Intel® Desktop Board DQ965GF: Technical Product Specification

Intel Desktop Board
DQ965GF
Technical Product Specification
September 2006
Order Number: D56021-001US
The Intel Desktop Board DQ965GF may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DQ965GF Specification Update.
Revision History
Revision
-001
Revision History
First release of the
Specification.
Intel
Date
Desktop Board DQ965GF Technical Product
September 2006
This product specification applies to only the standard Intel Desktop Board DQ965GF with
BIOS identifier CO96510J.86A.
Changes to this specification will be published in the Intel Desktop Board DQ965GF Specification
Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE,

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Designers must not rely on the absence or characteristics of any features or instructions marked reserved
or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
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Copyright 2006, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board DQ965GF. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DQ965GF and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains

Chapter
Description
A description of the hardware used on the board
A map of the resources of the board
The features supported by the BIOS Setup program
A description of the BIOS error messages, beep codes, and POST codes
Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings

NOTE
Notes call attention to important information.
INTEGRATORS NOTES
Integrators notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DQ965GF Technical Product Specification
Other Common Notation
iv
Used after a signal name to identify an active-low signal (such as USBP0#).
GB
Gigabyte (1,073,741,824 bytes)
GB/sec
Gigabytes per second
Gbit
Gigabit (1, 073,741,824 bits)
KB
Kilobyte (1024 bytes)
Kbit
Kilobit (1024 bits)
kbits/sec
1000 bits per second
MB
Megabyte (1,048,576 bytes)
MB/sec
Megabytes per second
Mbit
Megabit (1,048,576 bits)
Mbit/sec
Megabits per second
xxh
An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V
Volts. Voltages are DC unless otherwise specified.
This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
Contents
1 Product Description
1.1 Overview........................................................................................ 12
1.1.1 Feature Summary ................................................................ 12
1.1.2 Manufacturing Options .......................................................... 13
1.1.3 Board Layout ....................................................................... 14
1.1.4 Block Diagram ..................................................................... 16
1.2 Online Support................................................................................ 17
1.3 Processor ....................................................................................... 17
1.4 System Memory .............................................................................. 18
1.4.1 Memory Configurations ......................................................... 20
1.5 Intel Virtualization Technology (Intel VT) ........................................ 26
1.6 Intel vPro Technology Support ...................................................... 27
1.7 Intel Q965 Express Chipset ............................................................. 28
1.7.1 Intel Q965 Graphics Subsystem.............................................. 28
1.7.2 USB ................................................................................... 30
1.7.3 Serial ATA Interfaces ............................................................ 31
1.7.4 Parallel IDE Interface ............................................................ 32
1.7.5 Real-Time Clock, CMOS SRAM, and Battery .............................. 32
1.8 Legacy I/O Controller ....................................................................... 33
1.8.1 Serial Port Interface.............................................................. 33
1.8.2 Parallel Port Interface ........................................................... 33
1.8.3 Diskette Drive Interface ........................................................ 33
1.8.4 PS/2 Keyboard and Mouse Interface (Optional) ......................... 33
1.9 Audio Subsystem............................................................................. 34
1.9.1 Audio Subsystem Software .................................................... 34
1.9.2 Audio Connectors and Headers ............................................... 35
1.10 LAN Subsystem ............................................................................... 36
1.10.1 Intel 82566DM Gigabit Ethernet Controller ............................. 36
1.10.2 LAN Subsystem Software....................................................... 36
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 37
1.10.4 Intel Active Management Technology (Intel AMT) with
System Defense Feature........................................................ 37
1.10.5 Alert Standard Format (ASF) 2.0 Support................................. 38
1.11 Hardware Management Subsystem .................................................... 39
1.11.1 Hardware Monitoring and Fan Control...................................... 39
1.11.2 Fan Monitoring ..................................................................... 39
1.11.3 Chassis Intrusion and Detection.............................................. 39
1.11.4 Thermal Monitoring .............................................................. 40
1.12 Power Management ......................................................................... 41
1.12.1 ACPI .................................................................................. 41
1.12.2 Hardware Support ................................................................ 43
1.13 Trusted Platform Module (TPM).......................................................... 48
2 Technical Reference
2.1 Memory Map................................................................................... 49
2.1.1 Addressable Memory............................................................. 49
2.2 DMA Channels................................................................................. 51
2.3 Fixed I/O Map ................................................................................. 52
2.4 PCI Configuration Space Map ............................................................ 53
2.5 Interrupts ...................................................................................... 54
2.6 PCI Interrupt Routing Map ................................................................ 55
2.7 Connectors and Headers................................................................... 56
2.7.1 Back Panel Connectors .......................................................... 57
2.7.2 Component-side Connectors and Headers ................................ 58
2.8 Jumper Block .................................................................................. 67
2.9 Mechanical Considerations ................................................................ 68
2.9.1 Form Factor......................................................................... 68
2.9.2 I/O Shield ........................................................................... 69
2.10 Electrical Considerations ................................................................... 73
2.10.1 DC Loading.......................................................................... 73
2.10.2 Fan Header Current Capability................................................ 73
2.10.3 Add-in Board Considerations .................................................. 74
2.10.4 Power Supply Considerations ................................................. 74
2.11 Thermal Considerations .................................................................... 75
2.12 Reliability ....................................................................................... 77
2.13 Environmental ................................................................................ 78
3 Overview of BIOS Features

3.1 Introduction ...................................................................................
3.2 BIOS Flash Memory Organization .......................................................
3.3 Resource Configuration ....................................................................
3.3.1 PCI Autoconfiguration ...........................................................
3.3.2 PCI IDE Support...................................................................
3.4 System Management BIOS (SMBIOS).................................................
3.5 Legacy USB Support ........................................................................
3.6 BIOS Updates .................................................................................
3.6.1 Language Support ................................................................
3.6.2 Custom Splash Screen ..........................................................
3.7 BIOS Recovery................................................................................
3.8 Boot Options...................................................................................
3.8.1 CD-ROM Boot ......................................................................
3.8.2 Network Boot.......................................................................
3.8.3 Booting Without Attached Devices...........................................
3.8.4 Changing the Default Boot Device During POST ........................
3.9 Adjusting Boot Speed.......................................................................
3.9.1 Peripheral Selection and Configuration.....................................
3.9.2 BIOS Boot Optimizations .......................................................
3.10 BIOS Security Features ....................................................................
vi
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80
81
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82
82
83
83
83
84
84
84
84
84
85
85
85
86
Contents
4 Error Messages and Beep Codes

4.1
4.2
4.3
4.4
Speaker ......................................................................................... 87
BIOS Beep Codes ............................................................................ 87
BIOS Error Messages ....................................................................... 87
Port 80h POST Codes ....................................................................... 88
5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance..................................................................... 93
5.1.1 Safety Regulations................................................................ 93
5.1.2 European Union Declaration of Conformity Statement ................ 94
5.1.3 Product Ecology Statements................................................... 96
5.1.4 EMC Regulations .................................................................. 99
5.1.5 Product Certification Markings (Board Level)............................100
5.2 Battery Disposal Information............................................................101
Figures
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
Major Board Components..................................................................

Block Diagram ................................................................................
Memory Channel Configuration and DIMM Configuration........................
Dual Channel (Interleaved) Mode Configuration with Two DIMMs............
Dual Channel (Interleaved) Mode Configuration with Three DIMMs .........
Dual Channel (Interleaved) Mode Configuration with Four DIMMs ...........
Single Channel (Asymmetric) Mode Configuration with One DIMM ..........
Single Channel (Asymmetric) Mode Configuration with Three DIMMs.......
Flex Mode Configuration with Two DIMMs............................................
Front/Back Panel Audio Connector Options ..........................................
LAN Connector LED Locations ............................................................
Thermal Sensors and Fan Headers .....................................................
Location of the Onboard Power Indicator LEDs .....................................
Detailed System Memory Address Map ...............................................
Back Panel Connectors .....................................................................
Component-side Connectors and Headers ...........................................
Connection Diagram for Front Panel Header ........................................
Connection Diagram for Front Panel USB Headers ................................
Connection Diagram for IEEE-1394a Header ........................................
Location of the Jumper Block.............................................................
Board Dimensions ...........................................................................
I/O Shield Dimensions for Boards with IEEE-1394a and
PS/2 Connectors .............................................................................
23. I/O Shield Dimensions for Boards without PS/2 Connectors ...................
24. I/O Shield Dimensions for Boards without IEEE-1394a and
PS/2 Connectors .............................................................................
25. Localized High Temperature Zones.....................................................
14
16
21
22
22
23
24
24
25
35
37
40
47
50
57
58
64
66
66
67
68
70
71
72
76
vii
Tables
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
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16.
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41.
42.
43.
44.
45.
46.
viii
Feature Summary............................................................................ 12
Manufacturing Options ..................................................................... 13
Board Components Shown in Figure 1 ................................................ 15
Supported Memory Configurations ..................................................... 18
Memory Operating Frequencies ......................................................... 19
Audio Jack Retasking Support ........................................................... 34
LAN Connector LED States ................................................................ 37
Effects of Pressing the Power Switch .................................................. 41
Power States and Targeted System Power........................................... 42
Wake-up Devices and Events ............................................................ 43
System Memory Map ....................................................................... 51
DMA Channels................................................................................. 51
I/O Map ......................................................................................... 52
PCI Configuration Space Map ............................................................ 53
Interrupts ...................................................................................... 54
PCI Interrupt Routing Map ................................................................ 55
Component-side Connectors and Headers Shown in Figure 16................ 59
High Definition Audio Link Header ...................................................... 60
Serial ATA Connectors ...................................................................... 60
Chassis Intrusion Header .................................................................. 60
Serial Port Header ........................................................................... 60
Front and Rear Chassis Fan Headers .................................................. 60
Processor Fan Header ...................................................................... 61
Front Panel Audio Header ................................................................. 61
Processor Core Power Connector........................................................ 63
Main Power Connector...................................................................... 63
Front Panel Header .......................................................................... 64
States for a One-Color Power LED ...................................................... 65
States for a Two-Color Power LED...................................................... 65
Auxiliary Front Panel Power LED Header.............................................. 65
BIOS Setup Configuration Jumper Settings.......................................... 67
Compatible I/O shields ..................................................................... 69
DC Loading Characteristics ............................................................... 73
Fan Header Current Capability........................................................... 73
Thermal Considerations for Components ............................................. 77
Desktop Board DQ965GF Environmental Specifications.......................... 78
BIOS Setup Program Menu Bar.......................................................... 80
BIOS Setup Program Function Keys.................................................... 80
Acceptable Drives/Media Types for BIOS Recovery ............................... 83
Boot Device Menu Options ................................................................ 84
Supervisor and User Password Functions............................................. 86
Beep Codes .................................................................................... 87
Port 80h POST Code Ranges.............................................................. 88
Port 80h POST Codes ....................................................................... 89
Typical Port 80h POST Sequence........................................................ 92
Contents
47.
48.
49.
50.
Safety Regulations........................................................................... 93
Lead-Free Board Markings ................................................................ 98
EMC Regulations ............................................................................. 99
Product Certification Markings ..........................................................100
ix
Product Description
What This Chapter Contains

1.1 Overview........................................................................................ 12
1.2 Online Support................................................................................ 17
1.3 Processor ....................................................................................... 17
1.4 System Memory .............................................................................. 18
1.5 Intel Virtualization Technology (Intel VT)........................................ 26
1.6 Intel vPro Technology Support...................................................... 27
1.7 Intel Q965 Express Chipset............................................................. 28
1.8 Legacy I/O Controller ....................................................................... 33
1.9 Audio Subsystem............................................................................. 34
1.10 LAN Subsystem ............................................................................... 36
1.11 Hardware Management Subsystem .................................................... 39
1.12 Power Management ......................................................................... 41
1.13 Trusted Platform Module (TPM).......................................................... 48
11
1.1
Overview
1.1.1
Feature Summary
Table 1 summarizes the major features of the Desktop Board DQ965GF.

