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Flex Circuit Design Guide
Flex Circuit Design Guide
Flex Circuit Design Guide
www.minco.com
Flex Circuits
Thermofoil Heaters
Sensors
Instruments
Introduction
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Purpose of this Design Guide . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Benefits of Flex Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
High reliability
Superior packaging options
Design Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Flex Circuit Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Glossary
Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27-29
While using this guide, keep in mind that the design information
provided is only a suggestion. Minco takes pride in manufacturing
flex circuits considered difficult to build. In most cases, we do
build above and beyond the standard circuit specifications,
provided that the circuit design and type allow for it.
You are encouraged to contact Minco with your questions and
concerns.
Repeatable installation
Compared to discrete wiring, or ribbon cable, a flex circuit offers
a customized repeatable routing path within your assembly. This
gives you dependability where you need it. A flex circuits
longevity can reduce service calls.
Flex circuits can be shaped to fit where no other design can. They
are a hybrid of ordinary printed circuit boards and round wire,
exhibiting benefits of each. In essence, flex circuits give you unlimited freedom of packaging geometry while retaining the precision
density and repeatability of printed circuits.
Harsh environments
Standard practice for flex boards is to cover the conductors with
polyimide. This dielectric layer protects your circuits far beyond
the capability of simple soldermask. Other base and cover
materials are available for a broad range of ambient conditions.
High vibration
Under vibration and/or high acceleration, a flex circuits ductility
and low mass will reduce the impact upon itself and solder
joints. By contast, a PCBs higher vibrational mass will increase
stresses upon itself, components and solder joints.
Space and weight reduction; A single flex circuit can replace several hardboards, cables, and connectors.
Fast assembly; Flex circuits eliminate the need to color code and
wrap bundles of wire, reducing the chance of assembly rejects
and in-service failures. Total installed costs are lower, especially
with volume production.
Repeatable wire routing; Eliminate wire routing errors; reducing
test time, rework, and rejects
Robust connections; Flat foil conductors dissipate heat better, carrying more current than round wires of the same cross-sectional
area. Conductor patterns in a flex circuit maintain uniform electrical characteristics. Noise, crosstalk, and impedance can be predicted and controlled.
Rigid-flex
Before: A tangle of wires connects
four circuit boards.
Flex-coils
Custom coil winding; State of the art equipment generates a
highly repeatable component
After: The package is neat, lightweight, and less susceptible to connection
failure.
Design Options
Rigid-flex
Pins
Fine lines
Stiffeners
Connectors
Shielding
Factory forming
Coils
Surface mount
Selective bonding
Integrated solutions
Cardiac devices
As cardiac devices have grown more
sophisticated, many manufacturers have
added remote telemetry for two-way
communications. Mating coils inside and
outside the body exchange the signals.
This Minco circuit has an integral wirewound antenna coil in addition to the
etched conductors. The package is
compact, rugged, and reliable.
Clinical analyzers
Military radio
The latest generation of all-purpose
military radios have advanced features,
compact size, and nearly indestructible
construction. State-of-the-art packaging
makes it all possible. An example is this
Minco circuit, which has two 3-layer
arms mated at a single connector.
Design Guidelines
Specification documents
Consult standard specifications and design documents pertaining to your application and circuit requirements.
IPC specifications*
www.ipc.org
Military www.dscc.dla.mil/Programs/MilSpec/DocSearch.asp
MIL-P-50884 (inactive for new designs), Printed Wiring, Flexible
and Rigid-Flex for Electronic Printed Wiring
MIL-PRF-31032/3A, Printed Wiring Board, Flexible, Single and
Double Layer, With or Without Plated Holes, With or Without
Stiffeners, for Soldered Part Mounting
MIL-PRF-31032/4A, Printed Wiring Board, Rigid-Flex or Flexible,
Multilayer, with Plated Holes, with or Without Stiffeners, for
Soldered Part Mounting
IPC recommends that companies using MIL-PRF-31032 specifications for printed circuits, alternatively specify that flexible
circuits be supplied under IPC-6013 Class 3 performance
requirements. Government agencies have generally accepted
that this is a COTS (Commercial, Off-The-Shelf ) equivalent to
MIL-PRF-31032. Please see the IPC position paper which is
available for download at IPC.org or Minco.com.
