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Datasheet LM324-D
Datasheet LM324-D
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PDIP14
N SUFFIX
CASE 646
14
1
Features
SOIC14
D SUFFIX
CASE 751A
14
TSSOP14
DTB SUFFIX
CASE 948G
14
PIN CONNECTIONS
Out 1
Inputs 1
3
VCC
*
1
)
*
)
5
6
)
2
*
)
*
Inputs 4
12
VEE, GND
10
Inputs 3
9
8
Out 4
13
11
Inputs 2
Out 2
14
Out 3
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
Value
VCC
VCC, VEE
32
16
VIDR
32
Vdc
VICR
0.3 to 32
Vdc
tSC
Continuous
Rating
Power Supply Voltages
Single Supply
Split Supplies
Unit
Vdc
TJ
150
RJA
118
156
190
C/W
Tstg
65 to +150
Vesd
Case 646
Case 751A
Case 948G
V
2000
200
TA
C
25 to +85
0 to +70
40 to +105
40 to +125
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Split Power Supplies.
2. For supply voltages less than 32 V, the absolute maximum input voltage is equal to the supply voltage.
3. All RJA measurements made on evaluation board with 1 oz. copper traces of minimum pad size. All device outputs were active.
4. NCV2902 is qualified for automitive use.
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2
Symbol
VIO
Min
Typ
LM324A
Max
Min
Typ
LM324
Max
Min
Typ
LM2902
Max
Min
Typ
LM2902V/NCV2902
Max
Min
Typ
Max
Unit
mV
TA = 25C
2.0
5.0
2.0
3.0
2.0
7.0
2.0
7.0
2.0
7.0
TA = Thigh (Note 5)
7.0
5.0
9.0
10
13
TA = Tlow (Note 5)
7.0
5.0
9.0
10
10
VIO/T
7.0
7.0
30
7.0
7.0
7.0
V/C
IIO
3.0
30
100
5.0
30
75
5.0
50
150
5.0
50
200
5.0
50
200
nA
Average Temperature
Coefficient of Input
Offset Current
IIO/T
10
10
300
10
10
10
pA/C
IIB
90
150
300
45
100
200
90
250
500
90
250
500
90
250
500
nA
Average Temperature
Coefficient of Input
Offset Voltage
TA = Thigh to Tlow
(Notes 5 and 7)
TA = Thigh to Tlow
(Notes 5 and 7)
Input Bias Current
TA = Thigh to Tlow
(Note 5)
Input Common Mode
Voltage Range
(Note 6)
VICR
VCC = 30 V
TA = +25C
28.3
28.3
28.3
28.3
28.3
TA = Thigh to Tlow
(Note 5)
28
28
28
28
28
VCC
VCC
VCC
VCC
VCC
Differential Input
Voltage Range
VIDR
AVOL
V
V/mV
RL = 2.0 k,
VCC = 15 V,
for Large VO Swing
50
100
25
100
25
100
25
100
25
100
TA = Thigh to Tlow
(Note 5)
25
15
15
15
15
CS
120
120
120
120
120
dB
Common Mode
Rejection,
RS 10 k
CMR
70
85
65
70
65
70
50
70
50
70
dB
Power Supply
Rejection
PSR
65
100
65
100
65
100
50
100
50
100
dB
Channel Separation
10 kHz f 20 kHz,
Input Referenced
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3
Symbol
Min
Typ
LM324A
Max
Min
Typ
LM324
Max
Min
Typ
LM2902
Max
Min
Typ
LM2902V/NCV2902
Max
Min
Typ
Max
VOH
VCC = 5.0 V, RL =
2.0 k, TA = 25C
3.3
3.5
3.3
3.5
3.3
3.5
3.3
3.5
3.3
3.5
VCC = 30 V
RL = 2.0 k
(TA = Thigh to Tlow)
(Note 8)
26
26
26
26
26
VCC = 30 V
RL = 10 k
(TA = Thigh to Tlow)
(Note 8)
27
28
27
28
27
28
27
28
27
28
5.0
20
5.0
20
5.0
20
5.0
100
5.0
100
Output Voltage
Low Limit,
VCC = 5.0 V,
RL = 10 k,
TA = Thigh to Tlow
(Note 8)
VOL
IO +
Unit
mV
mA
TA = 25C
20
40
20
40
20
40
20
40
20
40
TA = Thigh to Tlow
(Note 8)
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
10
20
TA = Thigh to Tlow
(Note 8)
5.0
8.0
5.0
8.0
5.0
8.0
5.0
8.0
5.0
8.0
(VID = 1.0 V,
VO = 200 mV,
TA = 25C)
12
50
12
50
12
50
A
40
60
40
60
40
60
40
60
40
60
mA
IO
ISC
ICC
mA
mA
VCC = 30 V
VO = 0 V, RL =
3.0
1.4
3.0
3.0
3.0
3.0
VCC = 5.0 V,
VO = 0 V, RL =
1.2
0.7
1.2
1.2
1.2
1.2
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4
Output
Bias Circuitry
Common to Four
Amplifiers
VCC
Q15
Q16
Q22
Q14
Q13
40 k
Q19
5.0 pF
Q12
Q24
25
Q23
+
Q20
Q18
Inputs
Q11
Q9
Q21
Q17
Q6
Q2
Q25
Q7
Q5
Q1
Q8
Q3
Q4
2.4 k
Q10
Q26
2.0 k
VEE/GND
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5
1.0 V/DIV
VCC = 15 Vdc
RL = 2.0 k
TA = 25C
5.0 s/DIV
VCC
1.5 V to VCC(max)
1.5 V to VEE(max)
4
VEE
Single Supply
Split Supplies
VEE/GND
Figure 3.