Table 1. Feature Summary
Form Factor
microATX Form Factor (9.60 inches by 9.60 inches [243.84 millimeters by 243.84
millimeters])
Processor
Support for the following:

Intel Core2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
Intel Pentium D processor in an LGA775 socket with an 800 or 533 MHz
system bus
Intel Pentium 4 processor in an LGA775 socket with an 800 or 533 MHz
system bus
Intel Celeron D processor in an LGA775 socket with a 533 MHz system bus
Memory
Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
Support for DDR2 800, DDR2 667, or DDR2 533 MHz DIMMs
Support for up to 8 GB of system memory using DDR2 667 or DDR2 533
DIMMs
Support for up to 4 GB of system memory using DDR2 800 DIMMs
Chipset
Intel Q965 Express Chipset, consisting of:

Intel 82Q965 Graphics Memory Controller Hub (GMCH)
Intel 82801HO I/O Controller Hub (ICH8DO)
Video
Intel GMA 3000 onboard graphics subsystem
Audio
6-channel (5.1) audio subsystem using the SigmaTel* STAC9227 audio codec
Legacy I/O Control
Legacy I/O controller for diskette drive, serial, parallel, and optional PS/2* ports
USB
Support for USB 2.0 devices
Peripheral
Interfaces
10 USB ports
One serial port
One parallel port
Six Serial ATA interfaces
One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support
One diskette drive interface
LAN Support
Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82566DM

Gigabit Ethernet Controller
BIOS
Intel BIOS (resident in the SPI Flash device)

Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Trusted Platform
Module (TPM),
revision 1.2
A component that enhances platform security
continued
12
Product Description
Table 1. Feature Summary (continued)

Instantly Available
PC Technology
Support for PCI Local Bus Specification Revision 2.3

Support for PCI Express* Revision 1.0a
Suspend to RAM support
Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
Expansion
Capabilities
Two PCI Conventional* bus connectors
Hardware Monitor
Subsystem
Intel Quiet System Technology implemented through the ICH8

Manageability Engine
One PCI Express x1 bus add-in card connector

One PCI Express x16 bus add-in card connector
Voltage sense to detect out of range power supply voltages

Thermal sense to detect out of range thermal values
Three fan headers
Three fan sense inputs used to monitor fan activity
Intel vPro
Technology
support
1.1.2
Provides remote management, improved security, and energy-efficient

performance
Manufacturing Options
Table 2 describes the manufacturing options. Not every manufacturing option is

available in all marketing channels. Please contact your Intel representative to
determine which manufacturing options are available to you.
Table 2. Manufacturing Options
IEEE-1394a
interfaces
Two IEEE-1394a interfaces: one back panel connector and one front-panel header
PS/2 ports
Back panel PS/2 ports for mouse and keyboard connection
For information about
Refer to
Available configurations for the Desktop Board DQ965GF
Section 1.2, page 17
13
1.1.3
Board Layout
Figure 1 shows the location of the major components.

A
B C
D E
G
H
DD
CC
I
BB
J
K
AA
Z
Y
L
M
N
W V U TS R
O
OM18440
Figure 1. Major Board Components

Table 3 lists the components identified in Figure 1.
14
Product Description
Table 3. Board Components Shown in Figure 1

Item/callout
from Figure 1
A
Description
IEEE-1394a front panel header (optional)
Front panel audio header
PCI Conventional bus add-in card connector 1
PCI Express x1 connector
Back panel connectors
Processor core power connector
Rear chassis fan header
LGA775 processor socket
Intel 82Q965 GMCH
Processor fan header
DIMM Channel A sockets
Serial port header
DIMM Channel B sockets
Diskette drive connector
Main Power connector
Battery
Front chassis fan header
Chassis intrusion header
Intel 82801HO I/O Controller Hub (ICH8DO)
BIOS Setup configuration jumper block
Auxiliary front panel power LED header
Front panel header
Serial ATA connectors [6]
Front panel USB header
Speaker
AA
BB
Parallel ATE IDE connector
CC
DD
High Definition Audio header
15
1.1.4
Block Diagram
Figure 2 is a block diagram of the major functional areas.

Gigabit Ethernet
Controller
PCI Express x1 Interface

PCI Express x1 Slot 1
Back Panel/Front
Panel
USB Ports
USB
Parallel ATA
IDE
Connector
Parallel ATA
IDE
Controller
Parallel Port
PS/2 Mouse*
PS/2 Keyboard*
LPC
Bus
Intel Q965 Express Chipset
Intel 82Q965
Graphics and
Memory
Controller Hub
(GMCH)
PCI Express
x16 Interface
Display
Interface
DMI Interconnect
PCI Express
x16
Connector
Serial Port
Legacy
I/O
Controller
System Bus
(1066/800/533
MHz)
LGA775
Processor
Socket
Diskette Drive
Connector
Serial
Peripheral
Interface (SPI)
Flash Device
Intel 82801HO
I/O Controller Hub
(ICH8DO)
VGA
Port
LPC Bus
Dual-Channel
Memory Bus
SMBus
Channel B
DIMMs (2)
IEEE-1394a
Connector/Header*
IEEE-1394a
Controller*
PCI Bus
PCI
Bus
High Definition Audio Link
Channel A
DIMMs (2)
LAN
Connector
Serial ATA
IDE Interface
TPM
Component
Serial ATA IDE

Connectors (6)
Mic In
Audio
Codec
Line Out
Line In/Retasking Jack
Line Out/Retasking Jack
Mic In/Retasking Jack
PCI Slot 1
PCI Slot 2
SMBus
* = Optional
High Definition
Audio Link
Header
OM18449
Figure 2. Block Diagram
16
Product Description
1.2
Online Support
To find information about
Visit this World Wide Web site:
Intel Desktop Board DQ965GF under
http://www.intel.com/design/motherbd
Desktop Board Products or Desktop

Board Support
http://support.intel.com/support/motherboards/desktop
Available configurations for the

Desktop Board DQ965GF
http://developer.intel.com/design/motherbd/gf/gf_available.htm
Processor data sheets
http://www.intel.com/products/index.htm
ICH8DO addressing
http://developer.intel.com/design/chipsets/datashts
Audio software and utilities
LAN software and drivers
Supported video modes
http://www.intel.com/design/motherbd/gf/gf_documentation.htm
1.3
Processor
The board is designed to support the following processors:
Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz
system bus
Intel Pentium 4 processor in an LGA775 processor socket with an 800 or 533 MHz
system bus
Intel Celeron D processor in an LGA775 processor socket with a 533 MHz
system bus
See the Intel web site listed below for the most up-to-date list of supported
processors.
Refer to:
Supported processors
http://www.intel.com/design/motherbd/gf/gf_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can
damage the board, the processor, and the power supply.
INTEGRATORS NOTE
Use only ATX12V-compliant power supplies.
Refer to
Power supply connectors
Section 2.7.2.2, page 63
17
1.4
System Memory
The board has four DIMM sockets and supports the following memory features:
1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts

Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
8 GB maximum total system memory using DDR2 667 or DDR2 533 DIMMs;
4 GB maximum total system memory using DDR2 800 DIMMs. Refer to
Section 2.1.1 on page 49 for information on the total amount of addressable
memory.
Minimum total system memory: 512 MB
Non-ECC DIMMs
Serial Presence Detect
DDR2 800, DDR2 667, or DDR2 533 MHz SDRAM DIMMs
DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
A minimum of 512 MB of system memory is required to fully enable both the onboard
graphics and the manageability engine.
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This enables the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
18
Largest usable
DIMM (one x8
Double-sided
DIMM)
Maximum capacity
with four identical
x8 Double-sided
DIMMs
DIMM
Type
SDRAM
Technology
Smallest usable
DIMM (one x16
Single-sided
DIMM)
DDR2 533
256 Mbit
128 MB
512 MB
2 GB
DDR2 533
512 Mbit
256 MB
1 GB
4 GB
DDR2 533
1 Gbit
512 MB
2 GB
8 GB
DDR2 667
256 Mbit
128 MB
512 MB
2 GB
DDR2 667
512 Mbit
256 MB
1 GB
4 GB
DDR2 667
1 Gbit
512 MB
2 GB
8 GB
DDR2 800
256 Mbit
128 MB
512 MB
2 GB
DDR2 800
512 Mbit
256 MB
1 GB
4 GB
Product Description
NOTE
Regardless of the DIMM type used, the memory frequency will either be equal to or
less than the processor system bus frequency. For example, if DDR2 800 memory is
used with a 533 MHz system bus frequency processor, the memory will operate at
533 MHz. Table 5 lists the resulting operating memory frequencies based on the
combination of DIMMs and processors.
Table 5. Memory Operating Frequencies
DIMM Type
Processor system bus frequency
Resulting memory frequency
DDR2 533
533 MHz
533 MHz
DDR2 533
800 MHz
533 MHz
DDR2 533
1066 MHz
533 MHz
DDR2 667
533 MHz
533 MHz
DDR2 667
800 MHz
667 MHz
DDR2 667
1066 MHz
667 MHz
DDR2 800
533 MHz
533 MHz
DDR2 800
800 MHz
800 MHz
DDR2 800
1066 MHz
800 MHz
19
1.4.1
Memory Configurations
The Intel 82Q965 GMCH supports the following types of memory organization:
Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels
are black.
20
Product Description
Figure 3. Memory Channel Configuration and DIMM Configuration
INTEGRATORS NOTE
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated. This is a requirement of the
ICH8 Manageability Engine feature.
21
1.4.1.1
Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the
DIMM0 (blue) sockets of both channels are populated with identical DIMMs.
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
1 GB
Channel B, DIMM 0
Channel B, DIMM 1
OM18339
Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 5 shows a dual channel configuration using three DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the capacity of the single
DIMM in the DIMM0 (blue) socket of Channel B.
512 MB
1 GB
512
MB
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM18340
Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs
22
Product Description
Figure 6 shows a dual channel configuration using four DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the combined capacity of the
two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1
of both channels.
512 MB
1 GB
512 MB
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM18341
Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs
23
1.4.1.2
Single Channel (Asymmetric) Mode Configurations
NOTE
Dual channel (Interleaved) mode configurations provide the highest memory
throughput.
Figure 7 shows a single channel configuration using one DIMM. In this example, only
the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated.
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM18344
Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM
Figure 8 shows a single channel configuration using three DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A does not equal the capacity of the
single DIMM in the DIMM0 (blue) socket of Channel B.
512 MB
1 GB
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM18343
Figure 8. Single Channel (Asymmetric) Mode Configuration with Three

DIMMs
24
Product Description
1.4.1.3
Flex Mode Configuration
NOTE
The use of flex mode requires DIMMs to be installed in both channels.
Figure 9 shows a flex mode configuration using two DIMMs. The operation is as
follows:
The 512 MB DIMM in the Channel A, DIMM 0 socket and the lower 512 MB of the
DIMM in the Channel B, DIMM 0 socket operate together in dual channel mode.
The remaining (upper) 512 MB of the DIMM in Channel B operates in single
channel mode.
512 MB
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM18404
Figure 9. Flex Mode Configuration with Two DIMMs
25
1.5
Intel Virtualization Technology (Intel VT)
Virtualization is a proven technology that enables one computer to function as multiple