If your circuit must meet performance requirements of MIL-P50884, MIL-PRF-31032 or IPC-6013, we urge you to read the
IPC-2223 design specification for flexible circuits and follow its
recommendations.
Minco documents
www.minco.com
Design Guidelines
Manufacturing a flex circuit
Building a flex circuit generally involves the same steps from circuit to circuit. However, certain circuit designs can add cost. For example, a single-layer circuit with access holes on both sides is more expensive than a single-layer circuit with access on one side, because
the double-sided access hole circuit must have its substrate drilled separately. The adjacent flow chart and the illustrations below identify some cost driven issues, such as access holes, plated throughholes, etc. The flow chart shows the manufacturing process for a
Base
Drill
Plate
Print
Etch
Material
standard double-layer circuit with a stiffener.
Copper
Polyimide
Substrate
Copper
Plated
Copper
Adhesive
Top
Cover
Drill
Bottom
Cover
Drill
Adhesive
Conductor
FR-4
Material
Access Hole
Pad
Tack
Inspect
Solder
Drill
Ship
Laminate
Blank
6
5
COST MULTIPLIER
The information for the chart (right) was taken from a sample of
circuits built with Mincos standard materials. This chart is not
intended to be used as a price guide. However, it does show
that circuit cost generally rises with layer count.
4
3
2
1
0
1-Layer
Access
1-Side
1-Layer
Access
2-Sides
2-Layer
3-Layer
4-Layer
4-Layer
Multi-Layer Multi-Layer Rigid-Flex
CIRCUIT TYPE
Design Guidelines
Circuit types
Single-layer
IPC 6013, MIL-P-50884 - Type 1
Access Hole
Cover**
Adhesive*
Polyimide Substrate
Copper Pad
Double-layer
IPC 6013, MIL-P-50884 - Type 2
Access Hole
Cover
Adhesive
Copper Pad
Cover
Copper-Plated
Through-Hole
Polyimide Substrate
Multilayer
Access Hole
Cover
Copper Pad
Polyimide Substrate
Bond Ply
Polyimide Substrate
Adhesive
Cover
Copper-Plated Through-Hole
Cover**
Adhesive*
Cover**
Copper Pad (Layer #2)
Copper Pad (Layer #1)
Design Guidelines
Circuit types
Rigid-Flex
IPC 6013, MIL-P-50884 - Type 4
Polyimide Cover
Adhesive
Polyimide Cover
Polyimide Substrate
Polyimide Substrate
Copper Pad
Copper-Plated Through-Hole
Access holes or exposed pads without covers may be on either or both sides;
vias or interconnects can be fully covered for maximum insulation.
Stiffeners, pins, connectors, components, heat sinks, and mounting brackets are optional.
We also manufacture flush rigid-flex, where the top surface of contact areas is level
with adjacent adhesive/insulation.
Minco is capable of sequentially laminating, drilling, and plating circuits, which allows
for more flexibility in designing the circuit.
Flex-Coils
Flex-Coils are flex circuits containing integral wire coils
for use as antennas or inductors. There are three basic
types of Flex-Coils:
Coil-to-Circuit
Termination
Wire Coil
Etched Conductor
Flex-Coils have the same advantages that a flex circuit does. Wiring errors are reduced
because the coil is oriented in the same spot every time, which provides repeatable signals. Flex-Coils are rugged and easy to assemble, and their design usually guarantees a reduced package size. A Flex-Coil can terminate in any manner that a flex circuit can, or to a
wire lead. Heavy wire leads are available.
