:

,
VLSI

(off-chip interconnections)

. ,

RC interconnection delay, , cross talk,
, , .

A
2. Bakoglu H. B., Circuits, Interconnections, and Packaging for VLSI, AddisonWesley, 1990.
2. Young-Soo Shn,et al. Empirical Equations on Electrical Parameters of Coupled
Microstrip Lines for Crosstalk Estimation in Printed Circuit Board, IEEE
Transanctions on Advanced Packaging, Vol.24(4)2001.
2. Brian Young, Digital Signal Integrity:Modeling and simulation with
Interconnects and Packages, Prentice Hall Modern Semiconductor Design
Series, 2001.

..

2008



:

(off-chip interconnections)

(drivers)






,



.

1.
.:

1: chip

..

2008

( )

:

noise margin

.

.

..

2008

2. PCBs
(Printed Circuit Board)
,
lossless
transmission lines.

, ,

lumped capacitive inductive loads.
:

. ,
(LdI/dt).

2
&
:

3
, SPICE
PCB ,
..

2008

 () lumped elements.
D ( MCM-D).

:

4
,
-


fringing fields. ,
,
, ,
.

PCB, TEM-mode (Transverse ElectroMagnetic) ,
Maxwell
, ,

( 1).

..

2008

: Bakoglu H. B., Circuits, Interconnections, and Packaging for VLSI,

Addison-Wesley, 1990.
time-of-flight (ToF)

l L, C
.

,

..

2008

 lumped capacitance
mode.
PCB
(impedance) :

=r0
5

(ground plane)
.
,

PCBs ,
,

..

2008

 vias,
.
5% W/h<1.25 ,
0.1<t/W<0.8 2.5<<6

3.


(propagation delay)




.
,
.

.

crosstalk
.

. ,
CMOS off-chip ,

(P~CV2 ).


.
,
:


(switching noise)
CMOS Bipolar Ics.
, :



crosstalk
.
, 60-100
.

..

2008

4. &
wire bonds, vias
,
.

CMOS

(. )
.


:

, , ,
(1+).
.

..

2008

 ,
motherboard, , .

6



.
:

..

2008

10

Vr
Vi

5.

ToF .
,

tr < 2.5 tf
, , lumped
elements

tr > 5 tf

..

2008

11


.
10 cm, ,
1.5
nsec.
:
) .

.
)
.

.

.

6. Cm ,Cs
:

1mil=0.00245cm

..

2008

12

: !!!!!

I:
: &

: PCB
ORCAD (
PSPICE).


.
pads 150mm.
170mm X 170mm.

7
A) W=1mm

S=0.3mm
S=0.4mm
S=0.5mm
S=0.6mm
) W=2mm

S=0.4mm
S=0.6mm
) W=3mm

S=0.3mm
S=0.6mm
S=0.9mm
S=0.9mm ground plane

..

2008

13

: photoresist
:

8: ground plane
.
ground plane.

H
.

..

2008

14

pads

10
: pads
2mmX4mm .

..

2008

15

11

.

( ) laser printer
inkjet printer ( 600dpi)

.
.
PCB
.

..

2008

16

 I:
: &

:
.
.

1.
(ground plane) PCB
( ). :

.
LCR meter HP :
) (mutual inductance)
(self-inductance)
.

12

paper. (Young-Soo Shn,et al. Empirical Equations on Electrical
Parameters of Coupled Microstrip Lines for Crosstalk Estimation in Printed
Circuit Board, IEEE Transanctions on Advanced Packaging, Vol.24(4)2001).
B) , , Rp RS
Zo .
.
2. () LCR
meter :
) (self
capacitance)
) (mutual capacitance)
..

2008

17


1.
epoxy glass.
2.
. .
3. .
4.
5.
5. 1-section lumped circuit model ( 3) PSPICE,
Zo
6.
PSPICE.
.
REPORT

.

L self

Zo

Ls

L mutual
Rs

Ls

Rs

C self
Cp

C mutual
Rp

Cp

Rp

W=1
S = 0.3
S = 0.4
S = 0.5
S = 0.6
W=2
S = 0.4
S = 0.6
W=3
S = 0.3
S = 0.6
S = 0.9
S = 0.9 no
ground
r

..

2008

18

 I:
: CROSSTALK

: crosstalk
.
PSPICE.
crosstalk:

S/W

Cm/Ct . Lm/Ls
.
.

1. ( )
5Volt.
0Volt 5Volt.
rise time 10 nsec
100Hz. .
,
, :
) (near end)
(
). :
.
) probe
(far end) ..
) rise
time 10 msec 100Hz.
2.
13 .

13

..

2008

19

3.
14 .

14
4. ( )
5Volt.
0Volt 5Volt.
rise time 10 nsec
100Hz. .

( ) :

,
, :
) (near end)

Z0 100100 0
R2 R1.
:
.
) R1 crosstalk .

Young-Soo Shn,et al. Empirical Equations on
Electrical Parameters of Coupled Microstrip Lines for Crosstalk Estimation in
Printed Circuit Board, IEEE Transanctions on Advanced Packaging,
Vol.24(4)2001 crosstalk
:

..

2008

20

Vswing = 5Volt,

150 mm
.
1. crosstalk near end far
end epoxy glass
.
2. .
3. crosstalk
S/W .
4. .
5. R1 ,
crosstalk,
. .
6. 1-section lumped circuit model PSPICE,
3 crosstalk.
7. crosstalk.
REPORT

.

..

2008

21

 I:
:

:
ToF
.

:

15
lumped RC
:

t<<RC t>>RC

..