virtual systems. It enables multiple operating systems and application stacks to be
hosted in logically isolated partitions also known as virtual machines. Partitions are
independent virtualized environments within the same PC with shared, prioritized
access to system hardware. Platform resources, such as processors, memory,
storage, and network adapters can be allocated and prioritized for the different
partitions to meet specific business and application requirements.
Intel Virtualization Technology (Intel VT) offers silicon-level support for core
virtualization processes and a new, dedicated space in the software stack for an Intel
Lightweight Virtual Machine Monitor (Intel LVMM) a software layer that controls
and prioritizes each partitions access to the system hardware.
Intel provides the virtualization capability within Intel Virtualization Technologyenabled processors and validated chipsets. An Intel Virtualization Technology-enabled
BIOS is also needed. Standard memory, storage, and graphics cards work with the
Intel Virtualization Technology solution. However, because the quality and amount of
such system resources directly affect virtualization performance, it is advisable to be
generous in these areas. Using an Intel network adapter and compatible driver
ensures the ability to take advantage of the advanced security and manageability
capabilities of Intel Virtualization Technology.
A Virtual Machine Monitor enabled for Intel Virtualization Technology, such as
Intel LVMM, is also required. Intel LVMM is available to Independent Software
Vendors (ISVs). After the system hardware and VMM are in place, Intel Virtualization
Technology-enabled applications will need to be installed to take advantage of the
built-in hardware capabilities of Intel Virtualization Technology and the virtualization
enhancement of Intel LVMM.
Refer to
Intel Virtualization Technology
http://www.intel.com/go/dovirtualization/
INTEGRATORS NOTE
Intel Virtualization Technology-based platforms require system hardware,
virtualization software, and applications that are enabled for Intel Virtualization
Technology.
Individual PC manufacturers will determine whether to ship their platforms with Intel
Virtualization Technology enabled or disabled by default. Also, each PC manufacturer
may choose to ship Intel LVMM already installed on their platforms or on separate
CD-ROMs.
26
Product Description
1.6
Intel vPro Technology Support
The board supports Intel vPro technology, Intels platform for the digital office.
Intel vPro technology with Active Management Technology provides remote
management, improved security, and energy-efficient performance.
The management engine microcontroller in the Intel Q965 Express Chipset provides
remote hardware management capabilities regardless of the state of the operating
system. The embedded packet filters and sensors in ICH8DO provide enhanced
security features customizable through third party applications.
INTEGRATORS NOTE
In addition to the hardware support on the board (the Intel 82801HO ICH8DO and the
Intel 82566DM Gigabit Ethernet Controller), Intel vPro technology requires the use of
an Intel Core 2 Duo processor and compatible third-party applications.
Refer to
Intel vPro technology and compatible third-party applications
http://www.intel.com/vpro/
27
1.7
Intel Q965 Express Chipset
The Intel Q965 Express chipset consists of the following devices:
Intel 82Q965 Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
Intel 82801HO I/O Controller Hub (ICH8DO) with DMI interconnect
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D and display capabilities. The ICH8DO is a centralized controller for
the boards I/O paths.
Refer to
The Intel Q965 Express chipset
http://developer.intel.com/
Resources used by the chipset
Chapter 2
1.7.1
Intel Q965 Graphics Subsystem
The Intel Q965 Express chipset contains two separate, mutually exclusive graphics
options. Either the GMA 3000 graphics controller (contained within the 82Q965
GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express
x16 add-in card is installed, the GMA 3000 graphics controller is disabled.
1.7.1.1
Intel GMA 3000 Graphics Controller
The Intel GMA 3000 graphics controller features the following:
667 MHz core frequency

High performance 3-D setup and render engine
High quality texture engine
DX9.0c* and OpenGL* 1.4 + extensions compliant
Vertex Shader Model 2.0 / 3.0 (Software Only)
Hardware Pixel Shader 2.0
32-bit and 16-bit Full Precision Floating Point Operations
Up to eight Multiple Render Targets (MRTs)
Occlusion Query
128-bit floating point texture formats
Bilinear, Trilinear, and Anisotropic MipMap filtering
Shadow maps and double sided stencils
Alpha and luminance maps
Texture color-keying/chroma-keying
Cubic environment reflection mapping
Enhanced texture blending functions

3D Graphics Rendering enhancements
1.3 dual texture GigaPixel/sec fill rate
16 and 32 bit color
28
Product Description
Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz

Vertex cache
Anti-aliased lines
OpenGL version 1.5 support with vertex buffer and EXT_Shadow extensions
2D Graphics enhancements
8, 16, and 32 bit color
Optimized 256-bit BLT engine
Color space conversion
Anti-aliased lines
Video
Hardware motion compensation for MPEG2 and HD video
Software DVD at 30 fps full screen
Motion adaptive de-interlacing

Display
Integrated 24-bit 400 MHz RAMDAC
Up to 2048 x 1536 at 75 Hz refresh (QXGA)
DVI specification 1.0 compliant
Dual independent display options with digital display
180-degree hardware screen rotation
Hardware color cursor support
Supports TMDS transmitters or TV-out encoders
HDCP support
DDC2B compliant interface with Advanced Digital Display 2 card or Media
Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display
connections
Supports flat panels up to 2048 x 1536 at 75 Hz (when in dual-channel mode)
or digital CRT/HDTV at 1920 x 1080 at 85 Hz (with ADD2/MEC)
Two multiplexed SDVO port interfaces with 270 MHz pixel clocks using an
ADD2/MEC card
Dynamic Video Memory Technology (DVMT) support up to 256 MB
Intel Zoom Utility
1.7.1.2
Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be
allocated to DVMT on systems that have 512 MB or more of total system memory
installed. DVMT returns system memory back to the operating system when the
additional system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
29
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.7.1.3
Configuration Modes
A list of supported modes for the Intel GMA 3000 graphics controller is available as a
downloadable document.
Refer to
Supported video modes for the board
1.7.1.4
Advanced Digital Display (ADD2/MEC) Card Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
200 MHz pixel clock to the PCI Express x16 connector. The SDVO ports can be paired
for a dual channel configuration to support up to a 400 MHz pixel clock. When an
ADD2/MEC card is detected, the Intel GMA 3000 graphics controller is enabled and the
PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the
SDVO ports to be accessed by the ADD2/MEC card. An ADD2/MEC card can either be
configured to support simultaneous display with the primary VGA display or can be
configured to support dual independent display as an extended desktop configuration
with different color depths and resolutions. ADD2/MEC cards can be designed to
support the following configurations:
1.7.2
TV-Out (composite video)

Transition Minimized Differential Signaling (TMDS) for DVI 1.0
Low Voltage Differential Signaling (LVDS)
Single device operating in dual channel mode
VGA output
HDTV output
HDMI/UDI support (when used with the HD Audio Link)
USB
The board supports up to 10 USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers.
The ICH8DO provides the USB controller for all ports. The port arrangement is as
follows:
30
Six ports are implemented with stacked back panel connectors

Four ports are routed to two separate front panel USB headers
Product Description
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
Refer to
The location of the USB connectors on the back panel
Figure 15, page 57
The location of the front panel USB headers
Figure 16, page 58
1.7.3
Serial ATA Interfaces
The board provides six Serial ATA (SATA) connectors, which support one device per
connector.
1.7.3.1
Serial ATA Support
The ICH8DOs Serial ATA controller offers six independent Serial ATA ports with a
theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed
on each port for a maximum of six Serial ATA devices. A point-to-point interface is
used for host to device connections, unlike Parallel ATA IDE which supports a
master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows 2000 operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
Refer to
The location of the Serial ATA connectors
Figure 16, page 58
1.7.3.2
Serial ATA RAID
The ICH8DO supports the following RAID (Redundant Array of Independent Drives)
levels:
RAID
RAID
RAID
RAID
0 - data striping
1 - data mirroring
0+1 (or RAID 10) - data striping and mirroring
5 - distributed parity
31
1.7.4
Parallel IDE Interface
The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The
Parallel ATA IDE interface supports the following modes:
Programmed I/O (PIO): processor controls data transfer.

8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/sec.
Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up
to 88 MB/sec.
ATA-133: DMA protocol on IDE bus allows host and target throttling. The ATA-133
logic is designed to achieve read transfer rates up to 133 MB/sec and write transfer
rates in excess of 100 MB/sec.
NOTE
ATA-66, ATA-100, and ATA-133 are faster timings and require a specialized cable to
reduce reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives)
and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended
Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate
and translation mode to the BIOS.
Refer to
The location of the Parallel ATA IDE connector
Figure 16, page 58
1.7.5
Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to 13 minutes/year at
25 C with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 14 shows the location of the battery.
32
Product Description
1.8
Legacy I/O Controller
The I/O controller provides the following features:
One serial port

One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
Serial IRQ interface compatible with serialized IRQ support for PCI systems
PS/2-style mouse and keyboard interfaces
Interface for one 1.44 MB or 2.88 MB diskette drive
Intelligent power management, including a programmable wake-up event interface
PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1
Serial Port Interface
The serial port header is located on the component side of the board. The serial port
supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
Refer to
The location of the serial port header
Figure 16, page 58
1.8.2
Parallel Port Interface
The parallel port connector is located on the back panel. Use the BIOS Setup program
to set the parallel port mode.
Refer to
The location of the parallel port connector
Figure 15, page 57
1.8.3
Diskette Drive Interface
The I/O controller supports one diskette drive. Use the BIOS Setup program to
configure the diskette drive interface.
Refer to
The location of the diskette drive connector
Figure 16, page 58
1.8.4
PS/2 Keyboard and Mouse Interface (Optional)
The optional PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported
in the top PS/2 connector. Power to the computer should be turned off before a
keyboard or mouse is connected or disconnected.
Refer to
The location of the optional keyboard and mouse connectors
Figure 15, page 57
33
1.9
Audio Subsystem
The onboard audio subsystem consists of the following:
Intel 82801HO ICH8DO

Sigmatel STAC9227 audio codec
Back panel audio connectors
Component-side audio headers:
HD audio link header
Advanced jack sense for the front/back panel audio jacks that enables the
audio codec to recognize the device that is connected to an audio port. Within
hardware constraints, the back panel audio jacks are capable of retasking
according to the users definition, or can be automatically switched depending
on the recognized device type.
A signal-to-noise (S/N) ratio of 95 dB
Table 6 lists the supported retasking functions of the front panel and back panel audio
jacks.
Table 6. Audio Jack Retasking Support
Supports
Line in?
Supports
Line out?
Supports
Microphone?
Supports
Headphones?
Front panel Green
Yes
Yes
No
Yes
Front panel Pink
Yes
No
Yes
No
Back panel Blue
Yes
Yes
No
No
Back panel Green
No
Yes
No
Yes
Back panel Pink
Yes
Yes
Yes
No
Audio Jack
1.9.1
Audio Subsystem Software
Audio software and drivers are available from Intels World Wide Web site.
34
Refer to
Obtaining audio software and drivers
Product Description
1.9.2
Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable audio ports are shown in Figure 10.
Front Panel Audio Connectors
[Routed from Front Panel Audio Header]
Line Out/
Retasking Jack
[Green]
Mic In/
Retasking Jack
[Pink]
Back Panel Audio Connectors
Line In/Retasking Jack

[Blue]
Line Out/Retasking Jack
[Green]
Mic In/Retasking Jack
[Pink]
OM18469
Figure 10. Front/Back Panel Audio Connector Options

Refer to
The location of the front panel audio header
Figure 16, page 58
The signal names of the front panel audio header
Table 24, page 61
The location of the HD Audio Link header
Figure 16, page 58
The signal names of the HD Audio Link header
Table 18, page 60
The back panel audio connectors
Section 2.7.1, page 57
35
1.10 LAN Subsystem

The LAN subsystem consists of the following:
Intel 82566DM Gigabit (10/100/1000 Mbits/sec) Ethernet LAN controller
RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
CSMA/CD protocol engine
LAN connect interface between ICH8DO and LAN controller
PCI Conventional bus power management
Supports ACPI technology
Supports LAN wake capabilities
LAN Subsystem Software
LAN software and drivers are available from Intels World Wide Web site.
1.10.1
Intel 82566DM Gigabit Ethernet Controller
The Intel 82566DM Gigabit Ethernet Controller supports the following features:
PCI Express link

10/100/1000 IEEE 802.3 compliant
Compliant to IEEE 802.3x flow control support
Jumbo frame support
TCP, IP, UDP checksum offload
Transmit TCP segmentation
Advanced packet filtering
Full device driver compatibility
PCI Express Power Management Support
The Intel 82566DM also provides support for:
Alert Standard Format (ASF) 2.0

Intel Active Management Technology (Intel AMT)
Virtual LAN driver support for Intel VT partitions
1.10.2
36
Refer to
Obtaining LAN software and drivers
Product Description
1.10.3
RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 11 below).
Link LED
(Green)
Data Rate LED

(Green/Yellow)
OM18329
Figure 11. LAN Connector LED Locations

Table 7 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 7. LAN Connector LED States
LED
Link
Data Rate
1.10.4
LED Color
Green
Green/Yellow
LED State
Condition
Off
LAN link is not established.
On
LAN link is established.
Blinking
LAN activity is occurring.
Off
10 Mbits/sec data rate is selected.
Green
Yellow
Intel Active Management Technology (Intel

