A Project Report ON: "Thermoelectric Power"

Thermoelectric power
2015-16
A
PROJECT REPORT
ON
Thermoelectric Power
Submitted By
MR. PATIL SANKET DHANANJAY
MR. PATIL SIDDHANT SHRENIK
MR. PATIL SOURABH SHITAL
MR. PATIL RAKESH DILEEP
Under the Guidance of

MR. V. N. BARGALE
DEPARTMENT OF MECHANICAL ENGINEERING

LATTHE EDUCATION SOCIETYS POLYTECHNIC,
Latthe Education Societys Polytechnic, Sangli.

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KUPWAD-MIDC, SANGLI.
2015-2016
Latthe Education Societys Polytechnic Sangli.

Department of Mechanical Engineering
CERTIFICATE
This is to certify that
Mr. Patil Sanket Dhananjay (Roll No-3741)
Mr. Patil Siddhant Shrenik
(Roll No-3745)
Mr. Patil Sourabh Shital
(Roll No-3746)
Mr. Patil Rakesh Dileep(Roll No-3752)

Of T.Y. Mechanical (Div. B)
Has successfully presented and submitted a project report titled
Thermoelectric Power
in partial fulfillment of the requirements for
DIPLOMA IN MECHANICAL ENGINEERING
Of
M.S.B.T.E. MUMBAI
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In the year 2015-16.
Date: Place: - Sangli.
Mr. V.N. Bargale

(Guide)
Mr. S.J.Patil.
Mr. R. A. Charate.
(HOD)
(Principal)
ACKNOWLEDGEMENT
We would like express our gratitude toward our project guide Mr. V. N. Bargale for his
guidance during the project work and valuable effort toward our team for completion of work
within time.
We are also grateful to our H. O. D. Prof. S. J. Patil for giving us opportunity to carry
out our project and encouraging us to complete work. Also our thanks to teaching & nonteaching staff who kindly co-operated us complete the project.
Finally we are would like to express our appreciation to all who are directly or indirectly related
with our project.
PROJECT ASSOCIATES:-
Mr. Patil Sanket Dhananjay.

Mr. Patil Siddhant Shrenik.
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Mr. Patil Sourabh Shital.
Mr. Patil Rakesh Dileep
ABSTRACT
This is a project based on Seebeck effect found by the physician Thomas Johann
Seebeck, in 1821, when he was studying thermoelectric phenomenon. The Seebeck effect state
that if two different metals are connected to form two junctions and if one junction is heated and
other is kept cool, then EMF gets developed in the wire.
We have focused the aim of this project on the waste heat recovery. As the waste heat
decreases the efficiency of any application, by using this thermoelectric principle, we can
increase the efficiency of any application.
We are using a thermoelectric module which contains 127 numbers of thermocouples
having semiconductor material. These thermocouples are used to convert temperature difference
into voltage. In this project we are using one heat sink and one heat source. The purpose of using
these is to evenly supply heat to module and to rapidly removing heat from the module.

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We are presenting application of this principle by operating a fan powered by a candle.
We are giving heat to module with help of candle and module is cooled by an old CPU cooler.
INDEX
Sr.No.
Contents
Page No.
1.
Introduction
01
2.
Principle
04
3.
Thermoelectric power generator device
08
4.
Experimental setup
10

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5.
Block diagram
13
6.
Components
14
7.
Calculations
31
8.
Bill of material
32
9.
Application
33
10.
Conclusion
34
11.
Case study
35
12.
Future scope
37
13.
References
38
14.
Photo gallery
39
15.
Achievements
41
1. INTRODUCTION
Present
some
fundamental
aspects
of
the
direct
thermoelectric
conversion.
Thermoelectric systems are solid-state heat devices that either convert heat directly into
electricity or transform electric power into thermal power for heating or cooling. Such devices
are based on thermoelectric effects involving interactions between the flow of heat and electricity
through solid bodies. These phenomena, called Seebeck effect and Peltier effect, can be used to
generate electric power and heating or cooling.
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The Seebeck effect was first observed by the physician Thomas Johann Seebeck, in 1821,
when he was studying thermoelectric phenomenon. It consists in the production of an electric
power between two semiconductors when submitted to a temperature difference. Heat is pumped
into one side of the couples and rejected from the opposite side. An electrical current is
produced, proportional to the temperature gradient between the hot and cold sides. The
temperature differential across the converter produces direct current to a load producing a
terminal voltage and a terminal current. There is no intermediate energy conversion process. For
this reason, thermoelectric power generation is classified as direct power conversion.
On the other hand, a thermoelectric cooling system is based on an effect discovered by Jean
Charles Peltier Athanasius in 1834. When an electric current passes through a junction of two
semiconductor materials with different properties, the heat is dissipated and absorbed.
The parameters that are interesting to evaluate the performance of a cooling
thermoelectric system are the coefficient of performance (COP), the heat pumping rate and the
maximum temperature difference that the device will produce.
It shows these parameters and also the current that maximizes the coefficient of
performance, the resultant value of the applied voltage which maximizes the coefficient of
performance and the current that maximizes the heat pumping rate.
To evaluate the power generator performance it is presented the equations to calculate the
efficiency and the power output, as well as the operating design that maximizes the efficiency,
the optimum load and the load resistance that maximizes the power output. The last part of the
chapter presents the selection of the proper module for a specific application. It requires an
evaluation of the total system in which the thermoelectric module will be used. The overall
system is dynamic and its performance is a function of several interrelated parameters, such as:
the operation temperatures, the ambient temperature, the available space, the available power,
among others.

