Purpose:

Find the stress and strain (maximum and minimum) among nine proposed
model caused by thermal cycling and bending load. These stress and strain along
with mismatch CTE (coefficient of thermal expansion) has adverse effect on total
package reliability.
Methodology:
In this paper design methodology is generic and comprises Finite Element
Analysis (FEA), a numeric technique for computational modeling. Output result of
stress and strain was used for statistical analysis and optimization. This
computational method eliminates high cost of real life destructive testing. For
thermal condition we followed JESD22-A104C (-55C to +125 C) with a duration of
12 minutes for a single cycle. Those packages subjected to accelerated thermal
cyclic and mechanical bend condition.