This document contains an assignment for a MEMS course given to students at Dr. B.R. Ambedkar National Institute of Technology. The assignment asks students to explain why silicon is preferred for microelectronics and MEMS, discuss different actuation techniques including thermal, electrostatic, piezoelectric and magnetic actuation, explain the working principle of a piezoresistive pressure sensor, and discuss capacitive and piezoelectric sensing techniques as well as comparing piezoresistive, capacitive and electromagnetic sensing methods. It also includes a problem calculating the electrostatic force between parallel capacitor plates separated by 2 micrometers.
This document contains an assignment for a MEMS course given to students at Dr. B.R. Ambedkar National Institute of Technology. The assignment asks students to explain why silicon is preferred for microelectronics and MEMS, discuss different actuation techniques including thermal, electrostatic, piezoelectric and magnetic actuation, explain the working principle of a piezoresistive pressure sensor, and discuss capacitive and piezoelectric sensing techniques as well as comparing piezoresistive, capacitive and electromagnetic sensing methods. It also includes a problem calculating the electrostatic force between parallel capacitor plates separated by 2 micrometers.
This document contains an assignment for a MEMS course given to students at Dr. B.R. Ambedkar National Institute of Technology. The assignment asks students to explain why silicon is preferred for microelectronics and MEMS, discuss different actuation techniques including thermal, electrostatic, piezoelectric and magnetic actuation, explain the working principle of a piezoresistive pressure sensor, and discuss capacitive and piezoelectric sensing techniques as well as comparing piezoresistive, capacitive and electromagnetic sensing methods. It also includes a problem calculating the electrostatic force between parallel capacitor plates separated by 2 micrometers.
AMBEDKAR NATIONAL INSTITUTE OF TECHNOLOGY, JALANDHAR
B Tech (ECE) ECE Department MEMS (EC-478) ASSIGNMENT 2
Date: 22.01.2015
Date of submission: 29.01.2015
1. Why is Silicon preferred for the Microelectronics/Micro-sensors/MEMS.
2. Explain actuation techniques using thermal forces, electrostatic forces, piezoelectric crystals, magnetic actuation and shape memory alloy. 3. Discuss working principle of micropressure sensor based on piezoresistive sensing technique. 4. Explain: (a) Capacitive sensing technique. (b) Piezoelectric sensing technique. 5. A parallel capacitor is made of two square plates with dimensions L=W=1000m (0r 1 mm), as shown in figure 1. Determine the normal electrostatic force if gap between these two plates is d=2 m. Plates are separated by static air.
6. Discuss relative merits of piezoresistive, Capacitive and electromagnetic Sensing