Synthesis of Pulse Electrodeposited Functionally Graded (Cu, Cu-SiC)

Nanocomposite on Annealed Copper

The surface of engineering materials plays an important role in their
performance. A functionally graded Copper (Cu), Copper- Silicon Carbide (Cu-SiC)
nanocomposite coatings have been prepared by pulse electrodeposition (PED)
techniques. A slow gradient of pure Cu has been deposited on annealed Cu by
employing optimized deposition parameters. It has been observed that
morphology of Cu changes significantly with the deposition parameters. Then CuSiC nanocomposite coating has been deposited on pure Cu coatings. An attempt
has been made to correlate the morphology of pure Cu as well as Cu-SiC coatings
with the deposition parameters. The hardness and wear properties of the
functionally graded nanocomposite coatings have been compared with those of
the Cu-SiC monolayer coating.