T801 Frequency Reference Module (01-00) Issue A Tait Service ManualM801-00 CONTENTS Page SECTION 1 GENERAL INFORMATION 1.1 Introduction La 1.2. Specifications 12 1.2.1 General 1.2 1.2.2 TF-4010A Rubidium Frequency Standard (If Fitted) 1.2 SECTION 2_ CONTROLS & OUTPUTS 2.1. Introduction 2d 2.2. Front Panel Controls 24 2.3. Rear Panel Inputs & Outputs 2.2 2.4 Monitoring And Status Indication 23 2.5 Local Control Of Frequency Offsets 23 2.6 Remote Control Of Frequency Offsets 2.8 2.7 Selection Of Internal Or External Frequency Standard 2.9 SECTION 3 OPERATING INSTRUCTIONS 3.1 SECTION 4 CIRCUIT DESCRIPTION 4 SECTION 5 TUNING & ADJUSTMENT 5.1 VCTCXO Alignment Sal 5.2. Calibration Of The Rubidium Standard a 5.2.1 General oa 5.2.2 Range Of Adjustment 5.2 5.2.3 Adjustment Procedure 5.2 SECTION 6 INSTALLATION 6.1 Mounting & Connection 6.1 6.2 Power Supply 6.1 6.3. Configuration 6.1 6.4 Fitting The Rubidium Standard 6.2 May 29/92 Page 5 Copyright TELMg01-00 SECTION 7 INTRODUCTION TO SERVICING 7.1 General 71 7.1.1 Notes 71 7.1.2 Technical Instructions 7 7.2. Mechanical 7 7.2.1 Pozidriv Recess Head Screws 7 7.3 Component Replacement 72 7.3.1 Leaded Components 72 7.3.1.1 Desoldering Iron Method 7.2 7.3.1.2 Component Cutting Method 72 SECTION 8 FAULT FINDING 8&1 Visual Checks al 8.2 General Faults 81 8.3 Lock Detect Conditions 81 3.4 Fault Finding Charts 8.2 8.4.1 All Loops Fail To Lock 8.2 B.2 df & df2 Loops Fail To Lock a3 SECTION 9__ PCB INFORMATION Parts Lists Grid Reference Index Using CAD Circuit Diagrams Parts List 220-01252-02 Grid Reference Index PCB Layout - Bottom Side PCB Layout - Top Side Circuit Diagram Wiring Diagram LIST OF ILLUSTRATIONS Figure 2.1. Front Panel Controls Figure 2.2 Rear Panel Inputs & Outputs Figure 4.1 T801 Circuit Block Diagram Figure 5.1 Rubidium Standard Adjustment Details Figure 7.1. Typical Anti-Static Bench Set-Up 21 22 41 52 71 TABLES Table 2.1 Use Of Offset Multiplier Switch Table 2.2 Frequency & ppm Offsets Table 2.3. D-Range Wiring For Remote Control Of Frequency Offsets May 29/92 Page 6 Copyright TELM801-00.General Information SECTION |__GENERAL INFORMATION 1_INTRODUCTION The T801 Frequency Reference Module is intended for use with T800 series base station equipment. Its function is to provide a high stability frequency source to which the synthesiser within the T800 base station can be locked. This will provide T800 transmitters with the frequency stability required for simulcast transmission. The master standard within the T801 is primarily intended to be rubidium, although high quality ovenised crystal oscillators can also be used in applications where more frequent readjustment of frequency is acceptable. ‘The T801 converts the output frequency from its master standard to the 12.8MHz required by the T800 base station. ‘Small frequency offsets with a minimum step size of 4.3x10-9 can be programmed to allow the elimination of static nulls in the coverage overlap area of two or more simulcast transmitters. May 29/92 Page Lt Copyright TELM801-00 General Information 1.2 _ SPECIFICATIONS 1.2.1 GENERAL Input Supply Voltage ++ 410.8 to +16V DC Operating Temperature Range + “10°C to +55°C ambient Input Supply Current: No Internal Standard + 1A peak, 150mA typical TF-4O10A Rubidium Standard... 4A peak, 1.6A typical Note: The current is at maximum at switch-on, but settles to approximately L.6A at 13.8V and room temperature with the internal rubidium standard. df1* And df2* Outputs: Output Amplitude ++ 43dBm 31.54Bm, 50 ohms Harmonic Distortion /=-15dBm, ' 1 ' termes Too sits |—f 6 abe [8 et ote DH 7 p> >| an vmopenmmaum [TBA ros fn Tee [Ta } ont es Figure 4.1 TR01 Block Diagram igure 4.1 shows the T801 circuitry. There are three PLL synthesisers and the two offset loops (df1 and df2) are locked to the frequency standard via the reference PLL. ‘The reference synthesiser divides the frequency standard output frequency down to a reference of 847.4576271Hz. This is multiplied by the synthesiser to 12,79915254MHz which is then used as a reference for the offset loops (df and f2). May 29/92 Page 4.1 Copyright TELM801-00 Circuit Description To achieve the required fine offsets, the offset loops first divide the reference