This technical news document contains brief articles about various electronics and communications engineering topics, including phones still being vulnerable even when transmitters are off, a tiny load switch that can handle 7 amps, whether 3D printers represent the future, Samsung sending a message to Google with its Tizen smartphone, a flexible Arduino board using liquid wire for prototyping, Intel's move into wearable technology, a tool-free CAT6 jack that can be terminated in 90 seconds, and 3-V and CMOS on the same die as discussed at a German conference.
This technical news document contains brief articles about various electronics and communications engineering topics, including phones still being vulnerable even when transmitters are off, a tiny load switch that can handle 7 amps, whether 3D printers represent the future, Samsung sending a message to Google with its Tizen smartphone, a flexible Arduino board using liquid wire for prototyping, Intel's move into wearable technology, a tool-free CAT6 jack that can be terminated in 90 seconds, and 3-V and CMOS on the same die as discussed at a German conference.
This technical news document contains brief articles about various electronics and communications engineering topics, including phones still being vulnerable even when transmitters are off, a tiny load switch that can handle 7 amps, whether 3D printers represent the future, Samsung sending a message to Google with its Tizen smartphone, a flexible Arduino board using liquid wire for prototyping, Intel's move into wearable technology, a tool-free CAT6 jack that can be terminated in 90 seconds, and 3-V and CMOS on the same die as discussed at a German conference.