INTRODUCTION TO IC

ASSEMBLY AND
PACKAGING PROCESS
By EZAD RAZIF B AHMAT ROZALI

LEARNING OUTCOMES
Explain the importance of IC assembly
and packaging process
Identify some of the IC packages
State some of factors considered in
todays trend of packaging

INTRODUCTION
IC assembly is the most important first
step in the use of an IC which will go
through a number of process steps before
it can be used in an electronic system.
Nowadays, assembly process is working
towards developing smaller, cheaper,
more reliable and more environmentfriendly packages.

WHAT IS IC
ASSEMBLY
????

WHAT is IC ASSEMBLY???
The 1st process step after wafer fabrication
& test
IC assembly is defined as the process of
electrically connecting I/O bond pads on
the IC to the corresponding bond pads on
the package.

WHAT is IC ASSEMBLY???

Three interfaces:

(1) Metallurgical bond pad interface on the IC

(2) Metallurgical bond pad interface on the package
(3) Electrical interconnection between these two interfaces

PURPOSE of IC ASSEMBLY
Enable an IC to be electrically interconnected to the
package, and to allow that IC to be handled, tested and
burnt-in to guarantee the quality of the IC.
PRIMARY purpose enable ICs to be interconnected
with rest of the system;cell phone, computer, industrial
controller..

PURPOSE of IC ASSEMBLY

3 Primary functions of IC assembly:

i.

To provide signal and power distribution of the

packaged IC to the system.

ii.

To provide mechanical support and robustness to

fragile IC

iii.

To provide environmental protection of the IC

IC ASSEMBLY and PACKAGING

PROCESS

IC PACKAGES

TRENDS in PACKAGING
1st Generation LEADFRAME packaging
2nd Generation Wirebond Ball Grid Array(BGA)
3rd Generation Flip Chip and 3D SiPs

Find the
picture of
all
trends???

4th Generation Combine with wireless, optical and

MEM devices
Future trends are focus on smaller, reliable, higher
thermal dissipation capability and environment friendly
packaging

UNIT 2
IC ASSEMBLY
PROCESS FLOW

IC ASSEMBLY PROCESS
FLOW