See Flex-Coils Technical Specification FC01, for more information on Flex-Coil capabilities, design considerations, and the information
required for a quote or build.
Integrated solutions
Minco is a leading manufacturer of temperature sensors and
Thermofoil flexible heaters. We have the unique ability to integrate
these components and a flex circuit into a single package, drastically reducing assembly time and potential errors. Call Minco to discuss your application,
or visit www.minco.com.
Layers: 16 maximum.
Plating materials: Solder, hard gold, soft gold, tin, nickel, electroless nickel with immersion gold (ENIG), OSP
Electrical characteristics
Materials
Cover/substrate*: Polyimide film: 0.001", 0.002", 0.003", 0.005";
Photoimageable Coverlay (PIC); Epoxy glass (rigid-flex)
Conductor*:
Copper: 0.25 oz. (0.00035"; 9 micron), 0.33 oz. (0.00047"; 12
micron), 0.5 oz. (0.0007"; 18 micron), 1 oz. (0.0014"; 35 micron),
2 oz. (0.0028"; 71 micron), 3 oz. (0.0042"; 107 micron)
Cupro-nickel: 0.000625", 0.0009", 0.0013", 0.0019", 0.0023"
Nickel: 0.002", 0.005"
Adhesive*: Acrylic, flame retardant, epoxy, epoxy prepreg,
polyimide prepreg, phenolic
Stiffener: Epoxy-glass (FR-4), polyimide-glass, polyimide, copper, aluminum.
* These are the standard materials Minco uses for manufacturing flex circuits. See page 19 or contact Minco for materials not
listed or special considerations (e.g. implantable devices,
extended temperature range, etc.)
10
Quality management
Minco is certified to ISO 9001: 2000 and AS9100 (aircraft)
quality system requirements
Marking
When specifying testing, consider your needs carefully. Overspecification can greatly increase circuit cost. Minco encourages
electrical testing. It is required on all multilayer, rigid-flex, and
factory-formed circuits that are fabricated to MIL-P 50884, and
certain classes of IPC-6013.
Range of operation
IPC-6013 and
N.A.
MIL-P-50884 conformance
Complete dimensions
Dielectric withstanding
Electrical continuity
Ionic cleanliness
Insulation resistance
Thermal shock
Moisture resistance
Plating thickness
Flexibility
Microsections
11
12
Assumptions
1. The nomograph is valid only for conductors with a polyimide
cover layernot exposed conductors.
2. The conductor thickness includes copper plating. Be aware
that plating may add 0.0005" to 0.0014" of thickness.
Selectively plated circuits do not have significant plating over
conductors. The nomograph does not apply for plated metals
other than copper.
3. Derate current by 15% for conductor thicknesses greater
than 0.0042" (3 oz./sq. ft.).
4. The temperature rise curves only recognize heat generated
by the conductor itself. Heat from power dissipating components or nearby conductors on other layers is not included.
5. It is assumed that conductor coverage is relatively small; i.e.
there is enough free space between conductors for lateral
heat dissipation. Groups of closely spaced parallel conductors
on the same layer can be treated as one large conductor. Add
all the cross-sectional areas together and all the currents
together to determine the temperature rise.
6. Current ratings are for still air environments. Forced air cooling will increase the maximum allowable current. Operating
circuits in a vacuum will greatly decrease the maximum allowable current.
Contact Minco for assistance in cases where the nomograph
does not apply. Also contact us if you have difficulty designing sufficient current capacity into the space available. We can
suggest ideas to increase current capacity.
32
30
28
26
24
22
Current in Amperes
17.5
15.0
45C
12.5
30C
10.0
20C
7.5
10C
6.0
5.0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.75
0.50
0.37
0.25
0.125
0.062
0
0
0.001
0.005
0.010
0.015
0.020
0.030
0.050
0.070
Example #1
0.100
3 Oz/ft2 (0.0042")
0.150
Example #2
0.200
2 Oz/ft2 (0.0028")
0.250
0.300
0.350
0.400
Oz/ft2 (0.0007")
0 1
5 10 20 30
50 70 100
150
1 Oz/ft2 (0.0014")
Another consideration concerns rigid-flex. While Minco is capable of building a traditional rigid-flex board for you it may not
be your best choice. Multilayer or stiffened flex boards may be
able to meet your requirements for component and board
mounting at reduced cost.
