‘THE OXFORD SERIES IN ELECTRICAL AND COMPUTER ENGINEERING [AneL S. Sepa Seis Eaitor, Electrical Engineving The Science ee ane ee d Engi . eee een ae oy ecupaee mon ars and Engineering ee eceeieeece ee a ee peney eerie, : : Seuiae meena: of Microelectronic Se ecdacncas Cee Ss Mey Daag ot Ed Fabricati eae eat Comer Dig Let and State Mechine Design, 3d Ea abrication Ce aia ica ted nd Sem Ande, SE ectearcer me au Dimiutiev. Understanding Seiconducir Devices SECOND EDITION Reena pee alae eenecnaeeens Cel aimee cache Laney & termes nt Seems mene mec oe oe Jee ction Oc Fe Conmmioion tens Stephen A. Campbell Kuo, Digital Control Systems, 3rd Ed. Lancet) of Mnestta) ties te iid log Comma Sems St Ek Se Dita mete Creat Des Carer Syl en fran dnb EEL nan aa Eecronepene Pilar bopes ‘Warner and Grung, Semiconductor Device Electronics New York OxfordOxfnd University Pree Oxo New York Atboge Abelard — Bangkok Boge Bocnge Aes Caleta Cape Towa. Chena Darep Solas Deli rene Hong Kong Ital Karachy Kola Compur Madi Meitgimne "Merce Giy Mba Natt Pass St Paulo Shanghah Sigapore Tape Tatjy Teron Wow sed oat compas in Beip ean Copy © 200 by Oxford Universi Press Publi by Oxford Univers Pes, ne. 13 Aan acu New Yok New York 10016. nfo segs une ofOnford Univers Pest All ight reserved. No prof hie publication maybe repodced, red ina eal syst, o ante, 12am or by any nears elecons, mesic, prcoping. econ. robe, without Pt emai of Oxo Unive Pes Lincary of Congress Cataloging in Publication Data Campoat, ups A 15 Tf science a coginecing of mises fabcaowStephen A, Campbell — ‘cm. — (The Onesies ia lactic and computer einen) jcade ibigrpacl elec and index fewerssimas | Sonoita Desi adigstcon Tie Sess Spacer S ooesen2 £ ; Aa ad Mare “* Prinng angst 33798 6B ‘ing in the United Stas Arsen oni re pager Contents Preface — xii Part I Overview and Materials 1 Chapter 1 An Introduction to Microelectronic Fabrication 1.1 Microelectronic Technologies: A Simple Example 5S 1.2 UnitProcesses and Technologies 7 13 ARoadmapforthe Course 8 14 Summary 9 Chapter 2 Semiconductor Substrates 10 2.1 Phase Diagrams and Solid Solubility” 10 22 Ceystallography and Crystal Stoeture® 13 23 Crystal Defects 16 2.4 Caochralski Growth 24 25 Bridgman Growh ofGaas 29 26 Float Zone Growth 30 27 Wafer Preparation and Specifications 31 28 Summary and Fuure Trends 33 Problems 33 References 34 Part I Unit Process |: Hot Processing and lon Implantation 37 Chapter 3 Diffusion 39 ‘31 Fick's Diffusion Equation in One Dimension 39 3.2. Atomistic Models of Diffusion 47 Thin seion roid tack me3.3. Analytic Solutions of Fick's Law 45 ‘34 Corrections to Simple Theory 47 ‘33. Diffusion Coefiicients for Common Dopants 48 36 Analysis of Diffused Profiles 52 37 Diffusion in SiO, $9. 3.8 Diffusion Systems 60 3.9 SUPREM Simulations of Diffusion Profs 61 310 Summary 64 Problems 64 References 65 Chapter 4 Thermal Oxidation 68 "iL The Detl-Grove Model of Oxidation 68 42 The Linar and Parsboic Rae Coeficients 71 43° The nial Oxidation Regime 75 44 TheSinctueof SO. 76 43 Oniecharnseioaion "7 46 The Efe of Dopunts ring Oxidation and Poysiison Ouation 447. Oridton-Inducd Stacking Fats 86 48 Alleratve Gate Isolators? 88 43 Ouidaion Systems 50 4410 SUPREM Onidaions* 92 401 Summary 93 Problems 96 References 95 Chapter 5 lon implantation 98 ‘5.1 Ideatized fn implantation Systems 99 52 Coulomb Seattering® 104 53 Vertical Projected Range 105 5.4 Channing and Lateral Projected Range 110 55 Implantation Damage 112 5.6 Shallow Junction Formation’ 116 3.7 Buried Dielectrics” 118 ‘5.8 Ton Implancaion Systems: Problems and Concerns 120 5.9 Implanted Profiles Using SUPREM* 122 5.410 Summary 123, Problems 128, References 124 a genet Chapter 6 61 62 Rapid Thermal Processing 127 ness Gray Body Radiation, Heat Exchange, and Optical Absorption” High-Intensity Optical Sources and Chamber Design 130) ‘Temperature Measurement 133 ‘Thermoplastic Suess" 137 Rapid Thermal Activation of Impurities 138 Rapid Thermal Processing of Dielectrics 140 Silicidation and Contact Formation 141 Alternative Rapid Thermal Processing Systems 142 Summary M43 Problems 143 References 144 Unit Processes 2: Pattern Transfer Optical Lithography = 151 Lithography Overview 1ST Diffraction” 155 ‘The Modulation Transfer Function and Optical Exposures Source Systems and Spatial Coherence 159 ContacuProximity Printers 165 Projection Printers 167 ‘Advanced Mask Concepts" 172 Surface Reflections and Standing Waves 176 Alignment 178 Summary 179 Problems 180 References 180 149 Photoresists 183 Photoresist Types 183 Organic Materials and Polymers? 184 ‘Typical Reactions of DQN Positive Photoresist_ 186 Contrast Curves 187 ‘The Critical Modulation Transfer Function 190 Applying and Developing Phtoresist 191 Second-Order Exposure Effects 195 Ademcd Peed ire Ps” gs 158 128