AMT) with System Defense Feature
Intel Active Management Technology offers IT organizations tamper-resistant and

persistent management capabilities. Specifically, Intel AMT is a hardware-based
solution that uses out of band communication to manage access client systems in
addition to offering encrypted and persistent asset management and remote
diagnostics and/or recovery capabilities for networked platforms. With Intel AMT, IT
organizations can easily get accurate platform information, and can perform remote
updating, diagnostics, debugging and repair of a system, regardless of the state of the
operating system and the power state of the system.
NOTE
Software with AMT capability is required to take advantage of Intel AMT platform
management capabilities.
The key features of Intel AMT include:
Secure Out of Band (OOB) system management that allows remote management
of PCs regardless of system power or operating system state.
Remote troubleshooting and recovery that can significantly reduce desk-side visits
and potentially increasing efficiency of IT technical staff.
Proactive alerting that decreases downtime and minimizes time to repair.
37
Third party non-volatile storage that prevents users from removing critical
inventory, remote control, or virus protection agents.
Remote hardware and software asset tracking that eliminates time-consuming
manual inventory tracking, which also reduces asset accounting costs.
System Defense Feature - an Intel AMT feature for stopping the propagation of
worms and viruses through the use of programmable packet filters in the
integrated LAN controller. The packet filters inspect all incoming and all outgoing
packets and determine whether to block or pass the packets as configured. There
is no indication to the host that a packet has been blocked or accepted.
Refer to
Intel Active Management

Technology
http://www.intel.com/technology/manage/iamt/index.htm
1.10.5
Alert Standard Format (ASF) 2.0 Support
The board provides the following ASF support for PCI Express x1 bus add-in LAN cards
and PCI Conventional bus add-in LAN cards:
Monitoring of system firmware progress events, including:

BIOS present
Primary processor initialization
Memory initialization
Video initialization
PCI resource configuration
Hard-disk initialization
User authentication
Starting operating system boot process

Monitoring of system firmware error events, including:
Memory missing
Memory failure
No video device
Keyboard failure
Hard-disk failure
No boot media
Boot options to boot from different types of boot devices
Reset, shutdown, power cycle, and power up options
38
Product Description
1.11 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
Fan monitoring and control

Thermal and voltage monitoring
Chassis intrusion detection
1.11.1
Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
Intel Quiet System Technology, delivering acoustically-optimized thermal

management
Fan speed control controllers and sensors integrated into the ICH8DO
Four thermal sensors (processor, 82Q965 GMCH, 82801HO ICH8DO, and a remote
thermal sensor)
Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.25 V, and
+VCCP) to detect levels above or below acceptable values
Thermally monitored closed-loop fan control, for all three fans, that can adjust the
fan speed or switch the fans on or off as needed
1.11.2
Fan Monitoring
Fan monitoring can be implemented using Intel Desktop Utilities or third-party

software.
Refer to
The functions of the fan headers
Section 1.12.2.2, page 44
1.11.3
Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
Refer to
The location of the chassis intrusion header
Figure 16, page 58
39
1.11.4
Thermal Monitoring
Figure 12 shows the locations of the thermal sensors and fan headers.
B
E
D
OM18441
Item
Description
Thermal diode, located on processor die
Thermal diode, located on the GMCH die
Thermal diode, located on the ICH8DO die
Remote thermal sensor
Processor fan
Front chassis fan
Rear chassis fan
Figure 12. Thermal Sensors and Fan Headers
40
Product Description
1.12 Power Management

Power management is implemented at several levels, including:
Software support through Advanced Configuration and Power Interface (ACPI)

Hardware support:
Power connector
Fan headers
LAN wake capabilities
Instantly Available PC technology
Resume on Ring
Wake from USB
Wake from PS/2 devices
Power Management Event signal (PME#) wake-up support
1.12.1
ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with the board requires an
operating system that provides full ACPI support. ACPI features include:
Plug and Play (including bus and device enumeration)

Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (see Table 10 on page 43)
Support for a front panel power and sleep mode switch
Table 8 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 8. Effects of Pressing the Power Switch
If the system is in this
state
and the power switch

is pressed for
Off
(ACPI G2/G5 Soft off)
Less than four seconds
Power-on
(ACPI G0 working state)
On
Soft-off/Standby
(ACPI G1 sleeping state)
On
More than four seconds
Fail safe power-off

Sleep
Wake-up
Sleep
More than four seconds
Power-off
the system enters this state
41
1.12.1.1
System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 9 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 9. Power States and Targeted System Power
Global
States
Sleeping States
Processor
States
G0 working
state
S0 working
C0 working
D0 working
state.
Full power > 30 W
G1 sleeping
state
N/A
C1 stop
grant
D1, D2, D3
device
specification
specific.
5 W < power < 52.5 W
G1 sleeping
state
S3 Suspend to
RAM. Context
saved to RAM.
No power
D3 no power
except for
wake-up logic.
Power < 5 W (Note 2)
G1 sleeping
state
S4 Suspend to
disk. Context
saved to disk.
No power
D3 no power
except for
wake-up logic.
G2/S5
S5 Soft off.
Context not saved.
Cold boot is
required.
No power
D3 no power
except for
wake-up logic.
G3
mechanical off.
AC power is
disconnected
from the
computer.
No power to the
system.
No power
D3 no power for
wake-up logic,
except when
provided by
battery or
external source.
No power to the system.

Service can be performed
safely.
Device States
Targeted System
Power (Note 1)
Notes:
42
1.
Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis power supply.
2.
Dependent on the standby power consumption of wake-up devices used in the system.
Product Description
1.12.1.2 Two-Watt Standby

In 2001, the U.S. government issued an executive order requiring a reduction in
power for appliances and personal computers. This board meets that requirement by
operating at 1.5 W (or less) in S5 (Standby) mode. Two-Watt operation applies only
to the S5 state when the computer is turned off, but still connected to AC power.
Two-Watt operation does not apply to the S3 (Suspend to RAM) or S4 (Suspend to
disk) states.
Newer energy-efficient power supplies using less than 0.5 W (in Standby mode) may
also be needed to achieve this goal.
1.12.1.3
Wake-up Devices and Events
Table 10 lists the devices or specific events that can wake the computer from specific
states.
Table 10. Wake-up Devices and Events
These devices/events can wake up the computer
from this state
LAN
S3, S4, S5 (Note)
PME# signal
S3, S4, S5 (Note)
Power switch
S3, S4, S5
PS/2 devices
S3
RTC alarm
S3, S4, S5
Serial port
S3
USB
S3
WAKE# signal
S3, S4, S5
Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to
Power On will enable a wake-up event from LAN in the S5 state.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
1.12.2
Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
Power connector
Fan headers
43
LAN wake capabilities

Instantly Available PC technology
Resume on Ring
Wake from USB
Wake from PS/2 keyboard
PME# signal wake-up support
WAKE# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
Resume on Ring enables telephony devices to access the computer when it is in a
power-managed state. The method used depends on the type of telephony device
(external or internal).
NOTE
The use of Resume on Ring and Wake from USB technologies from an ACPI state
requires an operating system that provides full ACPI support.
1.12.2.1
Power Connector
ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computers response can be set
using the Last Power State feature in the BIOS Setup programs Boot menu.
Refer to
The location of the main power connector
Figure 16, page 58
The signal names of the main power connector
Table 26, page 63
1.12.2.2
Fan Headers
The function/operation of the fan headers is as follows:
44
The fans are on when the board is in the S0 state.

The fans are off when the board is off or in the S3, S4, or S5 state.
Each fan header is wired to a fan tachometer input of the hardware monitoring and
fan control device.
All fan headers support closed-loop fan control that can adjust the fan speed or
switch the fan on or off as needed.
All fan headers have a +12 V DC connection.
Refer to
The locations of the fan headers and thermal sensors
Figure 12, page 40
The signal names of the processor fan header
Table 23, page 61
The signal names of the chassis fan headers
Table 22, page 60
Product Description
1.12.2.3
LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line from the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing LAN wake capabilities can damage the power
supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
The PCI Express WAKE# signal

The PCI bus PME# signal for PCI 2.3 compliant LAN designs
The onboard LAN subsystem
1.12.2.4
Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line from the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 10 on page 43 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.3 compliant add-in cards and drivers.
1.12.2.5
Resume on Ring
The operation of Resume on Ring can be summarized as follows:
Resumes operation from ACPI S3 state

Detects incoming call similarly for external and internal modems
Requires modem interrupt be unmasked for correct operation
45
1.12.2.6
Wake from USB
USB bus activity wakes the computer from ACPI S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.12.2.7
Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S3 state.
1.12.2.8
PME# Signal Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI
S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.12.2.9
WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S3, S4, or S5 state.
46
Product Description
1.12.2.10 Onboard Power Indicator LEDs

CAUTION
If AC power has been switched off and the +5 V standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
CAUTION
When connected to AC power, the memory slots on the board will be powered on and
in use. A red LED (shown in Figure 13), located near the memory slots, will be lit if
the memory slots are powered.
Installing or removing memory while the memory slots are powered may result in
damage to both the memory and the board. Before installing or removing memory,
disconnect the computer from AC power and wait for the LED to go off before
proceeding.
Figure 13 shows the location of the two power indicators:
+5 V standby power indicator LED. The +5 V standby power indicator LED is lit
when there is standby power still present even when the computer appears to be
off.
Memory power indicator LED. The memory power indicator LED is lit when there is
power to the memory slots.
OM18490
Item
Description
LED color
+5 V standby power indicator LED
Green
Memory power indicator LED
Red
Figure 13. Location of the Onboard Power Indicator LEDs
47
1.13 Trusted Platform Module (TPM)

The TPM 1.2 component is specifically designed to enhance platform security aboveand-beyond the capabilities of todays software by providing a protected space for key
operations and other security critical tasks. Using both hardware and software, the
TPM protects encryption and signature keys at their most vulnerable stages
operations when the keys are being used unencrypted in plain-text form. The TPM is
specifically designed to shield unencrypted keys and platform authentication
information from software-based attacks.
48
Refer to
TPM 1.2
http://www.intel.com/design/motherbd/gf/
Technical Reference

2.1 Memory Map................................................................................... 49
2.2 DMA Channels................................................................................. 51
2.3 Fixed I/O Map ................................................................................. 52
2.4 PCI Configuration Space Map ............................................................ 53
2.5 Interrupts ...................................................................................... 54
2.6 PCI Interrupt Routing Map ................................................................ 55
2.7 Connectors and Headers................................................................... 56
2.8 Jumper Block .................................................................................. 67
2.9 Mechanical Considerations ................................................................ 68
2.10 Electrical Considerations ................................................................... 73
2.11 Thermal Considerations .................................................................... 75
2.12 Reliability ....................................................................................... 77
2.13 Environmental ................................................................................ 78
2.1
2.1.1
Memory Map
Addressable Memory
The board utilizes 8 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total
system memory). On a system that has 8 GB of system memory installed, it is not
possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
BIOS/ SPI Flash (16 Mbits)

Local APIC (19 MB)
Digital Media Interface (40 MB)
Front side bus interrupts (17 MB)
PCI Express configuration space (256 MB)
GMCH base address registers, internal graphics ranges, PCI Express ports (up to
512 MB)
Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express add-in cards
Manageability Engine support (6 MB)
Base graphics memory support (1 MB or 8 MB)
49
The amount of installed memory that can be used will vary based on add-in cards and
BIOS settings. Figure 14 shows a schematic of the system memory map. All installed
system memory can be used when there is no overlap of system addresses.
8 GB
Top of System Address Space
Upper
4 GB of
address
space
FLASH
APIC
~20 MB
Reserved
PCI Memory Range contains PCI, chipsets,

Direct Media Interface
(DMI), and ICH ranges
(approximately 750 MB)
0FFFFFH
0F0000H
0EFFFFH
Top of usable
DRAM (memory
visible to the
operating system)
0E0000H
0DFFFFH
0C0000H
DRAM
Range
0BFFFFH
1 MB
DOS
Compatibility
Memory
640 KB
0A0000H
1 MB
Upper BIOS
area (64 KB)
960 KB
Lower BIOS
area
(64 KB;
16 KB x 4)
896 KB
Add-in Card
BIOS and
Buffer area
(128 KB;
16 KB x 8)
768 KB
Standard PCI/
ISA Video
Memory (SMM
Memory)
128 KB
640 KB
09FFFFH
DOS area
(640 KB)
0 MB
00000H
0 KB
OM18311
Figure 14. Detailed System Memory Address Map
50
Technical Reference
Table 11 lists the system memory map.

