Leader in Dissipative Solutions

Model 255N
Manual Insulated Wire Bonder
Compact Thermosonic, Ultrasonic Bonder
Microprocessor control via alphanumeric keypad
Latest ESD protection for static sensitive devices

Features

Benefits

Bench-top, ultrasonic bonder Tab, or Wedge

Solid, robust equipment through

exceptional design and manufacturing

Fully programmable power, time and force for

every bond
Ultra compact and operator friendly
Easily adaptable for a wide range of
applications
Ideal dissipative solution for pilot lines, preproduction labs, or high volume production

High Cpk values with better process

consistency
Programmable bonder settings and
engineering-defined user ranges
Fast and simple equipment installation
Static dissipative body

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Options
Heated work holder

Illuminator

Custom work holder

Two Inch spool

Bonding Tools

Microscope

Specifications
Two inch spool

Machine Parameters

Bonding
tools
Wire Sizes:
0.0007-0.007 inches

Throat: 3.9 from tool center to front panel

Wire Type: Al, Au, Ag,-bare & insulated

Horizontal reach: 0.65

Bond Time: 10 to 1000 msec

Dimensions: 22 W, 16 D, 10 H

Bond Force : 10 to 250 grams

Weight: 55/95 lbs

Power Range: 0.01 to 5 watts

Power: 110/220 VAC, 50/60 Hz 3 amps

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Cycle Time: 0.50 sec

Transducer Impedance: 20 Ohms
Frequency: 64 KHz, full wave self tuning

4121 Citrus Ave, Rocklin, CA 95677

Mailing Address: P.O. Box 1850, Loomis, CA 95650
sales@anzatec.com
www.anzatec.com

Tel:
Fax:

916.625.0320
916.604.6202