IC FABRICATION TECHNIQUES

Course introduction
Lecturer: Ho Ngoc Diem

UIT

Course introduction
Content:
- Processing steps of semiconductor device fabrication
- Crystal growth, wafer fabrication and properties of silicon wafers
- Testing and assembly

References:
1.
2.
3.

Introduction to Microelectronic Fabrication, Richard C. Jaeger , 2nd edition,

2002, Prentice Hall
Introduction to Microfabrication, Sami Franssila, 2004, Wiley, 401 pages.
Silicon Processing for the VLSI Era Vol. 1, S.Wolf, R.N Tauber, 2nd
Edition, Pearson, 2000.

Course website: https://courses.uit.edu.vn/

Lecturer:
Ho Ngoc Diem - Email: diemhn@uit.edu.vn

9/10/2015

IC fabrication techniques

Requirement
Course meeting: Thursday, from 7:30 to 9:45
Grading:
- Midterm exam:
- Final exam:
- Homework/Presentation/Project:

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IC fabrication techniques

25%
50%
25%

Agenda

Chapter 1: Overview
Chapter 2: Lithography
Chapter 3: Etching techniques
Chapter 4: Thermal Oxidation of Si
Chapter 5: Doping techniques
Chapter 6: Film growth/deposition
Chapter 7: Interconnection and contacts
Chapter 8: Packaging and Yield
Chapter 9: Process for MEMS

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IC fabrication techniques

List of presentation topics

Integration processing: CMOS

45nm semiconductor technology
22nm semiconductor technology
Assembly & Packaging: SO, SOP, SOJ, TSOP (58%),
QFP/PLCC (19%), DIP (13%)
Test equipment: Ellipsometer, Profilometer, TEM, SEM
Semiconductor industry
And more
(Starting in week 4)

9/10/2015

IC fabrication techniques