Table 11. System Memory Map
Address Range
(decimal)
Address Range
(hex)
Size
Description
1024 K - 8388608 K
100000 - 1FFFFFFFF
8191 MB
Extended memory
960 K - 1024 K
F0000 - FFFFF
64 KB
Runtime BIOS
896 K - 960 K
E0000 - EFFFF
64 KB
Reserved
800 K - 896 K
C8000 - DFFFF
96 KB
Potential available high DOS

memory (open to the PCI bus).
Dependent on video adapter used.
640 K - 800 K
A0000 - C7FFF
160 KB
Video memory and BIOS
639 K - 640 K
9FC00 - 9FFFF
1 KB
Extended BIOS data (movable by

memory manager software)
512 K - 639 K
80000 - 9FBFF
127 KB
Extended conventional memory
0 K - 512 K
00000 - 7FFFF
512 KB
Conventional memory
2.2
DMA Channels
Table 12. DMA Channels

DMA Channel Number
Data Width
System Resource
8 or 16 bits
Open
8 or 16 bits
Parallel port
8 or 16 bits
Diskette drive
8 or 16 bits
Parallel port (for ECP or EPP)
8 or 16 bits
DMA controller
16 bits
Open
16 bits
Open
16 bits
Open
51
2.3
Fixed I/O Map
Table 13. I/O Map

Address (hex)
Size
Description
0000 - 00FF
256 bytes
Used by the Desktop Board DQ965GF. Refer to the ICH8DO

data sheet for dynamic addressing information.
01F0 - 01F7
0228 - 022F (Note 1)
8 bytes
Primary Parallel ATE IDE channel command block
8 bytes
LPT3
0278 - 027F (Note 1)
8 bytes
LPT2
02E8 - 02EF (Note 1)
8 bytes
COM4
02F8 - 02FF (Note 1)
8 bytes
COM2
0378 - 037F
8 bytes
LPT1
03B0 - 03BB
12 bytes
Intel 82Q965 GMCH
03C0 - 03DF
32 bytes
Intel 82Q965 GMCH
03E8 - 03EF
8 bytes
COM3
03F0 - 03F5
6 bytes
Diskette channel
03F4 - 03F7
4 bytes
Primary Parallel ATA IDE channel control block
03F8 - 03FF
8 bytes
COM1
04D0 - 04D1
2 bytes
Edge/level triggered PIC
LPTn + 400
8 bytes
ECP port, LPTn base address + 400h
0CF8 - 0CFB (Note 2)
4 bytes
PCI configuration address register
0CF9 (Note 3)
1 byte
Reset control register
0CFC - 0CFF
4 bytes
PCI configuration data register
FFA0 - FFA7
8 bytes
Primary Parallel ATA IDE bus master registers
Notes:
1.
Default, but can be changed to another address range
2.
Dword access only
3.
Byte access only
NOTE
Some additional I/O addresses are not available due to ICH8DO address aliasing. The
ICH8DO data sheet provides more information on address aliasing.
52
Refer to
Obtaining the ICH8DO data sheet
Section 1.2 on page 17
Technical Reference
2.4
PCI Configuration Space Map
Table 14. PCI Configuration Space Map

Bus
Number (hex)
Device
Number (hex)
Function
Number (hex)
Description
00
00
00
Memory controller of Intel 82Q965 component
00
01
00
PCI Express x16 graphics port (Note 1)
00
02
00
Integrated graphics controller
00
1B
00
Intel High Definition Audio Controller
00
1C
00
PCI Express port 1
00
1C
01
PCI Express port 2
00
1C
02
PCI Express port 3
00
1C
03
PCI Express port 4
00
1C
04
PCI Express port 5
00
1D
00
USB UHCI controller 1
00
1D
01
00
1D
02
00
1D
00
00
1A
01
00
1D
07
EHCI controller #1
00
1A
07
EHCI controller #2
00
1E
00
PCI bridge
00
1F
00
PCI controller
00
1F
01
Parallel ATA IDE controller
00
1F
02
Serial ATA controller #1
00
1F
05
Serial ATA controller #2
00
1F
03
SMBus controller
00
19
00
Gigabit LAN controller
(Note 2)
00
00
PCI Conventional bus connector 1
(Note 2)
01
00
PCI Conventional bus connector 2
(Note 2)
03
00
IEEE-1394a controller (optional)
01
00
00
PCI Express video controller (Note 1)
Notes:
1. Present only when a PCI Express x16 graphics card is installed.
2. Bus number is dynamic and can change based on add-in cards used.
53
2.5
Interrupts
The interrupts can be routed through either the Programmable Interrupt Controller
(PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the
ICH8DO component. The PIC is supported in Windows 98 SE and Windows ME and
uses the first 16 interrupts. The APIC is supported in Windows 2000 and Windows XP
and supports a total of 24 interrupts.
Table 15. Interrupts
IRQ
System Resource
NMI
I/O channel check
Reserved, interval timer
Reserved, keyboard buffer full
Reserved, cascade interrupt from slave PIC
COM2 (Note 1)
COM1 (Note 1)
LPT2 (Plug and Play option)/User available
Diskette drive
LPT1 (Note 1)
Real-time clock
Reserved for ICH8DO system management bus
10
User available
11
User available
12
Onboard mouse port (if present, else user available)
13
Reserved, math coprocessor
14
Primary IDE/Serial ATA (if present, else user available)
15
Secondary IDE/Serial ATA (if present, else user available)
16 (Note 2)
USB UHCI controller 1 / USB UHCI controller 4 (through PIRQA)
17 (Note 2)
AC 97 audio/modem/User available (through PIRQB)
18 (Note 2)
ICH8DO USB controller 3 (through PIRQC)
19 (Note 2)
ICH8DO USB controller 2 (through PIRQD)
20 (Note 2)
ICH8DO LAN (through PIRQE)
21 (Note 2)
User available (through PIRQF)
22 (Note 2)
User available (through PIRQG)
23 (Note 2)
ICH8DO USB 2.0 EHCI controller/User available (through PIRQH)
Notes:
1. Default, but can be changed to another IRQ.
2. Available in APIC mode only.
54
Technical Reference
2.6
PCI Interrupt Routing Map
This section describes interrupt sharing and how the interrupt signals are connected
between the PCI bus connectors and onboard PCI devices. The PCI specification
specifies how interrupts can be shared between devices attached to the PCI bus. In
most cases, the small amount of latency added by interrupt sharing does not affect
the operation or throughput of the devices. In some special cases where maximum
performance is needed from a device, a PCI device should not share an interrupt with
other PCI devices. Use the following information to avoid sharing an interrupt with a
PCI add-in card.
PCI devices are categorized as follows to specify their interrupt grouping:
INTA: By default, all add-in cards that require only one interrupt are in this
category. For almost all cards that require more than one interrupt, the first
interrupt on the card is also classified as INTA.
INTB: Generally, the second interrupt on add-in cards that require two or more
interrupts is classified as INTB. (This is not an absolute requirement.)
INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC
and a fourth interrupt is classified as INTD.
The ICH8DO has eight Programmable Interrupt Request (PIRQ) input signals. All PCI
interrupt sources either onboard or from a PCI add-in card connect to one of these
PIRQ signals. Some PCI interrupt sources are electrically tied together on the board
and therefore share the same interrupt. Table 16 shows an example of how the
PIRQ signals are routed.
Table 16. PCI Interrupt Routing Map
ICH8DO PIRQ Signal Name
PCI Interrupt Source
PIRQA
PIRQB
PIRQC
PIRQD
PIRQE
PIRQF
PIRQG
PIRQH
INTD
INTA
INTB
INTC
INTC
INTB
INTA
INTD
ICH8DO LAN
INTA
PCI bus connector 1

PCI bus connector 2
IEEE-1394a controller
INTA
NOTE
In PIC mode, the ICH8DO can connect each PIRQ line internally to one of the IRQ
signals (3, 4, 5, 6, 7, 9, 10, 11, 12, 14, and 15). Typically, a device that does not
share a PIRQ line will have a unique interrupt. However, in certain interruptconstrained situations, it is possible for two or more of the PIRQ lines to be connected
to the same IRQ signal. Refer to Table 15 for the allocation of PIRQ lines to IRQ
signals in APIC mode.
PCI interrupt assignments to USB ports, Serial ATA ports, and PCI Express ports are
dynamic.
55
2.7
Connectors and Headers
CAUTION
Only the following connectors have overcurrent protection: Back panel and front panel
USB, PS/2, and VGA.
The other internal connectors/headers are not overcurrent protected and should
connect only to devices inside the computers chassis, such as fans and internal
peripherals. Do not use these connectors/headers to power devices external to the
computers chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
This section describes the boards connectors and headers. The connectors and
headers can be divided into these groups:
56
Back panel I/O connectors (see page 57)

Component-side connectors and headers (see page 58)
Technical Reference
2.7.1
Back Panel Connectors
Figure 15 shows the locations of the back panel connectors.

C
K
OM18439
Item
Description
PS/2 mouse port (optional)
PS/2 keyboard port (optional)
Parallel port
VGA port
IEEE-1394a (optional)
USB ports [4]
LAN
USB ports [2]
Audio line in
Mic in
Audio line out
Figure 15. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
57
2.7.2
Component-side Connectors and Headers
Figure 16 shows the locations of the component-side connectors and headers.

D E
B C
10
2
4
1
16
F
G
U
2
10
2 1
1
10
1 2
10
8
1
24
9
1
2
2
1
O N
ML
J
OM18442
Figure 16. Component-side Connectors and Headers
58
Technical Reference
Table 17 lists the component-side connectors and headers identified in Figure 16.
Table 17. Component-side Connectors and Headers Shown in Figure 16
Item/callout
from Figure 16
A
Description
IEEE-1394a front panel header (optional)
Processor core power connector
Rear chassis fan header
Processor fan header
Serial port header
Diskette drive connector
Main Power connector
Front chassis fan header
Chassis intrusion header
Auxiliary front panel power LED header
Front panel header
Serial ATA connectors [6]
Parallel ATE IDE connector
High Definition Audio header
59
Table 18. High Definition Audio Link Header

Pin
Signal Name
Pin
Signal Name
BCLK
Ground
RST
3.3 V/1.5 V I/O
SYNC
Ground
SDO
3.3V_CORE
SDI
10
+12 V
11
No connect
12
Key (no pin)
13
No connect
14
3.3 V/1.5V STBY
15
No connect
16
Ground
Signal Name
Pin
Signal Name
DCD
RXD#
TXD#
DTR
Ground
DSR
Table 19. Serial ATA Connectors

Pin
Signal Name
Ground
TXP
TXN
Ground
RXN
RXP
Ground
Table 20. Chassis Intrusion Header

Pin
Signal Name
Intruder
Ground
Table 21. Serial Port Header

Pin
RTS
CTS
RI
10
Key (no pin)
Table 22. Front and Rear Chassis Fan Headers
60
Pin
Signal Name
Control
+12 V
Tach
Technical Reference
Table 23. Processor Fan Header

Pin
Signal Name
Ground
+12 V
FAN_TACH
FAN_CONTROL
Table 24. Front Panel Audio Header

Pin
Signal Name
Pin
Signal Name
[Port 1] Left channel
Ground
[Port 1] Right channel
PRESENCE# (Dongle present)
[Port 2] Right channel
[Port 1] SENSE_RETURN
SENSE_SEND (Jack detection)
Key (no pin)
[Port 2] Left channel
10
[Port 2] SENSE_RETURN
61
2.7.2.1
Add-in Card Connectors
The board has the following add-in card connectors:
PCI Express x16: one connector supporting simultaneous transfer speeds up to

4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent
bandwidth
PCI Express x1: one PCI Express x1 connector. The x1 interface supports
simultaneous transfer speeds up to 250 Mbytes/sec of peak bandwidth per
direction and up to 500 MBytes/sec concurrent bandwidth
PCI Conventional (rev 2.3 compliant) bus: two PCI Conventional bus add-in card
connectors. The SMBus is routed to PCI Conventional bus connector 2 only. PCI
Conventional bus add-in cards with SMBus support can access sensor data and
other information residing on the board.
Note the following considerations for the PCI Conventional bus connectors:
All of the PCI Conventional bus connectors are bus master capable.
SMBus signals are routed to PCI Conventional bus connector 2. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the
board. The specific SMBus signals are as follows:
The SMBus clock line is connected to pin A40.
The SMBus data line is connected to pin A41.
62
Technical Reference
2.7.2.2
Power Supply Connectors
The board has the following power supply connectors:
Main power a 2 x 12 connector. This connector is compatible with 2 x 10

connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and
24 unconnected.
Processor core power a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
Table 25. Processor Core Power Connector

