OSP reaction mechanism

Organic film is formed by azole compound in OSP material.

WPF106A and WPF15 have benz-imidazole ,KESTER has imidazole and triazole

N N N

R R N

NH NH
NH
benz-imidazole imidazole triazole
*note: R means branched chain, and is different between each OSP materials

Reaction mechanism»
azole compounds adsorption (2) Hydrogen(proton) elimination
on exposed copper surface and dehydration
N N N
N N N
R R R + H2
R R R
N- N- N-
NH NH NH Cu+ Cu+ Cu+

copper land copper land

 OSP reaction mechanism
chelate formation (4) Organic film formation

N: N: N: N: N: N:

R R R R R R
N- N- N- N
N N
Cu+ Cu+ Cu+ Cu++ Cu++ Cu++

copper land N: N:
N:

R R R
N N N
Cu+ Cu+ Cu+

copper land

Copper chelate is formed by Cu2+ in OSP mater

or Copper surface on PWB
KESTER has no Cu2+