1

11.00 0.10

0.80 1.60

11.00 0.10

(Datum A)

0.10MAX

78Ball FBGA for 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8) / 2Gb D-die (x4/x8)

0.35 0.05

(0.95)

78 - 0.45 Solder ball

(Post Reflow 0.05 0.05)

MOLDING AREA

1.10 0.10

(1.90)

0.2 M A B

Top

Bottom

8.00 0.10
0.80 x 8 = 6.40
(Datum A)

0.80

1.60

0.10MAX

78Ball DDP for 2Gb C-die (x4/x8)

A
#A1 INDEX MARK

3.20

#A1
9 8 7 6 5 4 3 2 1

11.00 0.10

11.00 0.10

0.80 x 12 = 9.60

0.80

0.80

4.80

A
B
C
(Datum B)
D
E
F
G
H
J
K
L
M
N

8.00 0.10

0.35 0.05
78 - 0.45 Solder ball
(Post Reflow 0.50 0.05)

1.40 0.10

0.2 M A B

TOP VIEW

BOTTOM VIEW

- 13 -

Feb. 2011

Product Guide

DDR3 SDRAM Memory

3.20

#A1 INDEX MARK

#A1

0.80 x 12 = 9.60

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

7.50 0.10

9 8 7 6 5 4 3 2 1

0.50 0.05

0.80 1.60

11.00 0.10

(Datum A)

11.00 0.10

7.50 0.10
0.80 x 8 = 6.40

0.10MAX

78Ball DDP for 2Gb D-die (x4/x8)

0.35 0.05

(0.95)

78 - 0.45 Solder ball

(Post Reflow 0.05 0.05)

MOLDING AREA

1.10 0.10

(1.90)

0.2 M A B

Top

Bottom

78Ball DDP for 4Gb A-die (x4/x8)

A

0.10MAX

10.50 0.10
0.80 x 8 = 6.40
3.20

#A1 INDEX MARK

1.60
B

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

0.80 x 12 = 9.60

9 8 7 6 5 4 3 2 1

#A1

10.50 0.10

12.00 0.10

0.80

12.00 0.10

(Datum A)

78 - 0.45 0.05 Solder ball

(Post Reflow 0.50 0.05)

0.35 0.05
1.10 0.10

0.2 M A B

BOTTOM VIEW

TOP VIEW

- 14 -

Feb. 2011

Product Guide

DDR3 SDRAM Memory

78Ball DDP for 4Gb B-die (x4/x8)

A

0.10MAX

11.00 0.10
0.80 x 8 = 6.40
3.20

#A1 INDEX MARK

1.60
B

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

0.80 x 12 = 9.60

9 8 7 6 5 4 3 2 1

#A1

11.00 0.10

11.00 0.10

0.80

11.00 0.10

(Datum A)

78 - 0.45 0.05 Solder ball

(Post Reflow 0.50 0.05)

0.35 0.05
1.10 0.10

0.2 M A B

BOTTOM VIEW

TOP VIEW

78Ball FBGA for 4Gb A-die (x4/x8)

A

0.10MAX

10.00 0.10
0.80 x 8 = 6.40
3.20

#A1 INDEX MARK

1.60
B

4.80
0.80
0.80

(Datum B)

A
B
C
D
E
F
G
H
J
K
L
M
N

78 - 0.45 Solder ball

(Post Reflow 0.50 0.05)
0.2 M A B

0.80 x 12 = 9.60

9 8 7 6 5 4 3 2 1

#A1

10.00 0.10

12.50 0.10

0.80

12.50 0.10

(Datum A)

(0.95) MOLDING AREA

0.35 0.05
1.10 0.10

(1.90)

BOTTOM VIEW

TOP VIEW

- 15 -

Feb. 2011

Product Guide

DDR3 SDRAM Memory

78Ball FBGA for 4Gb B-die (x4/x8)

10.00 0.10

0.10MAX

0.80 x 8 = 6.40
3.20

#A1 INDEX MARK

1.60

4.80
0.80

10.00 0.10

0.80

(Datum B)

0.80 x 12 = 9.60

9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N

#A1

11.00 0.10

0.80

11.00 0.10

(Datum A)

78 - 0.45 Solder ball

(Post Reflow 0.50 0.05)
0.2 M A B

(0.95)

0.35 0.05
MOLDING AREA
1.10 0.10

(1.90)

BOTTOM VIEW

TOP VIEW

3.20

#A1 INDEX MARK

#A1

4.80
0.80
0.80

(Datum B)

(0.30)

78 - 0.48 Solder ball

(Post Reflow 0.05 0.05)
0.2 M A B

0.80 x 12 = 9.60

9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N

7.50 0.10

0.50 0.05

0.80 1.60

11.00 0.10

(Datum A)

11.00 0.10

7.50 0.10
0.80 x 8 = 6.40

0.10MAX

78Ball FBGA Flip chip for 1Gb G-die (x4/x8)

0.35 0.05
MOLDING AREA

1.10 0.10

(0.60)