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Finally it presents conclusions, acknowledgment and references. Thermoelectric modules
consists of an array of p-type and n-type semiconductors elements that are heavily doped with
electrical carriers. The elements are arranged into an array that is electrically connected in series
but thermally connected in parallel. This array is then affixed to two ceramic plates, one on each
side of the elements, that is, one covers the hot joins and the other covers the cold one.
Thermoelectric devices offer several advantages over other technologies: the absence of
moving components results in an increase of reliability, a reduction of maintenance, and an
increase of system life; the modularity allows for the application in a wide-scale range without
significant losses in performance; the absence of a working fluid avoids environmentally
dangerous leakages; and the noise reduction appears also to be an important feature.
A unique aspect of thermoelectric energy conversion is that the direction of energy flow
is reversible. So, for instance, if the load resistor is removed and a DC power supply is
substituted, the thermoelectric device can be used to draw heat from the heat source element
and decrease its temperature. In this configuration, the reversed energy-conversion process of
thermoelectric devices is invoked, using electrical power to pump heat and produce refrigeration.
This reversibility distinguishes thermoelectric energy converters from many other conversion
systems.
Electrical input power can be directly converted to pumped thermal power for heating or
refrigerating, or thermal input power can be converted directly to electrical power for lighting,
operating electrical equipment, and other work. Any thermoelectric device can be applied in
either mode of operation, though the design of a particular device is usually optimized for its
specific purpose.

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2. PRINCIPLE
Thermoelectric conversion may be defined as the result of a process by which heat is
converted into electricity through the use of a heat-to-electricity conversion device.
Thermoelectric conversion, besides occurring in simple thermocouples, forms the basis of
reversible thermoelectric modules (TEMs), which can work either as coolers when supplied with
electricity, or as generators when supplied with heat.
Fig.no.2.1 TEC as Refrigerator & Power generator

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2.1: THE PELTIER AND SEEBECK EFFECTS:

The name thermoelectricity indicates a relationship between thermal and electrical
phenomena. The concepts of heat, temperature and thermal balance are among the most
fundamental and important to the science. Two objects are considered to be in thermal
equilibrium if the exchange of heat does not exist when they both are placed in contact. This is
an experimental fact. Objects in the same temperature are said to be in thermal equilibrium. This
is called zeroth law of thermodynamics.
Two objects at different temperatures placed in contact exchange energy in an attempt to
establish thermal equilibrium. Any work done during this process is the difference of heat lost by
an object and won by another object. This is the first law of thermodynamics, in other words,
energy is always conserved. The concepts of electric charge and electric potential are also
essentials.
Objects are composed of positive and negative charges. Opposite electric charges attract
each other and equal charges repel. These are experimental facts. Objects are said to be in
electric equilibrium if there is no heat exchange when they are placed in contact. Such objects
are said to be at the same electrical potential.
Objects with different electrical potential exchange charges in an attempt to achieve the
same electrical potential. The electric current is the amount of electric charges which pass
through a boundary of a conductor per unit time and it is related to the variation of the electrical
potential, in other words, the electrical gradient. Similarly, the heat flow is the amount of heat
that passes through the boundary per unit of time. Likewise, the thermal flow is related to
temperature variation, in other words, to the electrical gradient.