signal by N-1, then multiply it by N. If N is incremented by 1, then it can be shown that the incremental change in output frequency closely approximates 1/N? of that frequency. If N = 15104, then the output frequency is 12.8MHz, i.e. no frequency offset. For this value of N, the incremental offset is 4.383x10-9, which equates to 4.21Hz at a transmitter frequency of 960MHz, or 0.289Hz at 66MHz. The frequency offsets are defined by codes on hex switches SWI to SW4. The codes are divided into two equal regions, 0 to 127 (00 to 7F) and 128 to 255 (80 to. FF). The first region directly equates to the synthesiser division ratio N+(0 to 127) and provides a negative offset. The second region (80 to FF) equates to N-(0 to 127) and provides a positive offset. The offsets can be multiplied by a factor of 10 by using the multiplier switch, sw5. The full range of possible offsets lies in the range N+/-1270, which corresponds to -5.136ppm and +6.078ppm, The frequency offsets given in ppm for the various switch codes are given in Table 2.2, When the T801 leaves the factory, its VCTCXOs are adjusted so that their maximum control voltages are approximately at the middle of their tuning range. a3ppm is the maximum offset available without readjustment of the VCTCXOs. Considerable care must be exercised when making this adjustment since the VCTCXO trimmers are very delicate (refer to Section 5). Each of the three PLLs uses a single dedicated synthesiser IC which is controlled by a single, common, one-time programmable microprocessor. The micro- processor outputs the synthesiser data streams only following power-up, or if one of the hex switches changes state. Note: When ordering a spare, it is necessary to specify a programmed version of this device. The synthesisers are serially loaded by a single data stream in order of the reference loop, followed by the df and then the df2 loops; i.e. the reference loop is the last to receive its data. All three synthesisers share common data latch and clock lines. The VCTCXOs of the df1 and df2 loops have a control line sensitivity of only 1.9ppm/V which gives these loops relatively long lock-up times. The reference loop VCXO has a control line sensitivity of approximately 30ppm/V and locks at 12.79915254MHz. The control line voltage is monitored by the lock detect circuit which provides (LD2) a logic "I" output when the loop is locked. Similarly, the df1 and df2 loops have lock detect signals, LD3 and LD4& respectively, which are passed to the microprocessor. If the rubidium standard is used, its lock detect output is also passed to the microprocessor (LD1). Note that this line is pulled high by a 100k resistor, for when no rubidium standard is fitted, so that a false out-of-lock condition is not detected by the microprocessor. If the microprocessor detects an out-of-lock condition, the dfl and df2 loops are "disabled", i.e, left to free run, This means that the overall stability of the T801 is then reduced to the inherent stability of the VCTCXOs, +1.5ppm. May 29/92 Page 4.2 Copyright TELgo! The microprocessor will disable the df1 and df2 loops if either the rubidium standard ot the reference loops do not lock within 6 minutes from power-up. Alternatively, it will disable either of dfl or df2 loops if one or other does not lock in 21 minutes from power-up. Similarly, during normal operation, a fault in either the rubidium standard or the reference loop will disable both dfi and df2. If, however, a fault occurs in either {1 or df2, then only the faulty loop wil be disabled, Whichever loops are disabled will be indicated by the front panel LEDs. If the fault was momentary, one of the hex switches could be toggled to avoid having to wait another 21 minutes. May 29/92 Page 4.3 Copyright TELM801-00 Alignment & Adjustment SECTION 5__ TUNING & ADJUSTMENT 5el_-VCTCXO ALIGNMENT It may be necessary from time to time to realign the VCTCXOs because of natural ageing, or if a frequency offset greater than +3ppm is required. The adjustment is made by the trimmer on the top of each YCTCXO and must be performed so that the loop control voltage falls within the correct voltage window for the programmed offset. Example The required offset