Minco builds circuits up to 16 layers, but costs increase significantly above 10 layers.
Expect a trim tolerance similar to that of a steel rule die from
hole-to-border and border-to-border. Hole placement within a
cluster of holes and from cluster-to-cluster will have a 0.005"
tolerance within a single rigid area.
Minimum inside corner radius of 0.031" is standard, but smaller radii are available.
Unbonded layers can increase flexibility in multilayer flex circuits, but this option is more expensive. Specify unbonded
layers only in areas of the circuit that will bend.
Minco can provide an epoxy fillet on stiffener edges that will
bend or flex.
vs.
Bend
Desired
Circuit
14
Incorporate these features into multilayer and reduced bend ratio designs to increase reliability
1. Reduce overall thickness in the flex area
Reduce the base copper weight (and the corresponding adhesive thicknesses) or reduce the dielectric thickness.
Use adhesiveless base materials. Adhesiveless materials will
usually reduce the starting thickness of each substrate by
.001"-.002" when compared to adhesive based substrates.
Eliminate copper plating on the conductors in the flexing area
by utilizing selective (pads-only) plating or adding outer padsonly layers to the circuit.
GOOD
VS.
BAD
0.050" + t
Double-layer Multilayer
0.030" + t
Outer pad: 0.030" + t
Inner pad: 0.025" + t
0.030" + t
0.030" + t
Minor
access
hole
0.015" + t
0.015" + t
0.015" + t
Vias
Minco can provide circuits with covers that have no access holes
exposing the vias (called 'tented vias'). Minco can also provide
blind and buried vias in multilayer and rigid-flex circuits. Blind
vias connect the top or bottom conductor layer to adjoining
layers, but the via does not extend through all layers. A buried
via only connects internal layers and is not exposed in the finished
circuit. Blind and buried vias increase circuit cost, but they free up
space for additional conductors on the non-drilled layers.
Tented Via
Blind Via
Thruhole or Through-hole
Annular
Ring
Access Hole
Through-Hole
Through Hole
Outer Pad
Major
Access Hole
Inner Pad
Plated
Wiring
Hole
Minor
Access Hole
Stiffener holes
Stiffener holes should be a minimum of 0.015" in diameter larger
than the access hole. It is better if the access hole underneath
the stiffener hole is a minor access hole in order to increase the
stiffener web between holes and to prevent potential solder
wicking between the stiffener and the circuit. The customer
must allow tangency. Round stiffener holes are less expensive
than slotted stiffener holes, and as mentioned before, thinner
stiffener material (less than 0.031") is less expensive to process.
16
Minco can provide flex circuits with areas that are specifically
designed for surface mount components. Because covers are
drilled, not silk-screened, round access holes are easier to provide.
Square access holes will add to cost because the pad access area
would have to be punched out with a punch-and-die. Square
pads with round access holes are a good compromise. Below are
some ideas for configuring pads for surface mount.
Access Hole
Access Hole
Leads
Pads
Soldering tips
Since polyimide absorbs moisture, circuits must be baked (1
hour @ 250F) before soldering.
Pads located in large conductor areas, such
as ground planes, voltage planes, or heat
sinks, should be provided with relief areas,
as illustrated. This limits heat dissipation for
easier soldering.
Thermal relief
Pad fillets
Pad fIllets improve etched yield and material strength. Fillets
are appropriate when the pad diameter is greater than the connecting strand width. Acute angles at the interface between conductors and pads are to be avoided by using fillets to minimize the
concentration of stress at the interface.
