Week 4

Name

CVD

Methods

The fundamental
principle of the
process is that,
inside the reactor
between the source
glasses a chemical
reaction takes place.

Kinds

Low Pressure CVD

and Plasma
Enhanced CVD are
the 2 important
CVD technologies.

Depositions that happen for Chemical reaction

Electrode-position
Epitaxy
Thermal Oxidation
Process is known as
Basic deposition
electroplating.Elect
Epitaxy is usually
technology is known
ro-plating, a process
grown using vapor
as thermal oxidation
that uses electrical
-phase epitaxy (VPE), a
and it is simply
current to reduce
modification of
oxidation of the
dissolved metal cations
chemical vapor
substrate surface in an
so that they form a
deposition.
oxygen rich
coherent metal coating
atmosphere.
on an electrode.
There are normally
two technologies for
plating: Electroplating
and Electroless plating.

Temp.
High deposition
temperature (600 to
300)

WDWU
it

Ideal to use for a

thin film with good
step coverage.

Deposition
temperature around
300K.
The films can be made
in any thickness from
~1micrometer to
>100micrometer. The
deposition id best
controlled when used
with an external

There are several kinds of

Epitaxy, like Vapor-phase,
Liquid-phase and Solid-phase.

Low temperature
epitaxy (LTE) (350650C) with chemical
vapor deposition
(CVD) technique in
order to have faster
process with low cost.
This process can be used to
form films of silicon with
thickness of ~1micrometer to
>100 micrometer

Depositions that happen for Physical reaction

PVD
Casting
Evaporation Sputtering is a Casting is a process
where the material to
is a type of
process where
be deposited is
vaporization
atoms are
dissolved in liquid
form in a solvent, by
of a liquid
ejected from a
spraying or spinning.
that occurs
solid target
from the
material at much
surface of a
lower temp. than
liquid into a
evaporation.
gaseous phase
.

Thermal oxidation
units are typically
single chambered,
equipped with a
propane or natural gas
burner and a stack.

There are several

types of
evaporator as,
Natural circulation
evaporator, falling
film evaporator.

Ion-based sputtering,
reactive sputtering,
gas flow sputtering
etc are several types
of sputtering.

There are different

types of casting like,
metal, plaster,
concrete, or plastic
resin.

The temperature is raised to

800 to 1100 degree Celsius to
speed up the process.

Evaporation
temperature for
different materials
is different.

Sputtering deposition
temperature is much
lower temperature
than evaporation
(normally room temp)

Temperature is
50C to 150 C
for casting
deposition.

This process is basically used

to form films that are used for
electrical insulation or that are
used for other process
purposes later in a process
sequence.

PVD comprises the standard technologies

for deposition of metals. The choice of
deposition method may in many cased be
arbitrary, and may depend more on what
technology is available for the specific
material at the time.

Casting is a simple
technology which
can be used for a
variety of materials,
moistly polymer.

Week 4
electrical potential.
Rate

Figure

PECVD can deposit

1 out of 4 wafers at
a time but LPCVD
can deposit at least
25 wafers at a time
(on both sides).

Figure 4(a)

The largest electrodeposition rate is

achieved at 60 C. It
decrease when the
temp. is larger than
60 C.
Figure 4(b)

Relatively-low
deposition rate.

The maximum
repeatable growth rate
achieved is
30-32 um/h in the 200
mm.
Figure 4(c)

Figure 4(d)

Figure 4(e)

Figure 4(f)

Figure 4(g)

Table 2: Deposition process. [Most of the information has been taken from MEMsnet (https://www.memsnet.org/mems/processes/deposition.html)]
Here, CVD = Chemical Vapor Deposition, PVD = Physical Vapor Deposition, WDWU = When do we want to use, LP=Low Pressure, PE=Plasma Enhanced.