R.M.K.

COLLEGE OF ENGINEERING AND TECHNOLOGY

R.S.M NAGAR, PUDUVOYAL-601206
4th Semester B.E.
First Internal Assessment Test February 2013
Sub. Title : LINEAR INTEGRATED CIRCUITS and applications
Sub. Code : EE2254
Time
: 100 mts

Date
Branch
Max. Marks

: 06.02.2013
: EEE
: 50

Answer all questions

Part A - (5 x 2 = 10)
1.What is the need for burried layer in fabrication of monolithic integrated transistor?
2.Name the different types of IC packages
3. Define CMRR and slew rate.
4.Differentiate between thin film and thick film technology in IC fabrication.
5.What is thermal drift?
Part B - (2 x 16 & 1x8 = 40)
6.(a) (i)Explain the process of epitaxial growth and photolithography in IC fabrication process
with neat diagram

(8)

(ii)With neat sketches explain the fabrication of diodes.

(8)

Or
(b) (i) Discuss briefly the various steps involved in the fabrication of IC. Draw the layout of a
circuit by considering an example.

(10)

(ii) Explain the importance of isolation and discuss the different methods of Isolation
techniques

(6)

7.(a) Explain the different DC Characteristics of op-amp with the help of neat diagram

(16)

Or
(b) (i) Explain the frequency response and stability in AC characteristics of Op-amp

8.(a)Discuss in detail about the method of fabrication of monolithic transistor by monolithic

(16)

process.
(8)

Or
(b) List the different methods of integrated resistor fabrication and explain the diffused resistor in detail?
(8)