Before fillets
After fillets
17
Trimming
Each trimming method has advantages and disadvantages. Routing and laser trimming provide hard tooling (punch and die) tolerances for small quantities of circuits. Laser trimming is also capable of complex cutouts not feasible with other methods. Steel rule dies
(SRD) are best for intermediate quantities and tolerances. Chemical milled dies (CMD) offer tighter tolerances than SRDs for an incremental increase in cost. Hard tooling (punch and die) is recommended for tight tolerances, complex circuits, and/or high quantity. For
more specific information on SRD, punch-and-dies and CMD, see the Glossary at the end of this guide.
Circuit
dimension
in inches
1
5
10
15
20
Hole-to-border dimensions
SRD
CMD
Punch and
die /laser
0.015
0.010
0.007
0.020
0.015
0.012
0.025
0.020
0.017
0.030
0.025
0.022
0.035
0.030
0.027
Cluster to
cluster
0.003
0.007
0.012
0.017
0.022
Solder thickness
Minco follows IPC-6013 requirements of coverage and solderability for solder coatings.
18
Plated copper
0.001"
0.002"
0.003"
0.004"
Unplated copper
0.001"
0.001"
0.002"
0.003"
Adhesive
Stiffener
Material type
Kapton* and other polyimide films
FR-4
Polyimide
Copper
Different forms of copper
Beryllium copper
Cupro-nickel (70/30 alloy)
Nickel
Silver epoxy
Modified acrylic
Modified epoxy
Phenolic Butyral
Pressure-sensitive adhesive (PSA)
Preimpregnated material: FR-4, polyimide
Copper, Aluminum, and other metals
Polyimide glass
FR-4
Sizes/thickness available
0.0005", 0.001", 0.002", 0.003", 0.005"
Variety of thicknesses between 0.003" and 0.125"
Variety of thicknesses between 0.003" and 0.125"
1/4 oz., 1/3 oz., 1 oz., 2 oz., 3 oz., 5 oz., 7oz., 10 oz.
Half-hard, rolled-annealed, electro-deposited
0.003": half-hard and quarter-hard
0.004": half-hard
0.000625", 0.0009", 0.0013", 0.0019", 0.0023"
0.002", 0.003", 0.005"
Polyimide
* Kapton is a registered trademark of DuPont for polyimide. Dielectric strength of plain Kapton film is 3500-7000 volts/mil depending
upon material thickness. Kapton/modified acrylic has a dielectric strength of 3500 volts/mil and a temperature rating of -65 to 150C,
although circuits will discolor after a long-term exposure at 150C. For special applications, Minco can use an adhesive that will withstand temperatures of 150C continuous, and 200C short-term.
Other polyimide films are available for special applications.
Material is applied as an alternative to standard copper layers.
In general, Minco recommends 0.001" of adhesive on the cover material per 1 oz. of copper (including plated copper). There may be
special circumstances where more is required. Consult Minco for details.
19
Connectors
Connectors are usually customer selected, but Minco can recommend certain types of connectors to meet specific application requirements. Connectors can be attached to flex circuits
by hand soldering, wave soldering, crimping, or simple insertion with zero insertion force (ZIF) models. Connectors can be
potted after attachment or conformally coated for protection
and insulation with epoxy, polyurethane, or RTV.
One good option for many low cost
applications is the Clincher insulation
displacement connector.
High density connectors, with 0.050" or 0.025" center-to-center
terminals, are available from Omnetics Connector Corporation in
several forms, including high temperature and MIL-spec options.
Up to 44 Beryllium Copper
pins in less than half the
space of an 0.050" connector!
Connector type
Clincher connector
Micro series pin center-to-center
Nano series pin center-to-center
Pins
Socket pins are pressed in place and then soldered. Pins can
be swaged to the circuit and soldered after the swaging procedure, or pins can be swaged to an FR-4 stiffener and then
soldered. Swaged/soldered pins are moderately priced and
have good mechanical strength.