Pin
Signal Name
Pin
Signal Name
Ground
Ground
+12 V
+12 V
Table 26. Main Power Connector

Pin
Signal Name
Pin
Signal Name
+3.3 V
13
+3.3 V
+3.3 V
14
-12 V
Ground
15
Ground
+5 V
16
PS-ON# (power supply remote on/off)
Ground
17
Ground
+5 V
18
Ground
Ground
19
Ground
PWRGD (Power Good)
20
No connect
+5 V (Standby)
21
+5 V
10
+12 V
22
11
+12 V (Note)
23
+5 V
+5 V (Note)
12
2 x 12 connector detect (Note)
24
Ground (Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
63
2.7.2.3
Front Panel Header
This section describes the functions of the front panel header. Table 27 lists the signal
names of the front panel header. Figure 17 is a connection diagram for the front panel
header.
Table 27. Front Panel Header
Pin
In/
Out
Signal
Description
Pin
In/
Out
Signal
Hard Drive Activity LED
Description
Power LED
HD_PWR
Out
Hard disk LED pull-up

to +5 V
HDR_BLNK_
GRN
Out
Front panel green

LED
HDA#
Out
Hard disk active LED
HDR_BLNK_
YEL
Out
Front panel yellow

LED
Reset Switch
Ground
FP_RESET#
In
On/Off Switch
Ground
FPBUT_IN
Reset switch
Ground
+5 V
Not Connected
Power
10
N/C
N/C
Not connected
+5 V DC
Power
Switch
+
Dualcolored
Power LED
Power switch
Ground
Power
In
Reset
Switch
Hard Drive
Activity LED
Singlecolored
Power LED
OM18331
Figure 17. Connection Diagram for Front Panel Header

2.7.2.3.1
Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
64
A Serial ATA hard drive connected to an onboard Serial ATA connector

A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector
Technical Reference
2.7.2.3.2
Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.7.2.3.3
Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 28 shows the
possible states for a one-color LED. Table 29 shows the possible states for a two-color
LED.
Table 28. States for a One-Color Power LED
LED State
Description
Off
Power off/sleeping
Steady Green
Running
Table 29. States for a Two-Color Power LED

LED State
Description
Off
Power off
Steady Green
Running
Steady Yellow
Sleeping
NOTE
The colors listed in Table 28 and Table 29 are suggested colors only. Actual LED
colors are product- or customer-specific.
2.7.2.3.4
Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
2.7.2.4
Auxiliary Front Panel Power LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 30. Auxiliary Front Panel Power LED Header
Pin
Signal Name
In/Out
Description
HDR_BLNK_GRN
Out
Front panel green LED
Out
Front panel yellow LED
Not connected
HDR_BLNK_YEL
65
2.7.2.5
Front Panel USB Headers
Figure 18 is a connection diagram for the front panel USB headers.
INTEGRATORS NOTES
The +5 V DC power on the front panel USB headers is fused.

Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Power
(+5 V DC)
Power
(+5 V DC)
D-
D-
D+
D+
Ground
Ground
10
No connect
One
USB
Port
Key (no pin)
One
USB
Port
OM18317
Figure 18. Connection Diagram for Front Panel USB Headers
2.7.2.6 Front Panel IEEE-1394a Header (Optional)

Figure 19 is a connection diagram for the optional IEEE-1394a header.
Ground
10
Key (no pin)
+12 V DC
+12 V DC
TPB-
TPB+
Ground
Ground
TPA-
TPA+
OM18332
Figure 19. Connection Diagram for IEEE-1394a Header
66
INTEGRATORS NOTES
The +12 V DC power on the IEEE-1394a header is fused.

The IEEE-1394a header provides one IEEE-1394a port.
Technical Reference
2.8
Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 20 shows the location of the jumper block. The jumper determines the BIOS
Setup programs mode. Table 31 lists the jumper settings for the three modes:
normal, configure, and recovery. When the jumper is set to configure mode and the
computer is powered-up, the BIOS compares the processor version and the microcode
version in the BIOS and reports if the two match.
3 2 1
OM18445
Figure 20. Location of the Jumper Block

Table 31. BIOS Setup Configuration Jumper Settings
Function/Mode
Jumper Setting
Configuration
Normal
1-2
The BIOS uses current configuration information and

passwords for booting.
3 2 1
Configure
After the POST runs, Setup runs automatically. The

maintenance menu is displayed.
2-3
3 2 1
Recovery
None
3 2 1
The BIOS attempts to recover the BIOS configuration. See

Section 3.7 for more information on BIOS recovery.
67
2.9
Mechanical Considerations
2.9.1
Form Factor
The board is designed to fit into an ATX- or microATX-form-factor chassis. Figure 21

illustrates the mechanical form factor of the board. Dimensions are given in inches
[millimeters]. The outer dimensions are 9.60 inches by 9.60 inches [243.84
millimeters by 243.84 millimeters].
1.800
[45.72]
6.500
[165.10]
6.100
[154.94]
5.200
[132.08]
0.00
2.850
[72.39]
3.100
[78.74]
3.150
[80.01]
2.600
[66.04]
0.00
6.200
[157.48]
6.450
[163.83]
OM18444
Figure 21. Board Dimensions
68
Technical Reference
2.9.2
I/O Shield
The back panel I/O shield for the board must meet specific dimension and material
requirements. Systems based on this board need the back panel I/O shield to pass
certification testing. Table 32 lists the compatible I/O shield design drawings.
Table 32. Compatible I/O shields
IEEE-1394a connector
on back panel?
PS/2 connectors on
back panel?
For I/O shield

dimensions, see
Yes
Yes
Figure 22
Yes
No
Figure 23
No
No
Figure 24
Dimensions are given in inches [millimeters]. The figures indicate the position of each
cutout. Additional design considerations for I/O shields relative to chassis
requirements are described in the ATX specification.
NOTE
The I/O shield drawings are for reference only. I/O shields compliant with the ATX
specification are available from Intel.
69
0.063 0.005
[1.6 0.12]
0.787 0.010 TYP

[20 0.254]
0.061 REF
[1.55]
6.268 0.005
[159.2 0.12]
6.390 REF
[162.3]
0.039
[1]
8X R0.5 MIN
0.884
[22.45]
A
A
0.276
[7.01]
0.00
[0.00]
0.465
[11.81]
0.465
[11.81]
0.558
[14.17]
5.783
[146.88]
4.573
[116.15]
3.822
[97.08]
3.288
[83.52]
1.927
[48.95]
0.780
[19.81]
0.326
[8.27]
0.00
[0.00]
0.474
[12.04]
1.890
[48]
1.768 0.005
[44.9 0.12]
0.591 0.010
[15 0.25]
OM18446
Figure 22. I/O Shield Dimensions for Boards with IEEE-1394a and
PS/2 Connectors
70
Technical Reference
0.063 0.005
[1.6 0.12]
0.787 0.010 TYP

[20 0.254]
0.061 REF
[1.55]
6.268 0.005
[159.2 0.12]
6.390 REF
[162.3]
0.039
[1]
8X R0.5 MIN
0.884
[22.45]
A
A
0.276
[7.01]
0.00
[0.00]
0.465
[11.81]
0.474
[12.04]
5.783
[146.88]
4.573
[116.15]
3.822
[97.08]
3.288
[83.52]
1.927
[48.95]
0.780
[19.81]
0.00
[0.00]
0.558
[14.17]
1.890
[48]
1.768 0.005
[44.9 0.12]
0.591 0.010
[15 0.25]
OM18447
Figure 23. I/O Shield Dimensions for Boards without PS/2 Connectors
71
0.063 0.005
[1.6 0.12]
0.787 0.010 TYP

[20 0.254]
0.061 REF
[1.55]
6.268 0.005
[159.2 0.12]
6.390 REF
[162.3]
0.039
[1]
8X R0.5 MIN
0.884
[22.45]
A
A
0.276
[7.01]
0.00
[0.00]
0.465
[11.81]
0.474
[12.04]
5.783
[146.88]
4.573
[116.15]
3.822
[97.08]
1.927
[48.95]
0.780
[19.81]
0.00
[0.00]
0.558
[14.17]
1.890
[48]
1.768 0.005
[44.9 0.12]
0.591 0.010
[15 0.25]
OM18448
Figure 24. I/O Shield Dimensions for Boards without IEEE-1394a and
PS/2 Connectors
72
Technical Reference
2.10 Electrical Considerations

2.10.1
DC Loading
Table 33 lists the DC loading characteristics of the board. This data is based on a DC
analysis of all active components within the board that impact its power delivery
subsystems. The analysis does not include PCI add-in cards. Minimum values assume
a light load placed on the board that is similar to an environment with no applications
running and no USB current draw. Maximum values assume a load placed on the
board that is similar to a heavy gaming environment with a 500 mA current draw per
USB port. These calculations are not based on specific processor values or memory
configurations but are based on the minimum and maximum current draw possible
from the boards power delivery subsystems to the processor, memory, and USB
ports.
Use the datasheets for add-in cards, such as PCI, to determine the overall system
power requirements. The selection of a power supply at the system level is dependent
on the systems usage model and not necessarily tied to a particular processor speed.
Table 33. DC Loading Characteristics
DC Current at:
Mode
DC Power
-12 V
+12 V1
+12 V2
+5 V
+3.3 v
+5 VSB
(CPU)
Minimum
loading
43.13 W
0.00
0.40
1.79
1.80
2.00
0.25 [S0]
0.25 [S3]
Maximum
loading
532.98 W
0.30
11.50
16.77
23.96
19.52
1.17 [S0]
3.89 [S3]
2.10.2
Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 34 lists the current capability of the fan headers.
Table 34. Fan Header Current Capability
Fan Header
Maximum Available Current
Processor fan
3.0 A
Front chassis fan
1.5 A
Rear chassis fan
1.5 A
73
2.10.3
Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (all three
expansion slots and the PCI Express x16 connector filled) must not exceed 8 A.
2.10.4
Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
System integrators should refer to the power usage values listed in Table 33 when
selecting a power supply for use with the board.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
The potential relation between 3.3 VDC and +5 VDC power rails
The current capability of the +5 VSB line
All timing parameters
All voltage tolerances
74
Technical Reference
2.11 Thermal Considerations

CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the boards maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.13.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 25) can reach a temperature of up to 85 oC in
an open chassis.
75
Figure 25 shows the locations of the localized high temperature zones.
C
OM18443
Item
Description
A
B
C
D
Processor voltage regulator area

Processor
Intel 82Q965 GMCH
Figure 25. Localized High Temperature Zones
76
Technical Reference
Table 35 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 35. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and

processor specification updates
Intel 82Q965 GMCH
97 oC (under bias)
92 oC (under bias)
Refer to
Processor datasheets and specification updates
2.12 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 C. The Desktop Board
DQ965GF MTBF is 117,142 hours.
77
2.13 Environmental
Table 36 lists the environmental specifications for the board.
Table 36. Desktop Board DQ965GF Environmental Specifications
Parameter
Specification
Temperature
Non-Operating
-40 C to +70 C
Operating
0 C to +55 C
Shock
Unpackaged
50 g trapezoidal waveform
Packaged
Half sine 2 millisecond
Velocity change of 170 inches/second

Product weight (pounds)
Free fall (inches)
Velocity change
(inches/sec)
<20
36
167
21-40
30
152
41-80
24
136
81-100
18
118
Vibration
Unpackaged
5 Hz to 20 Hz: 0.01 g Hz sloping up to 0.02 g Hz

20 Hz to 500 Hz: 0.02 g Hz (flat)
Packaged
10 Hz to 40 Hz: 0.015 g Hz (flat)

40 Hz to 500 Hz: 0.015 g Hz sloping down to 0.00015 g Hz
78
Overview of BIOS Features

3.1 Introduction ...................................................................................
3.2 BIOS Flash Memory Organization .......................................................
3.3 Resource Configuration ....................................................................
3.4 System Management BIOS (SMBIOS).................................................
3.5 Legacy USB Support ........................................................................
3.6 BIOS Updates .................................................................................
3.7 BIOS Recovery................................................................................
3.8 Boot Options...................................................................................
3.9 Adjusting Boot Speed.......................................................................
3.10 BIOS Security Features ....................................................................
3.1
79
80
80
81
82
82
83
84
85
86
Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug
and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as CO96510J.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main
Advanced
Security
Power
Boot
Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.8 on page 67 shows how to put the board in configure mode.
79
Table 37 lists the BIOS Setup program menu features.