Top

Bottom

- 16 -

Feb. 2011

Product Guide

DDR3 SDRAM Memory

8. Module Dimension
x64/x72 240pin DDR3 SDRAM Unbuffered DIMM

Units : Millimeters

128.95

ECC

SPD

17.30

9.50

N/A

(for x64)

2.30

(for x72)

30.00 0.15

(4X)3.00 0.1

133.35 0.15

(2)
2.50
54.675
A

47.00

Max 4.0

71.00

N/A

(for x64)

ECC

(for x72)

2.50 0.20

1.270 0.10

5.00

0.80 0.05

3.80

0.2 0.15

1.500.10

1.00

2.50

Detail A

Detail B

- 17 -

2x 2.10 0.15

Feb. 2011

Product Guide

DDR3 SDRAM Memory

x64 204pin DDR3 SDRAM Unbuffered SODIMM

Units : Millimeters
67.60

0.10 M C A B
63.60

20.00

SPD

30.00 0.15

Max 3.8

1.00 0.10
24.80

A
21.00

B
39.00

2X 1.80
0.10 M C A B
(OPTIONAL HOLES)

2X 4.00 0.10
0.10 M C A B

0.60
0.45 0.03

1.65

4.00 0.10

2.55
0.25 MAX

1.00 0.10

Detail A

Detail B

- 18 -

Feb. 2011

Product Guide

DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM Registered DIMM

Units : Millimeters
C

128.95
32.40

18.93

9.74

Max 4.0

54.675

2.30

2.50
A

1.0 max

47.00

1.27 0.10

2.50 0.20

71.00

5.00

0.80 0.05

3.80

0.2 0.15

1.00

10.9

1.500.10

Detail A

Detail B

Detail C

2x 2.10 0.15

Register

2.50

17.30

Register

30.00 0.15

18.92

0.
50

10.9

9.50

9.76

(2X)3.00

133.35 0.15

Address, Command and Control lines

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0.4

Feb. 2011

Product Guide

DDR3 SDRAM Memory

Registered DIMM Heat Spreader Design

1. FRONT PART
Outside

R0.2

4.65 0.12

2 0.1

2.6 0.2

0.4

Inside
Green Line : TIM Attatch Line

7.45

Reg. pedestal line

80.78
119.29
128.5

2. BACK PART
Outside

Inside

0.15
1.3

Green Line : TIM Attatch Line

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1.3

1
0.
R

127 0.12

25.6 0.15

31.4

23.6 0.15

11.9

29.77

25.6 0.15

0.65 0.2

130.45 0.15

9.26

1+0/ -0.3

133.15 0.2

Feb. 2011

Product Guide

DDR3 SDRAM Memory

3. CLIP PART
39.3 0.2
Upper Bending
Tilting Gap

29.77

0.1 ~ 0.3

1.
5

0.5

4. DDR3 RDIMM ASSY View

Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)

1.27

1.05

132.95 133.45

39.3 0.2

19

19 0.1

K
text mark B or K
punch press_stamp

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E (Clip open size)

Feb. 2011

Product Guide

DDR3 SDRAM Memory

x72 240pin DDR3 SDRAM VLP Registered DIMM

Units : Millimeters
133.35 0.15
128.95
C
20.92

32.40

20.93

Max 4.0
9.74

Register

18.75 0.15

9.76

54.675
A

12.60

47.00

1.0 max

71.00

1.27 0.10
SPD/TS

2.50 0.20

18.10

0.80 0.05
9.9

3.80

0.6

5.00

0.2 0.15

Detail B

Detail C

VTT

Register

Detail A

1.00

2.50

VTT

0.
50

1.500.10

VTT

VTT

SPD/TS

Address, Command and Control lines

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Feb. 2011

Product Guide

DDR3 SDRAM Memory

VLP Registered DIMM Heat Spreader Design

1. FRONT PART
Outside
130.45
67
20.82

17.9

6.4

20.82

8.69

14.3

0.4

8.69

Driver
IC(DP:0.18mm)

DRIVER IC 0.18 -0/+0.1

Inside

Driver
IC(DP:0.18mm)

2. BACK PART
Outside

Driver
IC(DP:0.18mm)

Inside

Driver
IC(DP:0.18mm)

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Feb. 2011

Product Guide

DDR3 SDRAM Memory

3. CLIP PART

35.82

9.16 0.12

7.4 0.1

9.16

9.16 0.12

7.4 0.1

Clip open size

3.2~4.5

0.1

SIDE-L

FRONT

SIDE-R

4. ASSY VIEW

7.71

Reference thickness total (Maximum) : 7.71 (With Clip thickness)

TIM Thickness 0.25

* Dimension Index
Mono

DDP
Note

Min.

Typ.

Max.

Min.

Typ.

Max.

43.9

44.4

6.7

6.8

6.9

7.2

7.3

7.4

5.8

6.3

6.7

6.8

6.9

7.2

7.3

7.4

E (Clip open size)

2.5

3.6

2.6

3.8

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