End pins that are in line with conductors can be brazed, soldered, or crimped to conductors. Pins can be bent to form a
staggered arrangement.
Flex circuits can interface to hardboards via soldered lap
joints, lap joints applied with an anisotropic adhesive (conductive in the Z-axis only).
Pins can be inserted separately or ganged in a header. Minco
recommends using an FR-4 or polyimide stiffener in pin areas to
improve mechanical strength and simplify assembly.
Pin type
Swaged
Brazed
Centerline distance
0.100" typical, 0.085" min.
0.100" typical, 0.035" min.
Centerline distance
0.100" min.
0.050" min.
0.025" min.
Fingers
Fingers can be supported or unsupported. Supported fingers
are ideal for ZIF connectors mounted on rigid boards.
Unsupported fingers can be hot bar soldered to hard circuit
boards.
Supported fingers
Finger type
Supported
Unsupported
20
Unsupported fingers
Centerline distance
0.006" min.
0.020" min.
End pins
Lap joint
21
Population
Minco will also assemble hardware and electronic components
onto your flex and rigid-flex circuits.
Numerous connectors are available for flex termination, ranging
from crimp connectors to nano-size SMT connectors or discrete
pins.
Heat-sinks, metal stiffeners, and plastic mounting frames may
also be laminated, heat staked or glued to flex circuits.
Flex-coil designs are an example of an embedded component
supplied within flex, multilayer, and rigid-flex circuits.
22
Request a Quote
Providing information for a quote
Information required for a ballpark quote
Quantity desired
Number of layers
Supplying drawings
Quantity required
Material listing
Number of layers
Specifications
Plating requirements
Hole chart
Applicable specifications
Dimensional tolerances
Marking requirements
Testing requirements
Inductance
Resistance
Insulation resistance (IR)
Continuity
Capacitance
Sencore Ringer
Dielectric, net-to-net
Dielectric, high potential test of exterior insulation
Impedance
Note: Standard electrical testing includes continuity (5 ) and
insulation resistance (40 m @ 150 VDC).
23
Request a Quote
Artwork checklist
Minco strongly encourages customers to use the artwork
checklist provided. If you answer 'yes' to all the criteria, your artwork will probably not need adjustment.
Note: Depending on the size/complexity of the circuit, the criteria may differ.
Conductor width
Dimensions
Conductor spacing
Is artwork conductor space:
at least 0.001" over the specified minimum for all unplated
copper?
Conductor routing
24
Request a Quote
Designing CAD artworks
This section provides the information necessary for designing
CAD artworks that will meet the tolerance and quality requirements for a flex circuit. A correctly designed artwork will prevent
unnecessary and costly delays in the initial shipment.
Most CAD artwork is customer supplied. Minco can generate
CAD artworks at additional cost. To generate an artwork, Minco
needs:
CAD-generated artwork
Polygons or zero width line draws for irregular pad shapes and
shield area outlines are preferred (instead of filling in these
shapes).
Supply arcs and circles. Do not convert arcs or circles into segmented lines.
Avoid supplying only conductor outlines, as it increases set-up
cost. If you do supply conductor outlines, include supporting
CAD system layer with proper line width conductors and pads.
25
Start to finish or problem specific, design engineers are available to assist our customers. Your sales engineer will put you in
contact with the design engineer most able to help you with
your specific design.
Design services
Delivery information
When you receive your Minco quote you will see any findings
listed. Please review your Minco quote. Placement of an order
includes acceptance of all terms, conditions, exceptions and
substitutions. We are more than happy to discuss any questions
you have regarding your Minco quote.
Our sales engineer will provide estimated ship dates that will
vary due to your design, our work load, and which group builds
your parts.
26
Production models will follow our best practices and applicable lead times. Delivery times and quality are predictable for all
standard designs.
Prototype/quick turn models are generally offered on a "best
effort" basis with regard to meeting all print requirements. We
can also provide many designs completely "per print."
