SECTION - I

Q1) a) Explain generalized procedure for modeling and simulation of mechanical

systems. [8]
b) Explain the role of assembly modeling in CAE. [8]
Q2) a) Explain with suitable example, how the model geometry is used for
analysis and simulation of mechanical systems. [8]
b) Explain the role of solid modeling in simulation with suitable example.[8]
Q3) a) Differentiate between feature based modeling and constrained based solid
modeling techniques. [8]
b) What do you understand by coupled thermo mechanical stress analysis,
explain with suitable example. [8]
Q4) a) Explain typical issues in contact analysis used in FEA. [8]
b) Differentiate between static, Dynamic and fatigue analysis used in FEA.[8]
Q5) Write short notes on:
a) Optimization in FEA Software. [6]
b) Bottom up assembly modeling approaches. [6]
c) Analytical techniques for structural systems. [6]
Total No. of Questions : 10] [Total No. of Pages :2
[3965] - 523
M.E. (Mechanical) (Design Engineering)
COMPUTER AIDED ENGINEERING
(Elective - III) (502211) (2008 Course)
Time :3 Hours] [Max. Marks :100
Instructions to the candidates:
1) Answer any THREE questions from each section.
2) Answers to the two sections should be written in separate answer books.
3) Neat diagrams must be drawn wherever necessary.
4) Figures to the right indicate full marks.
P1435
P.T.O.
[3965]-523 2
SECTION - II
Q6) a) Classify 3D meshing techniques of FEA and explain any one in detail.[8]
b) Enlist different types of methods to verify FEA Results. [8]
Q7) a) Explain the quality checks used to check 2D meshing in FEA. [8]
b) Explain P and h Version of mesh refinement methods. [8]
Q8) a) Explain general procedure for Dynamic analysis. [8]
b) What are different methods of solving coupled thermo mechanical
problems. [8]
Q9) a) Write Nevier stroke equation in conservation form and explain meaning
of each term. [5]
b) Explain some modern developments in grid generations related to CFD.[6]
c) CFD as a design and Research tool. [5]
Q10)Write short notes on
a) Uniform and compressed grids used in CFD. [6]
b) Checks for Tetra 3D meshing techniques. [6]
c) Thermal analysis in CAE. [6]
EEE