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JBean Thermionic
JBean Thermionic
JBean Thermionic
Refrigeration
Jeffrey A. Bean
EE666 Advanced Semiconductor Devices
Outline
Types of refrigeration
Application of each type in electronics
Why the fuss about cooling?
Thermionic refrigeration (TIR) in detail
Current Devices
Improvements
Possible uses
Types of Refrigeration
Compressive
Utilizes a refrigerant fluid and a compressor
Efficiency: ~30-50% of Carnot value
Thermoelectric
T
c
Tc
Thermionic
Utilizes parallel materials separated by a small
distance (either vacuum or other material)
Efficiency: ~10-30% of Carnot value
Shakouri, A. and Bowers, J. E., Heterostructure Integrated Thermionic Refrigeration, 16 th Int. Conf. on Thermoelectrics, pp. 636, 1997
Compressive Refrigeration
1) Refrigerant fluid is compressed (high
pressure temperature increases)
2) Fluid flows through an
expansion valve into low
pressure chamber (phase of
refrigerant also changes)
3) Coils absorb heat in the
device
http://www.dts-generator.com/main-e.htm
mH
Cathode
mC
Vacuum
Barrier
Anode
Thermoelectric
Pros: lightweight, small footprint
Cons: lousy efficiency, low cooling power from ambient,
cant be integrated on IC chips, power consumption
Thermionic
Pros: integration on ICs using current technology, low power
Cons: only support localized cooling, low cooling power
from ambient temperature
University of Notre Dame
Intel
mH
mC
Cathode
Anode
thermionic
emission
mC
tunneling
Anode
mH
E
Cathode
e- flow
Thermionic Refrigeration
Electron transport is ballistic
Selective emission of hot carriers from cathode
to anode yields higher efficiency than TER
Tunneling of lower energy carriers reduces efficiency
Thermionic Refrigeration
Thermionic devices are based on Richardsons
equations
describes current per unit area emitted by a metal
with work function and temperature T
J E ( , T ) A * T F1 ( )
2
J Q ( , T ) A * T 2
kT
2 F2 ( ) F1 ( )
q
4qm * k 2
A*
h3
q
C
kT
qm * k B 2T 2
ln( I )
ln
2 3
Mahan, G. D., Thermionic Refrigeration, J. Appl. Phys, Vol. 76 (7) , pp. 4362, 1994.
Anode/Cathode spacing
Uniformity of electrodes
Proximity issues
Heterostructure Refrigeration
mC
mH
Shakouri, A. and Bowers, J. E., Heterostructure Integrated Thermionic Refrigeration, 16 th Int. Conf. on Thermoelectrics, pp. 636, 1997
Mahan, G. D., J. O. Sofo, and M. Bartkowiak, Multilayer thermionic refrigerator and generator, J. Appl. Phys., Vol. 83 No. 9, pp. 4683, 1998
SiGe/Si Microcoolers
SiGe/Si Microcoolers
Further Improvement
Reduce thermal
conductivity (materials)
The current limitation in
superlattice coolers is
the contact resistance
between the metal and
cap layer
Ohmic contacts to a
thermionic emission
device (ballistic transport)
will have a non-zero
resistance due to joule
heating from the large
current densities
cm2
10-7 cm2
10-6
Ulrich, M. D., P. A. Barnes, and C. B. Vining, Effect of contact resistance in solid-state thermionic emission, J. Appl. Phys., Vol.292 No. 1, pp. 245, 2002
cm
University of Notre Dame
More Improvements
Packaging is also an important aspect of
the device optimization
Addition of a package between chip and heat
sink adds another thermal barrier
Use of Si or Cu packages aided in reducing this
thermal resistance
Light Emission
Heat flowing in the reverse direction to the thermionic
emission due to lattice heat conduction reduces the
temperature difference and destroys efficiency
Opto-thermionic refrigeration gets the thermionic carriers:
e- from n-doped and h+ from p-doped semiconductor from
each side could recombine radiatively
Interband LEC
Shakouri, A. and Bowers, J. E., Heterostructure Integrated Thermionic Refrigeration, 16th Int. Conf. on Thermoelectrics, pp. 636, 1997
Conclusions
Small area, localized cooling, can be
implemented with current IC fabrication
techniques
With optimization, current devices could
provide:
Cooling of 20-30C for ~50x50 m2 areas
Several thousands of W/cm2 cooling power
density