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Lumped Element Modeling
Lumped Element Modeling
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Outline
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Context
Inertial MEMS
Changes gap
electrical output
Image removed due to copyright restrictions.
Photograph of a circuit board.
Acceleration
Beam
Plate capacitances
Fixed plate
Anchor
Unit cell
Motio
2 Microns thick
Image by MIT OpenCourseWare.
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
RF MEMS
1 m
Silicon
0.5 m
relay
Cantilever
Pull-down
electrode
Anchor
Zavracky et al., Int. J. RF Microwave CAE, 9:338, 1999, via Rebeiz RF MEMS
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
mechanical energy
RF MEMS Switch
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Outline
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Lumped-element modeling
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Lumped elements
> Electrical capacitor
> Spring
+
V
-
I =C
dV
dt
and displacement
Relation between
pressure and volumetric
flow rate
Point Load
F
x
MR
L
FR
wmax =
1
kcantilever
> Pros
Simplified representations that carry dimensional
dependencies
> Cons
Lose information
Deflection along length of cantilever
Will not get things completely right
Capacitance due to fringing fields
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
F = kx
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Lumped
dv
d 2x
F = ma = m = m 2
dt
dt
dashpot
Due to air damping
dx
F = bv = b
dt
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
F
m
b
x
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Outline
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
through
A through variable
An across variable
across
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
across
current
through
across (V)
velocity
through (I)
OR
force
through (I)
velocity
across (V)
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
F = k xdt
force
across (V)
velocity
through (I)
F = kx
V
dV
I =C
dt
C=1
k
x= 1 F
k
dF
1
x =
k dt
I
L= 1
k
dI
V =L
dt
1
I = Vdt
L
force
through (I)
velocity
across (V)
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Which is correct?
> Both are correct
> And both are used
> Velocity
beware!
voltage
> Force
voltage
Direct analogy
This is
Always store PE in capacitors what we
Springs Capacitors
will use
Generalized variables
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Generalized variables
> Formalize terminal
relations
General
Mechanical
dq
f =
dt
dx
v=
dt
q = qo + fdt
0
x = xo + vdt
0
dp
F=
dt
dp
e=
dt
t
p = po + edt
0
p = po + Fdt
0
Pnet = e f
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Examples
> Effort-flow relations occur in MANY different energy domains
General
Electrical
Mechanical
Fluidic
Thermal
Effort (e)
Voltage, V
Force, F
Pressure, P
Temp. diff., T
Flow (f)
Current, I
Velocity, v
Heat flow
Displacement (q)
Charge, Q
Displacement, x
Volume, V
Heat, Q
Momentum (p)
Momentum, p
Pressure
Momentum,
Resistance
Resistor, R
Damper, b
Fluidic
resistance, R
Thermal
resistance, R
Capacitance
Capacitor, C
Spring, k
Fluid
capacitance, C
Heat capacity,
mcp
Inertance
Inductor, L
Mass, m
Inertance, M
Node law
KCL
Continuity of space
Mass
conservation
Heat energy
conservation
Mesh law
KVL
Pressure is
relative
Temperature is
relative
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Other conventions
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
f
+
e
-
+ e (t)
- 0
effort source
+
e
f0(t)
flow source
f,I,v
Power IN
Power OUT
f0,I0,v0
e0
V0
F0
Power IN
e
V
F
Power OUT
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
f
+
+
e
R
-
Relates e & f
Directly relates e & f
+
C
L
-
Relates e & q
Differentiates e
Integrates f
Relates f & p
Integrates e
Differentiates f
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
A resistor
A damper (dashpot)
dQ
V = RI = R
dt
R=b
dx
F = bv = b
dt
V and F
I and v
Q and x
R and b
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Generalized resistor
f = f (e)
Linear resistor
I=1 V
R
v= 1 F
b
e,V,F
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
A capacitor
A spring
Q = CV
dV
I =C
dt
1
C=
k
x= 1 F
k
dx
dF
1
= x =
k dt
dt
V and F
I and v
Q and x
R and b
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Generalized capacitance
Linear capacitor
Nonlinear capacitor
e = (q )
e,V,F
V = 1 Q = (Q)
C
(Q) = Q
C
e1,V1,F1
q1
Q1
x1
q
Q
x
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Generalized capacitance
How much?
e1
W (e1 ) = qde
*
q1
q1
e,V,F
e1
= 1 (e)de
0
e1,V1,F1
W ( q1 ) + W * ( e1 ) = e1q1
W * ( e1 ) = e1q1 W ( q1 )
q1
Q1
x1
q
Q
x
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Parallel-plate capacitor
+
V
-
V = (Q) = Q
Q1
Q1
W (Q) = (Q)dQ = Q dQ
C
W (Q) =
Q
2C
I
Q = 1 (V ) = CV
V1
V1
W * (V ) = 1 (V )dV = CVdV
2
CV
W * (V ) =
2
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
An inductor
A mass
dI
d 2Q
V =L =L 2
dt
dt
dv
d 2x
L = m F = ma = m = m 2
dt
dt
V and F
I and v
Q and x
L and m
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Generalized Inertance
W ( p1 ) = 0 fdp
f1
f,v
f1,v1
W ( f1 ) = 0 pdf
*
W ( p1 ) + W * ( f1 ) = f1 p1
p1
W * ( f1 ) = f1 p1 W ( p1 )
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Outline
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Circuits in the e
V convention
1/k
F
m
F
b
x
Spring-mass-dashpot system
+
-
+ ek - +
em
- eb + -
Equivalent circuit
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
F = ma
F kx bx = mx
b
x
.
x
+
-
1/k
+ Fk - +
Fm
- Fb + -
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Example
F
k2
k1
m1
m2
b1
k1
a
k2
x1
x2
.
x2 1/k2
a
F
+
-
m2
.
x1
c
b1
m1
1/k1
e
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
k
1
1
=
=
m
LC
m1
k
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Energy coupling
deflection?
energy
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
Conclusion
effort variable
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].
k2
k1
m1
m2
> Note:
b1
x1
x2
displacement, caused
by F
.
x2
1/k2
.
x1
m2
displacement, x2 x1
If k1 , m2 and m1
share same
displacement
+
-
b1
m1
1/k1
Cite as: Joel Voldman, course materials for 6.777J / 2.372J Design and Fabrication of Microelectromechanical Devices, Spring 2007. MIT
OpenCourseWare (http://ocw.mit.edu/), Massachusetts Institute of Technology. Downloaded on [DD Month YYYY].