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Specification: CL 31 B 104 K B C N N N C
Specification: CL 31 B 104 K B C N N N C
Series
Size
Dielectric
Capacitance
Capacitance
tolerance
Rated Voltage
Thickness
CL
31
104
L: 3.2 0.15
mm
W:
1.6
Inner electrode
Termination
X7R
100
10 %
Ni
Cu
Sn 100%
Plating
50 V
0.85 0.15 mm
0.15 mm
(Pb Free)
Product
Special
Normal
Packaging
1.00.2Vrms
Rated Voltage
60~120 sec.
Resistance
10,000Mohm or 500Mohm
Whichever is Smaller
Appearance
Withstanding
No dielectric breakdown or
Microscope (10)
250% of the rated voltage
Voltage
mechanical breakdown
Temperature
X7R
Characterisitcs
Adhesive Strength
of Termination
terminal electrode
Bending Strength
Capacitance change :
Tan (DF)
Insulation
Test condition
110%
Capacitance
0.025 max.
Solderability
SnAg3.0Cu0.5 solder
is to be soldered newly
2455, 30.3sec.
(preheating : 80~120 for 10~30sec.)
Resistance to
Capacitance change :
Soldering heat
within 7.5%
Performance
Vibration Test
Capacitance change :
within 5%
Capacitance change :
Resistance
Tan :
IR :
Amplitude : 1.5mm
From 10 to 55 (return : 1min.)
0.05 max
500Mohm or 25Mohm
Whichever is Smaller
High Temperature
Capacitance change :
Resistance
Tan :
IR :
Test condition
0.05 max
1000Mohm or 50Mohm
Whichever is Smaller
Temperature
Capacitance change :
Cycling
within 7.5%
1000+48/-0hrs
1 cycle condition
Min. operating temperature
25
Max. operating temperature 25
5 cycle test
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5, 10sec. Max )
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.