70
70
Phase Margin
60
50
50
40
40
30
30
Gain Margin
20
20
10
10
0
1.0
1000
10
100
LOAD CAPACITANCE (pF)
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6
0
10000
PHASE MARGIN ()
60
120
A VOL, LARGE-SIGNAL
OPEN LOOP VOLTAGE GAIN (dB)
18
16
14
12
10
Negative
8.0
Positive
6.0
4.0
2.0
0
80
60
40
20
0
-20
2.0
4.0
6.0
8.0
10
12
14
16
18
20
1.0
10
100
1.0 k
10 k
1.0 M
100 k
f, FREQUENCY (Hz)
14
550
RL = 2.0 k
VCC = 15 V
VEE = GND
Gain = -100
RI = 1.0 k
RF = 100 k
12
10
8.0
VCC = 15 V
VEE = GND
TA = 25C
100
6.0
4.0
2.0
500
Input
450
Output
400
350
300
250
VCC = 30 V
VEE = GND
TA = 25C
CL = 50 pF
200
0
1.0
10
100
1000
1.0
2.0
3.0
4.0
5.0
6.0
7.0
f, FREQUENCY (kHz)
t, TIME (s)
8.0
TA = 25C
RL = R
2.1
2.4
1.8
1.5
1.2
0.9
0.6
0.3
0
5.0
10
15
20
25
VCC, POWER SUPPLY VOLTAGE (V)
30
90
80
70
35
2.0
4.0
6.0 8.0
10
12
14 16
VCC, POWER SUPPLY VOLTAGE (V)
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7
18
20
VCC
R2
10 k
1/4
MC1403
2.5 V
1/4
Vref =
VO = 2.5 V 1 +
1/4
R1
R2
Hysteresis
VOH
a R1
1/4
eo
LM324
+
1/4
VO
Vref
Vin
LM324
-
1/4
1
CR
LM324
+
VinH =
100 k
C
C
R
1/4
LM324
+
100 k
1/4
Vref
1/4
LM324
+
Vref
Bandpass
Output
R3
Vref
R1
-
Vref =
1
V
2 CC
C1 = 10C
For:fo=1.0 kHz
For:Q= 10
For:TBP= 1
For:TN= 1
Notch Output
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R1 = QR
R1
R2 =
TBP
C1
1/4
LM324
+
Vref
1
fo =2 RC
R3 = TN R2
LM324
+
Vref
VinH
R2
VinL
R1
(VOH - VOL)
R1 + R2
R2
VOL
R1
(VOH - Vref) + Vref
R1 + R2
H=
C1
VO
R1
(VOL - Vref) + Vref
VinL =
R1 + R2
eo = C (1 + a + b) (e2 - e1)
Vin
R
R1
b R1
e2
LM324
-
R1
R2
1
CR
1
fo = 2 RC
1
V
2 CC
e1
VO
LM324
+
VO
LM324
+
VCC
Vref
R
C
R1
R2
R3
= 160 k
= 0.001 F
= 1.6 M
= 1.6 M
= 1.6 M
1
V
2 CC
Triangle Wave
Output
+
R2
300 k
R3
1/4
LM324
-
VCC
+
1/4
75 k
LM324
-
R1
100 k
Vref
C
Square
Wave
Output
R1
R1 + RC
4 CRf R1
Vin
Vref
R2 R1
R2 + R1
VO
LM324
+
R2
if R3 =
CO
1/4
Rf
f =
R3
CO = 10 C
1
Vref = 2 VCC
Given:fo=center frequency
A(fo)=gain at center frequency
Choose value fo, C
Then:
R3 =
Q
fo C
R1 =
R3
2 A(fo)
R2 =
R1 R3
4Q2 R1 - R3
Qo fo
BW
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9
< 0.1
Shipping
LM224DG
SOIC14 (PbFree)
55 Units/Rail
LM224DR2G
SOIC14 (PbFree)
Device
LM224DTBG
TSSOP14 (PbFree)
96 Units/Tube
TSSOP14 (PbFree)
LM224NG
PDIP14 (PbFree)
25 Units/Rail
LM324DG
SOIC14 (PbFree)
55 Units/Rail
LM324DR2G
SOIC14 (PbFree)
LM324DTBG
TSSOP14 (PbFree)
96 Units/Tube
LM324DTBR2G
TSSOP14 (PbFree)
25C to +85C
LM224DTBR2G
LM324NG
PDIP14 (PbFree)
25 Units/Rail
SOIC14 (PbFree)
55 Units/Rail
LM324ADR2G
SOIC14 (PbFree)
LM324ADTBG
TSSOP14 (PbFree)
96 Units/Tube
LM324ADTBR2G
TSSOP14 (PbFree)
LM324ANG
PDIP14 (PbFree)
25 Units/Rail
LM2902DG
SOIC14 (PbFree)
55 Units/Rail
LM2902DR2G
SOIC14 (PbFree)
