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    Aluminum Oxide

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    smilt
    The document provides material property data for aluminum oxide. It lists values from Matweb.com for the material's mass density as 3960 kg/m^3, Young's modulus as 370 GPa, Poisson's ratio as 0.2, tensile strength as 300 MPa, specific heat as 850 J/(kgK), thermal conductivity as 30 W/(mK), dielectric constant as 9.9, index of refraction as 1.76, electrical conductivity as 1e-14 /ohm/cm, and melting point as 2054 C. Additional properties listed include magnetic permeability, piezoresistivity, wet etching and plasma etching methods, adhesion, and biocompatibility.

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    Aluminum Oxide

    Uploaded by

    smilt
    98 views2 pages
    The document provides material property data for aluminum oxide. It lists values from Matweb.com for the material's mass density as 3960 kg/m^3, Young's modulus as 370 GPa, Poisson's ratio as 0.2, tensile strength as 300 MPa, specific heat as 850 J/(kgK), thermal conductivity as 30 W/(mK), dielectric constant as 9.9, index of refraction as 1.76, electrical conductivity as 1e-14 /ohm/cm, and melting point as 2054 C. Additional properties listed include magnetic permeability, piezoresistivity, wet etching and plasma etching methods, adhesion, and biocompatibility.

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    The document provides material property data for aluminum oxide. It lists values from Matweb.com for the material's mass density as 3960 kg/m^3, Young's modulus as 370 GPa, Poisson's ratio as 0.2, tensile strength as 300 MPa, specific heat as 850 J/(kgK), thermal conductivity as 30 W/(mK), dielectric constant as 9.9, index of refraction as 1.76, electrical conductivity as 1e-14 /ohm/cm, and melting point as 2054 C. Additional properties listed include magnetic permeability, piezoresistivity, wet etching and plasma etching methods, adhesion, and biocompatibility.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pdf or txt
    98 views2 pages

    Aluminum Oxide

    Uploaded by

    smilt
    The document provides material property data for aluminum oxide. It lists values from Matweb.com for the material's mass density as 3960 kg/m^3, Young's modulus as 370 GPa, Poisson's ratio as 0.2, tensile strength as 300 MPa, specific heat as 850 J/(kgK), thermal conductivity as 30 W/(mK), dielectric constant as 9.9, index of refraction as 1.76, electrical conductivity as 1e-14 /ohm/cm, and melting point as 2054 C. Additional properties listed include magnetic permeability, piezoresistivity, wet etching and plasma etching methods, adhesion, and biocompatibility.

    Copyright:

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    of 2

    Aluminum Oxide

    6.777J/2.751J Material Property Database

    Material: Aluminum Oxide

    Property Value Reference Image/URL (optional)


    Mass density 3960 kg/m^3 Matweb.com http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

    Young's modulus 370 Gpa Matweb.com http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

    Poisson ratio 0.2 Matweb.com http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A


    Stiffness Constants Not found

    Tensile or fracture 300 MPa Matweb.com http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A


    strength

    Residual stress on Not found


    silicon

    http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A
    Specific heat 850 J/(kgK)
    Matweb.com
    Thermal conductivity 30 W/(mK) Matweb.com http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

    Dielectric constant 9.9 Matweb.com http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

    Index of refraction 1.76 Matweb.com http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

    Electrical conductivity 1e-14 /ohm/cm Matweb.com http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

    µ=1+4πκ
    Magnetic permeability Susceptibility E.W.Lee, http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A
    κ=-3.7e-5 m^3/ “Magnetism: an
    mol Introductory
    Survey”
    Piezoresistivity N/A
    Piezoelectricity Not found
    Ar+
    Wet etching method bombardment
    http://www.lamel.bo.cnr.it/pub/abstract/Bianconi2.html
    then H3PO4
    etch

    http://www.mit.edu/~6.777/matprops/alox.htm (1 of 2)1/29/2010 1:03:18 PM


    Aluminum Oxide

    Plasma etching Not found


    method

    Adhesion to silicon Not found


    dioxide

    http://faculty.virginia.edu/Nanoscale_Laser_Processing/Apl%20and%
    Biocompatibility Yes
    20PDFs/SrS-Te%20Frost%20Blurb%202003.htm
    Hydrophobicity Not found
    http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A
    Melting Point 2054 C
    Matweb.com
    CTE 7.4e-6 /K Matweb.com http://www.matweb.com/search/SpecificMaterial.asp?bassnum=BA1A

    http://www.mit.edu/~6.777/matprops/alox.htm (2 of 2)1/29/2010 1:03:18 PM

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