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  • DDR3 Code Information: Component

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    rdr213rdr213
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    This document provides a code to identify DDR3 SDRAM components. The code specifies details such as memory size, DRAM density, number of internal banks, speed, packaging, and temperature specifications. It allows identification of components by their code according to factors like 512Mb, x8 interface, 8 banks, DDR3-1066 speed, and commercial temperature range.

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    kode memori sodimm ddr3 notebook

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    DDR3_code

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    This document provides a code to identify DDR3 SDRAM components. The code specifies details such as memory size, DRAM density, number of internal banks, speed, packaging, and temperature specifications. It allows identification of components by their code according to factors like 512Mb, x8 interface, 8 banks, DDR3-1066 speed, and commercial temperature range.

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    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
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    24 views3 pages

    DDR3 Code Information: Component

    Uploaded by

    rdr213rdr213
    This document provides a code to identify DDR3 SDRAM components. The code specifies details such as memory size, DRAM density, number of internal banks, speed, packaging, and temperature specifications. It allows identification of components by their code according to factors like 512Mb, x8 interface, 8 banks, DDR3-1066 speed, and commercial temperature range.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
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    of 3

    Dec.

    2012

    DDR3 Code Information


    Component

    K4BXXXXXXX - XXXXXXX
    1
    1. Memory (K) 2. DRAM : 4 3. Small Classification B : DDR3 SDRAM 4~5. Density 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 8G : 8Gb AG : 16Gb 6~7. Bit Organization 04 : x4 08 : x8 16 : x16 33 : x32 8. # of Internal Banks 3 : 4 Banks 4 : 8 Banks 5 : 16 Banks 9. Interface, VDD, VDDQ 6 : SSTL, 1.5V, 1.5V 10. Generation M : M-die A : A-die B : B-die C : C-die D : D-die E : E-die F : F-die G : G-die H : H-die

    3 4

    9 10 11 12 13 14 15 16 17 18
    11. "" 12. Package H : FBGA (Lead-Free & Halogen-Free) M : FBGA (Lead-Free & Halogen-Free, DDP) B : FBGA (Lead-Free & Halogen-Free, Flip Chip) E : FBGA (Lead-Free & Halogen-Free, QDP) O : FBGA (Lead-Free & Halogen-Free, QDP for 64GB LRDIMM) 13. Temp, Power C : Commercial Temp.(0C ~ 85C), Normal Power(1.5V) Y : Commercial Temp.(0C ~ 85C), Low VDD(1.35V) K : Commercial Temp.(0C ~ 85C), Low VDD(1.35V), RS(Reduced Standby) 14~15. Speed F7 : DDR3-800 (400Mhz@CL=6, tRCD=6, tRP=6) F8 : DDR3-1066 (533MHz@CL=7, tRCD=7, tRP=7) H9 : DDR3-1333 (667MHz@CL=9, tRCD=9, tRP=9) K0 : DDR3-1600 (800MHz@CL=11, tRCD=11, tRP=11) MA : DDR3-1866 (933MHz@CL=13, tRCD=13, tRP=13)

    K4BXXXXXXX - XXXXXXX
    1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
    16. Packing "Packing Type Reference - Common to all products, except of Mask ROM - Divided into TAPE & REEL(In Mask ROM, divided into TRAY, AMMO Packing Separately) Divide Component Packing Type TAPE & REEL Other ( Tray, Tube, Jar ) Stack Module MODULE TAPE & REEL MODULE Other Packing T 0 ( Number) S P M New Marking

    17~18. Customer "Customer List Reference"

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