2008

22

,

:

10% 90%
:

ToF

..

2008

23



(ringing)
(overshoots).
, buffer
settling time
.

,
.

far end .

1. ( ) W=1mm
& S=0.2mm, 5Volt p-p
1MHz, 2
0 Ohm.
50. (ground plane) PCB
.

2.

3.
4.
5.
6.
7.

(near end) (
) (
).

.
HP-IB interface.

. .

.

. .
1,2,3 & 4
far end
.
( 100)

..

2008

24

.
REPORT

.

..

2008

25

 II:
&

:

.
dI/dt

buffers
.
Faraday


, emf = -(d/dt). =LI emf=-L(dI/dt), L
.
:

16: IC ( mutual
inductance signal power/ground planes)
, ECL
(Emitter Coupled Logic)

..

2008

26

 17: ECL
R1 R2
( ECL
)
.
group R2 Vx
switches over
R1 R2 .
2 off
I1 =(VDD/R1). A
2
, Lext chip V
VDD.
:

, group 2 turns on ,

R1 < 0.1 R2
10% .

..

2008

27

 II:
:
(tr)

( nsec).
.
1.
:

18

2. 10V dc
.
3.
22222.
4. R4
.
5. R4 20kHz.
6. ( )
22222
( 50 60 nsec). ,
.

..

2008

28

 II:
:
1.
R1

19
2. 1 22222
.
3. ( AC coupling) 2
.
.
4. A 180nF
R1.
5. ( AC coupling) 2
.
k
6. A
R1 100 R1 1.2
R2 ( 100).
7. ( AC coupling) 2
( 22222)
. .


.
REPORT

.
..

2008

29


ORCAD LAYOUT Plus Lite
1.
Orcad Layout-Lite edition File>New

. METRIC.TCH

..

2008

30

 Cancel.

Layout Plus-Lite Edition

..

2008

31

 layers
(. TOP, BOT, GND ..)

obstacle tool
,
.

..

2008

32

 mouse button Properties

obstacle edit. layer

,
. .. Free Track
layer TOP , Copper area
PADS TOP Layer Ground Plane Bottom Layer.

..

2008

33

 mouse End Command.

.

..

2008

34

 grid.
grid spacing : Options->System Settings

..

2008

35

grid
spacing layout.
2. (MANUAL DESIGN)
,

0.3mm 0.6mm.

( ).
.
artwork. ,
200mm 150mm.
global layer obstacle type Board
outline.

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2008

36

 grid spacing
.

..

2008

37

 board outline
, ..
( DISTANCE).

..

2008

38

To grid spacing .

. grid zoom in.
.

..

2008

39


obstacle type Free track
( 1mm) Layer.

..

2008

40

 .

PageUp/PageDown.

..

2008

41

 (. 0.3mm)

.

(0.3mm)
(1/2mm=0.5mm).

..

2008

42

 PADS
.

..

2008

43

 PADS layer Copper

area Obstacle Tool, Width
:

(Ground Plane) PADS Copper

Area Bottom Layer.
3.
Text Tool
layer .

New Text String
Layer ( TOP)

..

2008

44

4.
:

..

2008

45

5. ARTWORK
layout Options>Post Process Settings

Post process.
layers
.

layers layout
. . layer TOP
mouse Batch Enabled

..

2008

46

Output Format Print Manager.

Force Black & White.
layer

..

2008

47

 Options
Enable for Post processing.

layout laser inkjet printer

Transparent Films laser inkjet printer.

..

2008

48


:
1. PADS 2mm4mm
2. PADS 1mm
6.

(.. )

( Obstacle Tool,
, Obstacle Tool)

Edit -> Copy.

.
Home F5 Redraw
, Orcad
.
Page Up / Page Down
I / Z zoom in / zoom out

.
Text Tool
layer .

New
Text String Layer
( TOP)

7.

.


UV .

.

UV.
1) (steel)
.
.
.
2)
3) 15

4) 10

..

2008

49

5) UV 230.
6)
developer ()
.
To 0.20mm
: positive photoresist .

..

2008

50


Orcad 9.2 Lite Edition

Capture CIS project.
File>New>Project
project PCB Board Wizard

project.

.
.
,
project.
Analog, Discrete Transistor.
.

..

2008

51

 , .

..

2008

52

..

2008

53

 footprints
,
layout .
footprints .
Layout Plus Lite Edition,
. Tools Library Manager.

footprints.
PACKAGING_2004,
. , .rar
. , Library Manager
Add . Footprints
footprints .
footprints
. ,
PCB Footprint, Library
Manager. , PCB Footprint
22646 22646 (
).

..

2008

54

 , .
Layout Plus .

Layout
,
Tools Create Netlist.
, Layout
*.MNL,
project.
User properties are in millimeters.
Layout Plus.

..

2008

55

..

2008

56

 Layout, File > New.

technology template .
technology templates .TCH
standards ,
, Gerber. .TCH
Orcad Layout_Plus\Data
.
METRICH.TCH.

..

2008

57

 , .L ,
.
.MAX , project
Layout .
, layout footprints
.

..

2008

58

Layout
Move Datum (Tool>Dimension>Move Datum).
,
.
Obstacle Tool Board Outline (
Global Layer, .. 0,5 mm) 5cmx5cm.
Outline
. Board Outline .

.
Track (Tool>Track>Select tool) ,

.
(2mm).
, pads ( Obstacle,
Copper area) ,
( Text tool)
.
:

..

2008

59

:
1) Bottom Layer
, pads.
2)
. ( pad)
.

..

2008

60