Single crystal silicon is commonly used for microelectromechanical systems (MEMS) due to its mechanical and electrical properties. It is a very stiff material, requiring thinning to achieve appreciable strain for MEMS. Single crystal silicon has anisotropic properties that impact its electrical, thermal, mechanical, and chemical behavior. Etching techniques, including isotropic and anisotropic etching, are used to bulk micromachine single crystal silicon into cavity structures and cantilevers for MEMS.
Single crystal silicon is commonly used for microelectromechanical systems (MEMS) due to its mechanical and electrical properties. It is a very stiff material, requiring thinning to achieve appreciable strain for MEMS. Single crystal silicon has anisotropic properties that impact its electrical, thermal, mechanical, and chemical behavior. Etching techniques, including isotropic and anisotropic etching, are used to bulk micromachine single crystal silicon into cavity structures and cantilevers for MEMS.
Single crystal silicon is commonly used for microelectromechanical systems (MEMS) due to its mechanical and electrical properties. It is a very stiff material, requiring thinning to achieve appreciable strain for MEMS. Single crystal silicon has anisotropic properties that impact its electrical, thermal, mechanical, and chemical behavior. Etching techniques, including isotropic and anisotropic etching, are used to bulk micromachine single crystal silicon into cavity structures and cantilevers for MEMS.