USING LIQUID COOLING FOR 3D IC PROCESSORS

1. Aim This paper proposes a hybrid 3D-IC cooling scheme which combines micro-channel liquid cooling. the proposed cooling scheme provides much better cooling capability than using only Using Heat Pipes. 2. Objectives To get the aim as said above, the research provides the following objectives for a research 3D Integration Techniques (Structure of 3D Integration; Through-Silicon Vias (TSVs) in 3D Integration:) Liquid Cooling Techniques Evaluation Methordology 1. Evaluation Environments 2. Thermal Modeling 3. Temperature-Dependent Leakage Modeling 4. Reliability Modeling Evaluation Results And Analysis

WORK BREAKDOWN:
LIQUID COOLING FOR 3D IC

Related works survey

Design, Modeling of 3D Systems

Evaluation and Analysis

Summary and Conclusion

3D Integration Techniques survey

Liquid Cooling Techniques survey

Power Modeling

Performance Evaluation Modeling

Report Writing

Controller design

Microchannel design

Evaluation Temperature

Evaluation Leakage