Table 37. BIOS Setup Program Menu Bar
Maintenance
Main
Advanced
Security
Power
Boot
Exit
Clears
passwords and
displays
processor
information
Displays
processor
and
memory
configuration
Configures
advanced
features
available
through the
chipset
Sets
passwords
and
security
features
Configures
power
management
features
and power
supply
controls
Selects
boot
options
Saves or
discards
changes to
Setup
program
options
Table 38 lists the function keys available for menu screens.

Table 38. BIOS Setup Program Function Keys
BIOS Setup Program
Function Key
Description
<> or <>
Selects a different menu screen (Moves the cursor left or right)
<> or <>
Selects an item (Moves the cursor up or down)
<Tab>
Selects a field (Not implemented)
<Enter>
Executes command or selects the submenu
<F9>
Load the default configuration values for the current menu
<F10>
Save the current values and exits the BIOS Setup program
<Esc>
Exits the menu
3.2
BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 16 Mbit (2048 KB)
flash memory device
3.3
3.3.1
Resource Configuration
PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.
80
3.3.2
PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the
PCI IDE connector with independent I/O channel support. The IDE interface supports
hard drives up to ATA-66/100/133 and recognizes any ATAPI compliant devices,
including CD-ROM drives, tape drives, and Ultra DMA drives. The BIOS determines the
capabilities of each drive and configures them to optimize capacity and performance.
To take advantage of the high capacities typically available today, hard drives are
automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4,
depending on the capability of the drive. You can override the auto-configuration
options by specifying manual configuration in the BIOS Setup program.
To use ATA-66/100/133 features the following items are required:
An ATA-66/100/133 peripheral device

An ATA-66/100/133 compatible cable
ATA-66/100/133 operating system device drivers
NOTE
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master
device. For example, do not connect an ATA hard drive as a slave to an ATAPI
CD-ROM drive.
3.4
System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing

computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
BIOS data, such as the BIOS revision level

Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems, such as Windows NT*, require an additional
interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table
interface for such operating systems. Using this support, an SMBIOS service-level
application running on a non-Plug and Play operating system can obtain the SMBIOS
information.
81
3.5
Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating
systems USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating systems
installation instructions.
3.6
BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
Intel Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a thumb drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
Intel Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a thumb
drive or a USB hard drive), or a CD-ROM.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.
82
Refer to
The Intel World Wide Web site
3.6.1
Language Support
The BIOS Setup program and help messages are supported in US English. Additional
languages are available in the Integrators Toolkit utility. Check the Intel website for
details.
3.6.2
Custom Splash Screen
During POST, an Intel splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Integrators Toolkit that is available
from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
3.7
Refer to
The Intel World Wide Web site
BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption

occurs, the BIOS could be damaged. Table 39 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 39. Acceptable Drives/Media Types for BIOS Recovery
Media Type
Can be used for BIOS recovery?
CD-ROM drive connected to the Parallel ATA interface
Yes
CD-ROM drive connected to the Serial ATA interface
Yes
USB removable drive (a USB Thumb Drive, for example)
Yes
USB diskette drive (with a 1.44 MB diskette)
No
USB hard disk drive
No
Legacy diskette drive (with a 1.44 MB diskette) connected to the

legacy diskette drive interface
No
Refer to
BIOS recovery
http://support.intel.com/support/motherboards/desktop
83
3.8
Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard
drives, CD-ROM, or the network. The default setting is for the diskette drive to be the
first boot device, the hard drive second, and the ATAPI CD-ROM third. The fourth
device is disabled.
3.8.1
CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM

format specification. Under the Boot menu in the BIOS Setup program, ATAPI CDROM is listed as a boot device. Boot devices are defined in priority order. Accordingly,
if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot
from the next defined drive.
3.8.2
Network Boot
The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.8.3
Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
Video adapter
Keyboard
Mouse
3.8.4
Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices (as set in the BIOS setup programs
Boot Device Priority Submenu). Table 40 lists the boot device menu options.
Table 40. Boot Device Menu Options
84
Boot Device Menu Function Keys
Description
<> or <>
Selects a default boot device
<Enter>
Exits the menu, saves changes, and boots from the selected
device
<Esc>
Exits the menu without saving changes
3.9
Adjusting Boot Speed
These factors affect system boot speed:
Selecting and configuring peripherals properly

Optimized BIOS boot parameters
3.9.1
Peripheral Selection and Configuration
The following techniques help improve system boot speed:
Choose a hard drive with parameters such as power-up to data ready less than
eight seconds, that minimize hard drive startup delays.
Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
3.9.2
BIOS Boot Optimizations
Use of the following BIOS Setup program settings reduces the POST execution time.
In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced
Menu in the Drive Configuration Submenu of the BIOS Setup program).
85
3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
For enhanced security, use different passwords for the supervisor and user
passwords.
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 41 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 41. Supervisor and User Password Functions
Password
During
Boot
None
None
None
Can change a
Supervisor Password
limited number
of options
Supervisor
None
N/A
Can change all

options
User
User
Can change all

options
Can change a
Supervisor Password
limited number Enter Password
of options
Supervisor or
user
Supervisor or
user
Supervisor
Mode
User Mode
Neither
Can change all

options (Note)
Can change all

options (Note)
Supervisor
only
Can change all

options
User only
Supervisor
and user set
Note:
86
Setup Options
Password
to Enter
Setup
Password
Set
Enter Password
Clear User Password
If no password is set, any user can change all Setup options.
Error Messages and Beep Codes

4.1
4.2
4.3
4.4
Speaker ......................................................................................... 87
BIOS Beep Codes ............................................................................ 87
Port 80h POST Codes ....................................................................... 88
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information
during POST.
Refer to
The location of the onboard speaker
Figure 1, page 14
4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS displays an error
message describing the problem (see Table 42).
Table 42. Beep Codes
Type
Pattern
Frequency
Memory error
Three long beeps
1280 Hz
Thermal warning
Four alternating beeps:
High tone: 2000 Hz
High tone, low tone, high tone, low tone
Low tone: 1600 Hz
4.3 BIOS Error Messages

Table 43 lists the error messages and provides a brief description of each.
Table 43. BIOS Error Messages
Error Message
Explanation
CMOS Battery Low
The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad
The CMOS checksum is incorrect. CMOS memory may have been

corrupted. Run Setup to reset values.
Memory Size Decreased
Memory size has decreased since the last boot. If no memory

was removed then memory may be bad.
No Boot Device Available
System did not find a device to boot.
87
4.4 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST-codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the
BIOS:
Table 44 lists the Port 80h POST code ranges

Table 45 lists the Port 80h POST codes themselves
Table 46 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 44. Port 80h POST Code Ranges
Range
Category/Subsystem
00 0F
Debug codes: Can be used by any PEIM/driver for debug.
10 1F
Host Processors: 1F is an unrecoverable CPU error.
20 2F
Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 3F
Recovery: 3F indicated recovery failure.
40 4F
Reserved for future use.
50 5F
I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 6F
Reserved for future use (for new busses).
70 7F
Output Devices: All output consoles. 7F is an unrecoverable error.
80 8F
Reserved for future use (new output console codes).
90 9F
Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 AF
Reserved for future use (new input console codes).
B0 BF
Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 CF
Reserved for future use.
D0 DF
Boot device selection.
E0 FF
F0 FF: FF processor exception.

E0 EE: Miscellaneous codes. See Table 45.
EF boot/S3: resume failure.
88
Table 45. Port 80h POST Codes

POST Code
Description of POST Operation

Host Processor
10
Power-on initialization of the host processor (Boot Strap Processor)
11
Host processor Cache initialization (including APs)
12
Starting Application processor initialization
13
SMM initialization
21
Initializing a chipset component
Chipset
Memory
22
Reading SPD from memory DIMMs
23
Detecting presence of memory DIMMs
24
Programming timing parameters in the memory controller and the DIMMs
25
Configuring memory
26
Optimizing memory settings
27
Initializing memory, such as ECC init
28
Testing memory
50
Enumerating PCI busses
51
Allocating resources to PCI bus
PCI Bus
52
Hot Plug PCI controller initialization
53 57
Reserved for PCI Bus

USB
58
Resetting USB bus
59
Reserved for USB

ATA/ATAPI/SATA
5A
Resetting PATA/SATA bus and all devices
5B
Reserved for ATA

SMBus
5C
Resetting SMBUS
5D
Reserved for SMBUS

Local Console
70
Resetting the VGA controller
71
Disabling the VGA controller
72
Enabling the VGA controller

Remote Console
78
Resetting the console controller
79
Disabling the console controller
7A
Enabling the console controller
continued
89
Table 45. Port 80h POST Codes (continued)

POST Code

Keyboard (PS2 or USB)
90
Resetting keyboard
91
Disabling keyboard
92
Detecting presence of keyboard
93
Enabling the keyboard
94
Clearing keyboard input buffer
95
Instructing keyboard controller to run Self Test (PS2 only)

Mouse (PS2 or USB)
98
Resetting mouse
99
Disabling mouse
9A
Detecting presence of mouse
9B
Enabling mouse
Fixed Media
B0
Resetting fixed media
B1
Disabling fixed media
B2
Detecting presence of a fixed media (IDE hard drive detection etc.)
B3
Enabling/configuring a fixed media

Removable media
B8
Resetting removable media
B9
Disabling removable media
BA
Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC
Enabling/configuring a removable media
Dy
Trying boot selection y (y=0 to 15)
BDS
PEI Core
E0
Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN

EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2
Permanent memory found
E1, E3
Reserved for PEI/PEIMs

DXE Core
E4
Entered DXE phase
E5
Started dispatching drivers
E6
Started connecting drivers
continued
90
Table 45. Port 80h POST Codes (continued)

POST Code

DXE Drivers
E7
Waiting for user input
E8
Checking password
E9
Entering BIOS setup
EB
Calling Legacy Option ROMs
F4
Entering Sleep state
F5
Exiting Sleep state
Runtime Phase/EFI OS Boot
F8
EFI boot service ExitBootServices ( ) has been called
F9
EFI runtime service SetVirtualAddressMap ( ) has been called
FA
EFI runtime service ResetSystem ( ) has been called
30
Crisis Recovery has initiated per User request
31
Crisis Recovery has initiated by software (corrupt flash)
34
Loading recovery capsule
35
Handing off control to the recovery capsule
3F
Unable to recover
PEIMs/Recovery
91
Table 46. Typical Port 80h POST Sequence
92
POST Code
Description
21
Initializing a chipset component
22
Reading SPD from memory DIMMs
23
Detecting presence of memory DIMMs
25
Configuring memory
28
Testing memory
34
Loading recovery capsule
E4
Entered DXE phase
12
Starting Application processor initialization
13
SMM initialization
50
Enumerating PCI busses
51
Allocating resourced to PCI bus
92
Detecting the presence of the keyboard
90
Resetting keyboard
94
95
Keyboard Self Test
EB
Calling Video BIOS
58
Resetting USB bus
5A
92
Detecting the presence of the keyboard
90
Resetting keyboard
94
5A
28
Testing memory
90
Resetting keyboard
94
E7
Waiting for user input
01
INT 19
00
Ready to boot
Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance..................................................................... 93
5.2 Battery Disposal Information............................................................101
5.1
Regulatory Compliance
This section contains the following regulatory compliance information for Desktop
Board DQ965GF:
5.1.1
Safety regulations
European Union Declaration of Conformity statement
Product Ecology statements
Electromagnetic Compatibility (EMC) regulations
Product certification markings
Safety Regulations
Desktop Board DQ965GF complies with the safety regulations stated in Table 47 when
correctly installed in a compatible host system.
Table 47. Safety Regulations
Regulation
Title
UL 60950-1:2003/
Information Technology Equipment Safety - Part 1: General

Requirements (USA and Canada)
CSA C22.2 No. 60950-1-03

EN 60950-1:2002

Requirements (European Union)
IEC 60950-1:2001, First Edition

Requirements (International)
93
5.1.2
European Union Declaration of Conformity

Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel
Desktop Board DQ965GF is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
89/336/EEC (EMC Directive) and Council Directive 73/23/EEC (Safety/Low Voltage
Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 89/336/EEC and
73/23/EEC.
etina Tento vrobek odpovd poadavkm evropskch smrnic 89/336/EEC a
73/23/EEC.
Dansk Dette produkt er i overensstemmelse med det europiske direktiv
89/336/EEC & 73/23/EEC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
89/336/EEC & 73/23/EEC.
Eesti Antud toode vastab Euroopa direktiivides 89/336/EEC ja 73/23/EEC kehtestatud
nuetele.
Suomi Tm tuote noudattaa EU-direktiivin 89/336/EEC & 73/23/EEC mryksi.
Franais Ce produit est conforme aux exigences de la Directive Europenne
89/336/EEC & 73/23/EEC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europischen Richtlinie
89/336/EEC & 73/23/EEC.

