Simulation Report

Company

Author
Edgardo Anaya
Date
Monday, April 07, 2014
Software Used
Solid Edge ST(105.00.00.102 x64)
Femap (10.3.1)
Solver Used
NX Nastran (8.1)

1. Introduction
Dentro del presente reporte se detallan los resultados de la simulacin de transferencia de
calor en Solid Edge de un sistema tarjeta impresa-chip.

2. Study Properties
Study Property

Value

Study name
Study Type
Mesh Type
Iterative Solver
NX Nastran Geometry Check
NX Nastran command line
NX Nastran study options
NX Nastran generated options
NX Nastran default options

Lab_Transferencia_de_calor
Steady State Heat Transfer
Tetrahedral
On
On

Thermal Load Options

RadiationEnclosure Ambient Element
Free ConvectionAlternate Formulation
Convection Exponent
Surface results only option

0.00
No
0.00
On

3. Study Geometry
3.1 Solids
Solid Name Material

Mass

Volume

Weight

Pieza 2.par:1 Silicone (Assembly)

0.000 kg 0.000 mm^3 0.00 N

Pieza 1.par:1 ABS Plastic, medium impact (Assembly) 0.000 kg 0.000 mm^3 0.00 N

4. Material Properties
4.1 ABS Plastic, medium impact
Property

Value

Density
Coef. of Thermal Exp.
Thermal Conductivity
Specific Heat
Modulus of Elasticity
Poisson's Ratio
Yield Stress
Ultimate Stress
Elongation %

1024.000 kg/m^3
0.000058 /C
0.002 kW/m-C
0.000 J/kg-C
2275.270 MegaPa
0.400
43.437 MegaPa
0.000 MegaPa
0.000

4.2 Silicone
Property

Value

Density
1110.000 kg/m^3
Coef. of Thermal Exp. 0.000081 /C
Thermal Conductivity 0.000 kW/m-C

Specific Heat
Modulus of Elasticity
Poisson's Ratio
Yield Stress
Ultimate Stress
Elongation %

0.000 J/kg-C
0.000 MegaPa
0.000
0.000 MegaPa
0.000 MegaPa
0.000

5. Loads
Load Name Load Type

Temp1

Thermal
Temperature

Conv_chip

Convection

Conv_pcb

Convection

Heat_source

Heat
Generation

Load
Distribution

Load Value

Load
Direction

Load
Direction
Option

Positive

Normal to
face

Positive

Normal to
face

25 C
Film Coefficient =24
W/m^2-K, Ambient
Temperature =30 C
Film Coefficient =19
W/m^2-K, Ambient
Temperature =25 C
5W

Total

6. Connector
Connector
Name

Connector
Type

Search
Distance

Conector 1

Glue

0.17 mm

Minimum
Search Distance

Coefficient Of
Static Friction

Penalty
Value
100.00

7.Results
7.1 Thermal

Result component: Temperature

Value X
Y
Z

Extent
Minimum 25 C
Maximum 109 C

25.000 mm 100.000 mm 10.000 mm

-3.125 mm -70.937 mm 13.000 mm