selected from Table 2.2 is +5.0483ppm, hex code EBx10, for loop dil, * Set hex switches SWI, SW2 and SW3 for +3ppm offset (C2x10) and wait for the loop to lock, Adjust the trimmer for a loop voltage of 1V, measured at front panel test point TP3, * Set SWI and SW2 for an offset of +5.0483ppm (EBx10) and the loop will lock at between 2 and 3V, To return to zero offset, the reverse procedure applies. If for any reason the loop loses lock (e.g. incorrect adjustment of the trimmer) and the microprocessor disables the loop, the recovery procedure is as follows, * Measure the output frequency of the offset loop in question to an accuracy ‘of 0.5ppm or better. * Tune the trimmer for an offset of Oppm. * Programme the hex switches for Oppm offset. * Allow the loop to lock, then adjust the trimmer for a loop voltage of 2.5V 40.1V. 5.2_ CALIBRATION OF THE RUBIDIUM STANDARD 3 NERAL 1 If the Quartzlock model TF-4010A rubidium frequency standard is fitted, adjustment will be necessary from time to time. The frequency of readjustment will depend on the magnitude of the frequency offset employed. Zero frequency offset will require the most frequent adjustment. To give some idea of the likely period between recalibration, the ageing characteristics of the TF-4010A are as follows: 5x10-11 per month, starting at the second month, 5x10-10 per year for the first year, 2x10-10 per year after the first year. May 29/92 Page 5.1 Copyright TELM801-00 Alignment & Adjustment 3 RANGE OF ADJUSTMENT ‘As taken from the manufacturer's specifications (Dartington Frequency Standards). The following adjustment is possible: Mechanical Adjustment w+ 3x10-9 Electrical Adjustment ct 3x10-9 For electrical adjustment, pin 2 of the D-range connector can be 0-10V DC. adjustable voltage. The frequency will increase for positive change in voltage, i.e. OV gives a lower frequency and 10V gives a higher frequency. This allows 41.5x10-9 around the mechanical adjustment set point. Pin 3 is the electrical adjustment return, Note that there is no provision for electrical adjustment of the rubidium standard within the T801 as standard, and that it will normally be necessary to trim the frequency via the mechanical adjustment. ADJUSTMENT PROCEDURE The following is an extract from the manufacturer's data sheet: Frequency drift should be less then 5x10-11 per month starting from th second month, 5x10-10 per year for the first year, and afterwards 2x10"! per year. Therefore, a periodical frequency calibration is recommended, depending on the specific application. Frequency adjustment is performed via the frequency adjustment trimmer located on top of the unit, accessible by removing the closing sticker. One turn equals approximately 5x10-10. The adjustment may be done as follows (refer to Figure 5.1): The unit is compared with a reference (Cs clock or a calibrated Rb standard) via a phase comparator, TF-3009A. Phase drift of 2/100, at IMHz, during 1000s, corresponds to a frequency offset of 1x10-! & Figure 5.1_Rubidium Standard Adjustment Details Alternatively, a frequency counter may be used, provided that adequately long. gate times are possible and that its reference clock is guaranteed to be invariant between individual transmitters. Locking to a broadcast high stability frequency standard is ideal for this purpose. May 29/92 Page 5.2 Copyright TELM801-00 Installation SECTION 6 _ INSTALLATION 6.1__MOUNTING & CONNECTION The T801 is designed to mount in a 483mm (19") rack frame, It requires a depth of approximately 400mm to allow clearance for the rear connector and cable entry, and a clearance in height of approximately 95mm to allow for adequate air flow around the unit. All coax connectors are BNC female, while the DC input is via a connector block mounted on the rear panel. Note: In order that the internal rubidium standard (if fitted) can keep within its “~~ operating limits at high ambient temperatures, it is important that an adequate convective air flow can be maintained over the T8Ol. Installations with closely packed equipment or unventilated cabinets should be avoided. 