Quickturn offers fast proof of concept constructions that may
uncover improvements as well as road-blocks. Either way, you
will see your product more quickly with our quick-turn group
than through our production group.
Glossary
Access hole
Conductor width
Access Hole
Adhesive
Polyimide
Cover
Annular ring
The ring of exposed copper or solder that surrounds a flex circuits through-holes.
Dynamic application
The use of a flex circuit in an environment that requires flexing
in use.
Annular
Ring
Flex circuit
Flexible printed circuits made from etched foil conductor
strands. The conductor strands are laminated between insulating layers. Flex circuits can vary in complexity from the simplest
single-layer circuit to a complex multilayer.
Artwork
The original pattern of conductor strands for a flexible circuit.
Flex-Coil
Hold-down tabs
Conductor
The path that carries electrical current from one point to another. Mincos flex circuit conductors are commonly found in the
form of copper strands.
Conductor
Hold-Down
Tab
I-beam effect
Conductor spacing
The width of space between conductor strands. A certain minimum conductor spacing must exist in order to prevent conductors from shorting together.
Conductor
Spacing
Adhesive
Polyimide
27
Glossary
Impedance
Pad
Pad
Profile tolerance
Dimensional tolerancing where the part trim line is contained
within a tolerance zone consisting of the area between two parallel lines, separated by the specified tolerance. For example, a
circuit to be trimmed with a steel rule die might have a tolerance of 0.015" (A 0.030" wide profile tolerance zone). The circuit
trim line could vary anywhere inside the zone.
.030 A B
An access hole (see Access hole) that exposes only a very small
portion of a conductor pad, used on holes where a solder pad is
not needed or desired. The cover hole must still be larger than
the through-hole to allow for normal registration tolerances.
Minor
Access Hole
A
DRAWING CALLOUT
Nesting
Designing circuits so that they lay closely together on a panel
during production. This maximizes the usage of panel space,
which minimizes production cost.
.030 WIDE
TOLERANCE ZONE
EXAMPLE
Punch-and-die
Hard-tooling that is used in a punch press. A punch-and-die
consists of two precisely matched metal plates held in special
die shoes. When the punch press is activated, the plates come
together in order to punch a specific pattern into material.
28
Glossary
Rigid-Flex
Tear stops
A circuit containing both rigid and flexible areas. The rigid layers have conductors and plated through-holes connecting
them to other layers.
Selective plating
Through-holes
Holes that are drilled through the layers of a flex circuit in order
to have component access to those layers. Connection from
one layer to the next is provided by plating the through-hole
walls with a thin layer of copper.
Static application
The use of a flex circuit in an environment that requires flexing
during installation and maintenance, but not in operation.
Trim line
The area defined by a design engineer as the final cut-out area
around a flex circuit.
Trim Line
Unbonded areas
A flex circuit design technique that involves providing an insulating layer between every conductive layer of a flex circuit, but
with no adhesive bonding between the insulating layers in certain areas of the circuit. This technique improves circuit flexibility.
Stiffener
Flexible or rigid pieces of material (usually Kapton or FR-4)
added to flex circuits to reinforce them for component mounting. There are no conductors on stiffeners, as compared to rigidflex circuits.
Via
A plated through-hole with no cover access holes that provides
connection for internal layers.
Substrate
A layer of insulator bonded on one or both sides with foil.
Tangency
A condition that occurs when the edge of a stiffener or cover
access hole is flush with the edge of a through-hole.
Through-Hole
Stiffener
29
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Minneapolis, MN 55432 USA
Tel: 1.763.571.3121
Fax: 1.763.571.0927
sales@minco.com
www.minco.com
European Headquarters
Usine et Service
Commercial, Z.I.
09310 Aston, France
Tel: (33) 5 61 03 24 01
Fax: (33) 5 61 03 24 09
Flex Circuits
Thermofoil Heaters
Sensors
Instruments