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To understand the thermoelectric effect it is needed to visualize the phenomenon in a
micro scale. In the nature, the materials are made of molecules composed by atoms.
Depending on the kind of interlace between the atoms, the outer electrons are more or
less likely of moving around the nucleus and other electrons. In the purer metallic conductors
outer electrons, less connected to others, can move freely around all the material, as if they do
not belong to any atom. These electrons transmit energy one to another through temperature
variation, and this energy intensity varies depending on the nature of the material.
For this reason, if two distinct materials are placed in contact, free electrons will be
transferred from the more loaded material to the other, so they equate themselves, such
transference creates a potential difference, called contact potential, since the result will be a pole
negatively charged by the received electrons and another positively charged by the loss of
electrons. The following sequence of metals shows, from left to right, which is more likely to
lose electrons:
(+) Rb K Na Al Zn Pb Sn Sb Bi Fe Cu Ag Au Pt (-)
In the case of semi-conductors, the transference occurs because some of the atoms that
compose it are already lacking some electrons. When voltage is applied, there is a tendency to
drive electrons and complete the atomic orbit. When it occurs, the atomic conduction leaves
holes that are essentially atoms with crystalline grids that now have positive local charge. The
electrons are, then, continuously drown out of the holes moving towards the next hole available.
In fact, the embezzlement of these atoms is what drives the current.
Electrons move more easily in copper conductors than in semiconductors. When
electrons leave the p element and entering the cold side of the copper, holes are created in the p
type as the electrons go to a higher level of energy to reach an energy level of electrons that are
already moving in the copper. The extra energy to create these holes come from the absorption of
heat. Meanwhile, the newly-created holes move throughout the copper in the hot side.

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The hot side electrons of the copper move to the p element and complete the holes,
releasing energy generated as heat.
The n-type conductor is doped with atoms which provide more electrons than the ones
necessary to complete the atomic orbits within the crystalline grids. When the voltage is applied,
these extra electrons move easily to the conduction band. However, additional energy is
necessary so that the n-type electrons reach the next energy level of electrons arriving from the
cold side of the copper. This extra energy comes from the heat absorbed. Finally, when the
electrons leave the hot side of the n-type element, they can move freely again throughout the
copper. They fall to a lower energy level, releasing heat in the process. The information above do
not cover all the details, but they can explain complex physical interactions. The main point is
that the heat is always absolved in the cold side of the elements p and n, and the heat is always
released in the hot side of the thermoelectric element.
The pumping capacity of the module heat is proportional to electric current and depends
on the geometry of the element, the number of pairs and the properties of the material. It is also
possible to form a more conductive crystal by adding impurities with less valence electron. For
instance, Indium impurities (which have 3 valence electrons) are used in combination with
silicon and create a crystalline structure with holes. These holes make it easier to transport
electrons throughout the material when the voltage applying a voltage. In this case, the holes are
considered load conductors in this conductor positively doped which is referred as p-type.

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Fig no2.1 Peltier Effect
Fig. no. 2.2 Seebeck effect
3. THERMOELECTRIC POWER GENERATOR DEVICE

Figure shows the configuration of a typical thermoelectric system that operates by the
Seebeck effect.
Fig. no. 3.1.1 Schematic of a thermoelectric power generator

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There are some important practical considerations that should be made before attempting
to use thermoelectric coolers in the power generation mode. Perhaps the most important
consideration is the question of survivability of the module at the anticipated maximum
temperature.
Many standard thermoelectric cooling modules are fabricated with eutectic Bi/Sn solder
which melts at approximately 138C. However, there are some coolers being offered employing
higher temperature solders designed to operate at temperatures of 200C, even approaching
300C. In any case, consideration should be given to operational lifetime of a thermoelectric
module exposed to high temperatures. Contaminants or even constituents of the solder can
rapidly diffuse into the thermoelectric material at high temperatures and degrade performance
and, in extreme cases, can cause catastrophic failure.
This process can be controlled by the application of a diffusion barrier onto the TE material.
However, some manufactures of thermoelectric coolers employ no barrier material at all between
the solder and the TE material.
Although application of a barrier material is generally standard on the high temperature
thermoelectric cooling modules manufactured, they are mostly intended for only short-term
survivability and may or may not provide adequate MTBFs (Mean Time Between Failures) at
elevated temperatures.
In summary, if one expects to operate a thermoelectric cooling module in the power
generation mode, qualification testing should be done to assure long-term operation at the
maximum expected operating temperature.

