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  • Standard Process Flow

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    clementi
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    This document provides the standard process flow and bill of materials for wafer-level chip scale packages (WLCSP). It outlines the receiving, inspection, mounting, backgrinding, dicing, marking, curing, and quality assurance steps. Key steps include wafer taping, pick and place of dies, optical inspection, laser marking, and reverse flow UV curing before final testing and batch outs. Laser marking and backgrinding are optional steps in the process.

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    Standard Process Flow

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    This document provides the standard process flow and bill of materials for wafer-level chip scale packages (WLCSP). It outlines the receiving, inspection, mounting, backgrinding, dicing, marking, curing, and quality assurance steps. Key steps include wafer taping, pick and place of dies, optical inspection, laser marking, and reverse flow UV curing before final testing and batch outs. Laser marking and backgrinding are optional steps in the process.

    Copyright:

    © All Rights Reserved
    Download as PPT, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as ppt, pdf, or txt
    28 views1 page

    Standard Process Flow

    Uploaded by

    clementi
    This document provides the standard process flow and bill of materials for wafer-level chip scale packages (WLCSP). It outlines the receiving, inspection, mounting, backgrinding, dicing, marking, curing, and quality assurance steps. Key steps include wafer taping, pick and place of dies, optical inspection, laser marking, and reverse flow UV curing before final testing and batch outs. Laser marking and backgrinding are optional steps in the process.

    Copyright:

    © All Rights Reserved
    Download as PPT, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as ppt, pdf, or txt
    of 1

    TITLE : STANDARD PROCESS FLOW AND BOM FOR SCS WAFER PROCESS

    DOC NO : AP080052QP
    FORM REV 4
    Page1/1

    STANDARD PROCESS FLOW FOR WLCSP


    Off-shore lots
    receiving to Die Bank

    Wafer from die bank


    (in-house lots from WS or WP)

    Wafer Mount
    AP0800124WI

    IQA Wafer Inspection


    QP090011WI

    Wafer Taping
    AP080044WI

    Backgrind
    AP080045WI

    Pick & Place


    TNR
    AP0800128WI

    OCR Wafer
    ID/Linking
    AP0800025QP

    Pick & Place


    Waffle Pak
    AP0800128WI

    Wafer Saw
    AP0800186QP
    Outgoing QA
    QP090050WI

    Mfg 2nd Optical


    AP0800143WI

    REVERSE
    UV Cure, Detaping FLOW
    AP080124WI

    Laser Mark
    AP080137WI

    Laser Mark
    AP080137WI

    QA 2nd Optical
    QP090038WI

    EOL Batch Out

    UV Cure, Detaping
    AP080124WI

    COMPANY PRIVATE
    052_12f_rev4_Standard Process Flow-WLCSP
    STATS ChipPAC LTD.
    Any hardcopy printout of this document is uncontrolled unless it bears DCC controlled stamp except for forms only.

    Note :
    Laser Mark and Backgrind are
    OPTIONAL

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