6.2__POWER SUPPLY Because frequency stability is critical in simulcast applications, it may be desirable, for the sake of system reliability, to use a battery based power supply. This Is because the rubidium frequency standard requires a warm-up time of 3 minutes to lock and 5 minutes to 2x10-11, and once out-of-lock, the T801 can take up to 21 minutes to acquire lock. The power supply to the T801 is controlled by a key switch to prevent unauthorised or inadvertent power-down of the unit. Note: When power is removed from the T801, the transmitters which are referenced to it will cease to transmit. A momentary loss of power will result in a frequency stability of only +1.5ppm until lock is once again acquired. 6.3__CONFIGURATION The T801 may be configured as a stand-alone frequency reference with its own internal reference standard, such as the TF-4010A rubidium standard, or even a high stability ovenised crystal oscillator. * If the TF-4O10A rubidium standard is used, connect BNC connector J8 on the rear panel to J7 with the short coaxial link supplied. Set SW6 to position "0" as the reference frequency is 1OMHz. * If an external frequency standard is used, connect its output to the external standard input BNC connector (37) via a 50 ohm cable. Programme SW6 to accept the frequency of the external standard, which must be in the range of 1 to 1OMHz in IMHz steps, or 12.8MHz. * If there is a rubidium standard in the T801 and it is not being used, it must be disabled by unplugging its D-range connector and removing the 10A fuse (F3) on the filter PCB. May 29/92 Page 6.1 Copyright TELM801-00 Introduction To Servicing SECTION7 INTRODUCTION TO SERVICING 7.1_.GENERAL NOTES If further information is required about the T801 or this Manual, it may be obtained from Tait Electronics Ltd or accredited agents. When requesting this information, please quote either the equipment serial number or works order number (found on a label at the back of the set). In the case of the Service Manual quote the Tait Internal Part Number (IPN) and Issue, and for Circuit Diagrams quote the 'Title’ and ‘Issue’. CAUTION: CMOS DEVICES This equipment contains CMOS Devices which are susceptible to damage from static charges, Care when handling these devices is essential. For correct handling procedures refer to manufacturers' data books covering CMOS devices, e.g. Philips Data Handbook Covering CMOS Devices; Motorola CMOS Data Book Section 5 (Handling Procedures), etc. To BUNDING EARTH NOT MANS EARTH ‘ai Senes eSSIOR wera. ae Figure 7.1_ Typical Anti-Static Bench Set-U 7.1.2 TECHNICAL INSTRUCTIONS (TI's) From time to time T's are issued by Tait Electronics Engineering Division. These TI's may be used to update equipment or information, or to meet specific operational requirements. 7.2__MECHANICAL 1_POZIDRIV RECESS HEAD SCREWS Pozidriv recess head screws are the preferred standard on all Tait manufactured equipment. The very real advantages of this type of screw will not be realised unless the correct screwdrivers are used by servicing personnel. May 29/92 Page 7.1 Copyright TELM801-00 Introduction To Servicing 7.3__COMPONENT REPLACEMENT 7.3.1__LEADED COMPONENTS Whenever components are removed from or fitted to the PCB, care must be taken to avoid damage to the track. The two satisfactory methods of removing ‘components from PTH PCB's are detailed below. Note: The first method requires the use of a desoldering station, e.g. Philips SBC 314 or Pace MBT-100E. 7.3.1.1 _Desoldering Iron Method Place the tip over the lead and, as the solder starts to melt, move the tip in a circular motion, Start the suction and continue the movement until 3 or 4 circles have been completed, Remove the tip while continuing suction to ensure that all solder is removed from the joint, then stop the suction. Before pulling the lead out, ensure it is not stuck to the plating. If the lead is still not free, resolder the joint and try again. Note: The desoldering iron does not usually have enough heat to desolder leads from the ground plane. Additional heat may be applied by holding a soldering iron on the tip of the desoldering iron (this may require some additional help). 