Xiaomi MI3

SOC
Qualcomm Snapdragon 800 MSM8274AB

ISA Supported: ARMv7

CPU Structure: RISC
Semiconductor Technology: CMOS
Year Released: 2014

Technical Specifications:

CPU clock speed: 2.265 MHz

CPU cores : 4
Primary Central Processing Unit: Qualcomm Krait 400
L1 Instruction Cache 16 KB/Core
L1 Data Cache
16 KB/Core
L2 Cache
2,048 KB/Core
Word Length 32 bit
Data Bus
32 bit
RAM: 2GB

Graphics Processing Unit:

Qualcomm Adreno 330

Digital Signal Processing

DSP Type: 600 MHz Hexagon QDSP6V5A

Mobile Broadband Signals: CDMA, EDGE, GPRS, GSM, HSPA+

External Components:

RAM Interface: LP-DDR3

Primary Camera Support: 55 MP ( The maximum camera resolution an SoC can
support.)
Video Encoding: 2160p
Video Decoding: 2160p
GPS Module Type: gpsOneGen 8B with GLONASS

A continuacin, muestro una estimacin realizada por Teardown del diagrama de

bloques empleado por la versin TD-CDMA (cuenta con un Nvidia Tegra 4 en lugar del
Snapdragon 800):

Iphone 6
SOC
Apple A8
Technical Specifications:

CPU clock speed: 1.4 MHz

RAM: 1GB LPDDR3
CPU cores : 2
Graphics Processor: Imaginations PowerVR GX6450 (4 cores)
CPU: ARMv8 64 bits basada en dos ncleos Apple 'Cyclone'
Proc. Fab: TSMC 20 nm.
Superficie total: 89 mm2
Superficie CPU
12,2 mm2
Superficie GPU
19,1 mm2

Chip A8:

Bibliografa
[1] Specouts
[2] Teardown
[3] Xataka
[4] Chipworks