Electronic Packaging - MAE 14:650:478

Dr. Saxena

(LSAXENA@rci.rutgers.edu)

Homework #11
(Submission on SAKAI preferred; can also email assignment or submit in class)

Thermal Conductivities in W/ C m:
Silicon = 135
Copper = 380;
Epoxy = 0.26;
Silver Filled Epoxy = 2.6
A silicon chip (10mm x 10mm x 0.5mm) is mounted at the center of a square glass epoxy PC
board (100mm x 100mm x 2mm). It is attached to the PC board with the help of conductive epoxy
0.05 mm thick.
The chip is encapsulated on the top by a thick glob of non-conductive material, essentially
insulating it thermally on the top.
The PC board has a layer of copper 0.05 mm thick in the center of the board.
1. Draw the heat path from the top of the silicon chip where the heat is generated to the
outside air.
2. What is the thermal resistance of each of the following paths:
a)
b)
c)
d)

from the top of silicon chip to the bottom of the chip

from bottom of silicon chip to top of PC board
from top of PC board to the copper plane in the center of the PC board
The spreading resistance on the PC board: from chip to the edge of the PC
board.

If the chip dissipates 5W of power, and the convective heat coefficient from the PC board to the
air is 10 W/C per sq meter, and the air temp is 50C. What is the device (silicon) junction
temperature (as a first approximation)?
What changes one would make to lower the silicon junction temperature?