2. Component Cutting Method Cut the leads on the component side of the PCB. Heat the solder joint sufficiently to allow easy removal of the lead by drawing it ut from the component sider de not use undue torce. Fill the hole with solder and then clear with solderwick. May 29/92 Page 7.2 Copyright TEL,M801-00 Fault Finding SECTION 8 FAULT FINDING 8.1 VISUAL CHECKS Remove the top cover from the T801 and inspect the PCBs for damaged or broken components. Check for defective solder joints, If repair or replacement is considered necessary, refer to Section 7.3. 8.2_.GENERAL FAULTS The reference loop and the internal standard must be locked within 6 minutes from power-up or the dfl and df2 loops will be disabled by the microprocessor. Similarly, the df and df2 loops must be locked within 21 minutes from power-up or they will be disabled by the microprocessor. The microprocessor has its programme stored within its one-time programmable ROM. Its function is to programme and control the synthesisers. If the microprocessor is faulty, the synthesiser will be loaded with incorrect data or no data at all. The df1 and df2 loops will not lock if the reference loop is not locked, or if the reference loop is driven by a frequency that is more than 23pm from its correct operating frequency (assuming the VCTCXOs are not trimmed in this way). This will cause the df1 and df2 loops to trip the associated lock detect circuit and the microprocessor to disable the loops. The in-lock voltage window of the lock detect circuits is between 0.4 and 4.6V. Check the standard for the required frequency. 8.3 LOCK DETECT CONDITIONS Item Fault Effect Internal Goes out of lock after 6 minutes have The microprocessor disables the Standard elapsed from power-up. £1 and df2 control loops. Note: If an external standard is used, no lock information is available: the microprocessor “senses a locked condition permanently. Reference Goes out of lock after 6 minutes have The microprocessor disables both Loop elapsed from power-up or after 21 df1 and df2 control loops. minutes have elapsed since df1 & df2 acquired lock. Note: If the fault condition is momentary (occurred during checking), toggle any of the hex switches and wait for the loop to lock. dt1/at2 Either or both loops fail to lock before The 1oop(s) will be disabled by Loops 21 minutes have elapsed from power-up. the microprocessor. Either or both loops go out of lock The loop(s) will be disabled by after 21 minutes, the microprocessor. Note: The microprocessor disables the df and df2 loops by holding their control lines open. Pulling pins 6 & 13 of analogue switch IC13 low opens the switches of dfl and df2 respectively. May 29/92 Page 8.1 Copyright TELM&01-00 Fault Finding 8.4 FAULT FINDING CHARTS 8 1__ALL LOOPS FAIL TO LOCK RO gta. & net, Ioope Fail to tock 'in' 16 Re otd conmected to D-Renge, Connect 9 Fe sridone-2d G6 to oc |S of teats Be, 'bs necosaary, Is TF-40108 1000 voltage on TPi stv sTiv'eeminutoe after | y orp? [NJ te tock detest gional Bresont £ LED! avtver Bireute on. titer PCo Oc? I (Coax Link between U7 & Replace on repair 8 OKT [> as necessary. Replace Ab eta, Replace 104 or 05, iran z ST Vv ea TTTE] y . Bees OOS. 7 apt ment mean TE : pore eee een y_ must: ordered from : # Te SWB In, position ipagosttton | Nise v6. y Does ref Loop lock? Check ref 18 Tr2 voi tage sv s1V7 Tei ce PAY ts LED3, I Tamtnatea? Replace If necesaary. May 29/92 Page 8.2 Copyright TELM801-00 Fault Finding 8.2 df J & df2 LOOPS FAIL TO LOCK SE rer, Are, JI J, out N ic butfere Soden 1 Sed® |__S | oom ek ect 12.80 £i: Sppa? check "rcot'€ ‘too2. Y Set Svi-su5. Check 103 pins 6 & 13 ——t __ heck JAP a SFE " 7 10 (0008 10k in al Ties titers, Check. ininuteo? lock dgtoct sincule che ge are ayn. 5 ie" Have bean ‘peogrenned, Ts off & are output |_W Gheck ret eta 2 : 126005002 [+h] Y ‘Ott & af2 loope Ox. May 29/92 Page 8.3 Copyright TELM801-00 PCB Information SECTION 9__ PCB INFORMATION PARTS LISTS The 10 digit numbers (000-00000-00) in this Parts List are "internal part numbers" (IPN's). Your spare parts orders can be handled more efficiently if you quote: equipment type, circuit reference and IPN, along with a brief description of the part. The components listed in this Parts List are divided into two main types: those with a circuit reference (e.g. C2, D1, R121, etc) and those without (miscellaneous and mechanical). Those with a circuit reference are grouped by component type in numerical order. Each component entry comprises three columns: the circuit reference, IPN and description. The miscellaneous and mechanical section lists the variant and common parts in IPN order. GRID REFERENCE INDEX To assist in locating components and labelled pads on the PCB layout and Circuit Diagram, a component grid reference index has been provided. This index lists the components and pads in alphabetical order, along with the appropriate alphanumeric grid references. The first digit in the Circuit Diagram reference is the sheet number, and the last two characters give the location of the component on that sheet. The first digit in the PCB layout reference is a "1" or "2", indicating the top or bottom side layout respectively, and the last two characters give the location of the component on that diagram. USING CAD CIRCUIT DIAGRAMS Reading a CAD Circuit Diagram is similar to reading a road map, in that both have an alphanumeric border. The Circuit Diagrams in this Manual use letters to represent the horizontal axis, and numbers for the vertical axis, These Circuit Diagram "grid references" are useful in following a circuit that is spread over two or more sheets. When a line representing part of the circuitry is discontinued, a reference will be given at the end of the line to indicate where the rest of the circuitry is located. The first digit refers to the sheet number (printed on the bottom right hand corner of the CAD diagram) and the last two characters refer to the location on that sheet of the continuation of the circuit (e.g. 1-D4). If more than one line is represented (indicated by a double thickness line), a dot with a reference label will follow the route each individual line represents. May 29/92 Page 9.1 Copyright TELRERRRRRRRGLSIGTIGGSSIRRRRR LARGER ARR ARSRSLLLSPERoReRApReRRIeReeRgeaRE ‘Go oourieg on oa ‘Se vou on 0007 ‘Se tvourec out eae ‘Se wowourwc ante ot030y May 29/92 f aaz gas engagcone CBSRrg gneae seegrg g geeceseens 2 2g2gaaanaran2 ¢ HEAT i i il BRRBERRRRRREREEzzz2 DescRIPTION Ssmacsameceronn Tose nr 60 Copyright TELM801-00 PCB Information new DESCRIPTION Ber pw DESCRIPTION = erences as min eee nesreunaaendmrana SSeS Meruumeemataae mi Seven fesraunaaanecmant nee mm Seain Se Seeman. hacer amauaacc coment raven waist ‘See Raincrmear nat Se samen Tantaupostrocuox coat Ti Sees Marae oneara aa, Sie esas © rianartnowemrcnure = seruatormeean a fers dewneose Set tamar na rnuroncanton = Sra mucin at jor hemes Tootemeestarra coro smcaea ‘fesruiaan verona A i May 29/92 Page 9.3 Copyright TELM801-00 PCB Information ‘7801 MECHANICAL & MISCELLANEOUS PARTS ww DESCRIPTION ew DeSonTION cm cnet Buca May 29/92 Page 9.4 Copyright TEL‘M801-00 PCB Information 1801 GRID REFERENCE INDEX (220-01252-02) DEVICE PCB CIRCUT DEVICE PCB CIRCUIT DEVICE PCB CIRCUIT DEVICE_ Pes CIRCUIT ; o = = os & & os os Mm i z 2 a fe 2 i See = z 2 8 ‘ = 5 = ES 2 i ie E ta g ees A z 2s S a 7 x. es MA 483 ¢ 8 Ws 5 iS g en 2 & a a & ey & & = zt E = # oo = = 2 . = & = = ae = & 2 3 = s = & = 2 5S 5 = B 4 2 e = = 8 eI 2 eI a om = S a 8 = gS 3 =» 2 2 & & Ss 2 2 & # # £e & = eae te fF Be & & i Seer et eee = i RE & a = 2 #8 & eee 2 &P 8 # 7 eee = a & 8 ae ee aes. ibe 2 : ta me mom ES = 2 fe 3B 2 2 2 2 ee = pa in os = = & eee = ae eee cee e 2 2 ie a 8 eee 2 8 =e & = Fa eee £ @ B 8 eos aaa 2 #2 & eee eee 2 & & & z 2 & aS g & Fe 2 a & = a» i ae 8 & os = & aes g eae a OE = ie 2 & a 8 Steere eae a & = = 2 & 3 8 - & 3 eS mn iw BE = i & a 8 = 3 = eee eae & Sete cee = i 2 2 #2 & PA 2 2 #2 & * 2 & a : #2 & See 2 222 8 Secu es Hoe = 22 = Boe eS = es 2 £8 EF RE Ro. & May 29/92 Page 9.5 Copyright TEL6 er dddaggangees ws te wre we 18 ue toe i an May 29/92 M&01-00 PCB Information Page 9.6 Copyright TELoLvive By « Ae ee re re oe a Oe cP Ee. ware Bary 8 = aes Om | maHt Ons oot eet UE] pen mye] sea Orage pees , | 20g Oo 7 pat | Sar@~ 8 }3 | ea ‘ | jt + = TITLE — as = ie" — mente ——[ueetce tame fo RREQUENCYM801-00 PCB Information T Way 23799 Copyright TEL FILE NAwE GOLFRL@A FILE DATE: 2570/82 TAIT ELECTRONICS NEW ZEALAND a4 ao 8 ae onnwine no. 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