89/336/ 73/23/.
Magyar E termk megfelel a 89/336/EEC s 73/23/EEC Eurpai Irnyelv elrsainak.
Icelandic essi vara stenst regluger Evrpska Efnahags Bandalagsins nmer
89/336/ EEC & 73/23/EEC.
Italiano Questo prodotto conforme alla Direttiva Europea 89/336/EEC &
73/23/EEC.
Latvieu is produkts atbilst Eiropas Direktvu 89/336/EEC un 73/23/EEC
noteikumiem.
Lietuvi is produktas atitinka Europos direktyv 89/336/EEC ir 73/23/EEC
nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 89/336/EEC
u 73/23/EEC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
89/336/ EEC & 73/23/EEC.
94
Regulatory Compliance and Battery Disposal Information
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej

89/336/EWG i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Europia 89/336/EEC &
73/23/EEC.
Espaol Este producto cumple con las normas del Directivo Europeo 89/336/EEC &
73/23/EEC.
Slovensky Tento produkt je v slade s ustanoveniami eurpskych direktv
89/336/EEC a 73/23/EEC.
Slovenina Izdelek je skladen z dolobami evropskih direktiv 89/336/EGS in
73/23/EGS.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 89/336/EEC &
73/23/EEC.
Trke Bu rn, Avrupa Birliinin 89/336/EEC ve 73/23/EEC ynergelerine uyar.
95
5.1.3
Product Ecology Statements
The following information is provided to address worldwide product ecology concerns

and regulations.
5.1.3.1
Disposal Considerations
This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2
Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the

Intel Product Recycling Program to allow retail consumers of Intels branded products
to return used products to select locations for proper recycling.
Please consult the
http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
Intel Product Recycling Program
http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
Deutsch
Als Teil von Intels Engagement fr den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermglicht, gebrauchte Produkte an ausgewhlte Standorte fr
ordnungsgemes Recycling zurckzugeben.
Details zu diesem Programm, einschlielich der darin eingeschlossenen Produkte,
verfgbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
Espaol
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
para ver los detalles del programa, que incluye los productos que abarca, los lugares
disponibles, instrucciones de envo, trminos y condiciones, etc.
96
Franais
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en uvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits uss en les retournant des adresses spcifies.
Visitez la page Web
http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm pour en savoir
plus sur ce programme, savoir les produits concerns, les adresses disponibles, les
instructions d'expdition, les conditions gnrales, etc.
http://www.intel.com/intel
/other/ehs/product_ecology/Recycling_Program.htm
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
untuk mendapatkan butir-butir program ini, termasuklah skop produk yang
dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos so reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
(em Ingls) para obter os detalhes sobre este programa, inclusive o escopo dos
produtos cobertos, os locais disponveis, as instrues de envio, os termos e
condies, etc.
Russian
, Intel
Intel (Product Recycling Program)
Intel

.
, -
, , ,
, ..
97
Trke
Intel, evre sorumluluuna bamllnn bir paras olarak, perakende tketicilerin
Intel markal kullanlm rnlerini belirlenmi merkezlere iade edip uygun ekilde geri
dntrmesini amalayan Intel rnleri Geri Dnm Programn uygulamaya
koymutur.
Bu programn rn kapsam, rn iade merkezleri, nakliye talimatlar, kaytlar ve
artlar v.s dahil btn ayrntlarn grenmek iin ltfen
Web sayfasna gidin.
5.1.3.3
Lead Free Desktop Board
This desktop board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance
and/or reliability. This desktop board is referred to as Lead-free second level
interconnect. The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free. Table 48 shows the various
forms of the Lead-Free 2nd Level Interconnect mark as it appears on the board and
accompanying collateral.
Table 48. Lead-Free Board Markings
Description
Mark
nd
Lead-Free 2 Level
Interconnect: This symbol is
used to identify electrical and
electronic assemblies and
components in which the lead
(Pb) concentration level in the
desktop board substrate and the
solder connections from the board
to the components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).
or
or
98
5.1.4
EMC Regulations
Desktop Board DQ965GF complies with the EMC regulations stated in Table 49 when
correctly installed in a compatible host system.
Table 49. EMC Regulations
Regulation
Title
FCC Class B
Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B,

Radio Frequency Devices. (USA)
ICES-003 (Class B)
Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022: 1998 (Class B)
Limits and methods of measurement of Radio Interference Characteristics

of Information Technology Equipment. (European Union)
EN55024: 1998
Information Technology Equipment Immunity Characteristics Limits and

methods of measurement. (European Union)
AS/NZS CISPR 22
(Class B)
Australian Communications Authority, Standard for Electromagnetic

Compatibility. (Australia and New Zealand)
CISPR 22, 3rd Edition,

(Class B)
Limits and methods of measurement of Radio Disturbance Characteristics of

Information Technology Equipment. (International)
CISPR 24: 1997
Information Technology Equipment Immunity Characteristics Limits and

Methods of Measurement. (International)
VCCI (Class B)
Voluntary Control for Interference by Information Technology Equipment.

(Japan)
Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.
99
Korean Class B statement translation: this is household equipment that is certified to

comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.
5.1.5
Product Certification Markings (Board Level)
Desktop Board DQ965GF has the product certification markings shown in Table 50:
Table 50. Product Certification Markings
Description
Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file

number for Intel desktop boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment. Includes
Intel name and DQ965GF model designation.
CE mark. Declaring compliance to European Union (EU) EMC directive

(89/336/EEC) and Low Voltage directive (73/23/EEC).
Australian Communications Authority (ACA) C-tick mark. Includes adjacent

Intel supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea MIC (Ministry of Information and Communication) mark.

Includes adjacent MIC certification number: CPU-DQ965GF
For information about MIC certification, go to
http://support.intel.com/support/motherboards/desktop/
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.
Printed wiring board manufacturers recognition mark. Consists of a unique
UL recognized manufacturers logo, along with a flammability rating (solder
side).
100
V-0
5.2
Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usage est remplace par une pile de type incorrect. Les
piles usages doivent tre recycles dans la mesure du possible. La mise au rebut des
piles usages doit respecter les rglementations locales en vigueur en matire de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
br om muligt genbruges. Bortskaffelse af brugte batterier br foreg i
overensstemmelse med gldende miljlovgivning.
OBS!
Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
br kastes i henhold til gjeldende miljlovgivning.
VIKTIGT!
Risk fr explosion om batteriet erstts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljvrdsbestmmelserna.
VARO
Rjhdysvaara, jos pariston tyyppi on vr. Paristot on kierrtettv, jos se on
mahdollista. Kytetyt paristot on hvitettv paikallisten ympristmrysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
101
PRECAUCIN
Existe peligro de explosin si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENO
Haver risco de exploso se a bateria for substituda por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminao de baterias
usadas deve ser feita de acordo com as regulamentaes ambientais da regio.
ACIAROZNA
, .
, , .
.
UPOZORNN
V ppad vmny baterie za nesprvn druh me dojt k vbuchu. Je-li to mon,
baterie by mly bt recyklovny. Baterie je teba zlikvidovat v souladu s mstnmi
pedpisy o ivotnm prosted.

.
.
.
VIGYAZAT
Ha a telepet nem a megfelel tpus telepre cserli, az felrobbanhat. A telepeket
lehetsg szerint jra kell hasznostani. A hasznlt telepeket a helyi krnyezetvdelmi
elrsoknak megfelelen kell kiselejtezni.
102
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEENIE
Istnieje niebezpieczestwo wybuchu w przypadku zastosowania niewaciwego typu
baterii. Zuyte baterie naley w miar moliwoci utylizowa zgodnie z odpowiednimi
przepisami ochrony rodowiska.
PRECAUIE
Risc de explozie, dac bateria este nlocuit cu un tip de baterie necorespunztor.
Bateriile trebuie reciclate, dac este posibil. Depozitarea bateriilor uzate trebuie s
respecte reglementrile locale privind protecia mediului.
.
.
, .
UPOZORNENIE
Ak batriu vymente za nesprvny typ, hroz nebezpeenstvo jej vbuchu.
Batrie by sa mali poda monosti vdy recyklova. Likvidcia pouitch batri sa mus
vykonva v slade s miestnymi predpismi na ochranu ivotnho prostredia.
POZOR
Zamenjava baterije z baterijo druganega tipa lahko povzroi eksplozijo.
e je mogoe, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
UYARI
Yanl trde pil takldnda patlama riski vardr. Piller mmkn olduunda geri
dntrlmelidir. Kullanlm piller, yerel evre yasalarna uygun olarak atlmaldr.
O
, .
, .
, .
103
104

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Intel Desktop Board

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE,

What This Document Contains

A description of the hardware used on the board

A map of the resources of the board

The features supported by the BIOS Setup program

Regulatory compliance and battery disposal information

Notes, Cautions, and Warnings

Intel Desktop Board DQ965GF Technical Product Specification

Other Common Notation

Used after a signal name to identify an active-low signal (such as USBP0#).

Gigabyte (1,073,741,824 bytes)

Gigabytes per second

Gigabit (1, 073,741,824 bits)

Kilobyte (1024 bytes)

Kilobit (1024 bits)

1000 bits per second

Megabyte (1,048,576 bytes)

Megabytes per second

Megabit (1,048,576 bits)

Megabits per second

An address or data value ending with a lowercase h indicates a hexadecimal value.

Volts. Voltages are DC unless otherwise specified.

Intel Desktop Board DQ965GF Technical Product Specification

3 Overview of BIOS Features

4 Error Messages and Beep Codes

5 Regulatory Compliance and Battery Disposal Information

Major Board Components..................................................................

Intel Desktop Board DQ965GF Technical Product Specification

Intel Desktop Board DQ965GF Technical Product Specification

What This Chapter Contains

Intel Desktop Board DQ965GF Technical Product Specification

Table 1 summarizes the major features of the Desktop Board DQ965GF.

Support for the following:

Intel Q965 Express Chipset, consisting of:

Intel GMA 3000 onboard graphics subsystem

Legacy I/O Control

Support for USB 2.0 devices

Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82566DM

Intel BIOS (resident in the SPI Flash device)

A component that enhances platform security

Table 1. Feature Summary (continued)

Support for PCI Local Bus Specification Revision 2.3

Two PCI Conventional* bus connectors

Intel Quiet System Technology implemented through the ICH8

One PCI Express x1 bus add-in card connector

Voltage sense to detect out of range power supply voltages

Provides remote management, improved security, and energy-efficient

Table 2 describes the manufacturing options. Not every manufacturing option is

Back panel PS/2 ports for mouse and keyboard connection

For information about

Available configurations for the Desktop Board DQ965GF

Section 1.2, page 17

Intel Desktop Board DQ965GF Technical Product Specification

Figure 1 shows the location of the major components.

Figure 1. Major Board Components

Table 3. Board Components Shown in Figure 1

Front panel audio header

PCI Conventional bus add-in card connector 1

PCI Express x1 connector

PCI Express x16 connector

Back panel connectors

Processor core power connector