TSSOP14 (PbFree)
96 Units/Tube
LM324ADG
LM2902DTBG
0C to +70C
40C to +105C
LM2902DTBR2G
TSSOP14 (PbFree)
LM2902NG
PDIP14 (PbFree)
25 Units/Rail
LM2902VDG
SOIC14 (PbFree)
55 Units/Rail
LM2902VDR2G
SOIC14 (PbFree)
LM2902VDTBG
TSSOP14 (PbFree)
96 Units/Tube
TSSOP14 (PbFree)
LM2902VNG
PDIP14 (PbFree)
25 Units/Rail
NCV2902DR2G*
SOIC14 (PbFree)
LM2902VDTBR2G
40C to +125C
NCV2902DTBR2G*
TSSOP14 (PbFree)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP
Capable.
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10
14
LM324AN
AWLYYWWG
14
LMx24N
AWLYYWWG
14
LM2902N
AWLYYWWG
LM2902VN
AWLYYWWG
SOIC14
D SUFFIX
CASE 751A
14
14
14
14
LMx24DG
AWLYWW
LM324ADG
AWLYWW
1
LM2902DG
AWLYWW
LM2902VDG
AWLYWW
TSSOP14
DTB SUFFIX
CASE 948G
14
14
14
14
x24
324A
2902
ALYWG
G
ALYWG
G
ALYWG
G
1
2902
V
ALYWG
G
1
x
= 2 or 3
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= PbFree Package
(Note: Microdot may be in either location)
*This marking diagram also applies to NCV2902.
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11
A
8
H
E1
1
NOTE 8
b2
TOP VIEW
END VIEW
A2
A
NOTE 3
L
SEATING
PLANE
A1
D1
e
M
eB
END VIEW
14X b
SIDE VIEW
0.010
C A
NOTE 6
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12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACKAGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
INCHES
MIN
MAX
0.210
0.015
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.735 0.775
0.005
0.300 0.325
0.240 0.280
0.100 BSC
0.430
0.115 0.150
10
MILLIMETERS
MIN
MAX
5.33
0.38
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
18.67 19.69
0.13
7.62
8.26
6.10
7.11
2.54 BSC
10.92
2.92
3.81
10
A
B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
A3
E
L
1
0.25
DETAIL A
13X
b
0.25
C A
DETAIL A
X 45 _
A1
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
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13
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
0.10 (0.004)
0.15 (0.006) T U
T U
N
2X
14
L/2
0.25 (0.010)
M
B
U
L
PIN 1
IDENT.
N
F
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
DETAIL E
K
A
V
K1
J J1
SECTION NN
W
C
0.10 (0.004)
T SEATING
PLANE
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
INCHES
MIN
MAX
MIN MAX
4.90
5.10 0.193 0.200
4.30
4.50 0.169 0.177
1.20
0.047
0.05
0.15 0.002 0.006
0.50
0.75 0.020 0.030
0.65 BSC
0.026 BSC
0.50
0.60 0.020 0.024
0.09
0.20 0.004 0.008
0.09
0.16 0.004 0.006
0.19
0.30 0.007 0.012
0.19
0.25 0.007 0.010
6.40 BSC
0.252 BSC
0_
8_
0_
8_
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
ON Semiconductor and
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limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC
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14
LM324/D