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4. EXPERIMENTAL SETUP
First of all, it does not need to be exactly those components. Other heat sinks,
TEC/TEG, motor, fan, thermal paste, bolts and base plate can be used.
Main concept rules are:
A TEC or TEG module (smaller dimension than upper heat sink base plate).
Specifications are not that important but make sure it can handle high temperature. Many
modules are only 100 degrees C and then you need to modify the construction as it gets
warmer than that.
One hot side that is not hotter than TEC max-temp (My candle flame never touches the
surface)
One cold side, an efficient heat sink (heat pipes) are a good choice
Good thermal paste to maximize temperature difference
Low voltage motor, around 5V. I prefer it to be quite (low dB)
Fan with high air flow at low RPM
Base plate that adds stability, holder for light, isolate heat the lower heat sink (hot side)
was cut and polished to get it nice looking. Keep 5mm of the fins to absorb the heat well
when the light flame burns and increases distance to the surface.

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Fig. Setup of Experiment

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The wooden frame will hold the lower heat sink on top of the two side fins. The
rectangular section cut into the wooden stand will act as base and support the whole setup on two
side fins, one on each side. The distance between base and heat sink is 80mm but make it 4045mm as the flame almost touches the surface. You dont want that because it creates black soot.
The lower heat sink gets really warm but at the same time it works as a cooler to not get too
warm, that would melt the TEC-module.
TEC module placed on heat sink and with thermal paste in between module and heat
sink. Both surfaces of the TEC are covered with a thin smooth layer of thermal paste. On that
CPU cooler with thermal paste is attached. A motor with fan for forced cooling is also placed on
cardboard and it is placed between two fins of CPU cooler.
5. BLOCK DIAGRAM
CPU cooler
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Coolness
TEC module
O/P
Aluminium heat
source
Heat
Fig.: Block dia. of experiment
6. COMPONENTS
1. CPU-cooler (cold side): Antec A-40(Base plate: 44x44mm)
2. Aluminium heat source(WxLxH=84x70x26mm)
3. TEC-module: TEC12-706 (44x44x4mm)
4. DC Motor: 5V
5. Thermal paste: Silver and graphite based compound material.
6. A base of wood.

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Electricit
y
2015-16
6.1: CPU-cooler (cold side): Antec A-40:
Antec A-40 CPU cooler 1155 / 1366 / 775 / 1156 CPUs AMD Socket FM1 /AM2 / AM2+ /
AM3. This is a special type of CPU cooler in contrast with the old CPU cooler it has fins with
the fan which blows air on fins that it will cool faster also it contains the copper tubes which
carries the hot air from upper side of the TEC module. It helps to keep cool the TEC module & to
maintain temperature difference.
Fig. no. 6.1.1 Schematic diagram of Antec A-40 CPU cooler
6.1.1 Specifications:
Dimensions
Weight
Materials
Fan RPM
Input Voltage
48(L) x 100(W) x 125(H)mm

450g
Pure Copper, Aluminum
300-350 rpm 10%
4-5 VDC

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6.1.2Features:
o Powerful Cooling Performance
Four heat pipes and aluminum fins are designed for maximum cooling while cooler setup
quickly expels hot air out of the case.
o Easy Installation
The cooler is designed with tool-less installation clip, making installation convenient.
Avoid inserting objects or hands into the fan while it is in operation to prevent
product damage and injuries
Do not ingest the Thermal Grease, and avoid its contact with skin and eyes. If
contact is made with skin, wash off with water. If ingested or irritation persists, seek medical
attention.
To prevent possible injuries, gloves must be worn while handling this product.
Excessive force exerted on the fan may cause damage to the fan and/or system.
Use and keep product away from reach of children.
During transportation of the system, the cooler must be remove, Liquid metal thermal grease
unlike the normal thermal grease it contains electrical conductivity and causes aluminum cooler
to rust therefore please avoid using it. Corrosion and short circuits caused by using aluminum
cooler are users' responsibility, so please read this carefully before using. (EX: Liquid Pro,

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Liquid Ultra etc.)
Fig. no. 6.1.2 Antec A-40 CPU cooler
6.2: TEC-module:
A thermoelectric (TE) module, also called a thermoelectric cooler or Peltier cooler, is a
semiconductor-based electronic component that functions as a small heat pump
By applying a low voltage DC power to a TE module, heat will be moved through the
module from one side to the other. One module face, therefore, will be cooled while the opposite
face is simultaneously heated.
It is important to note that this phenomenon may be reversed whereby a change in the
polarity (plus and minus) of the applied DC voltage will cause heat to be moved in the opposite
direction.
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Consequently, a thermoelectric module may be used for both heating and cooling thereby
making it highly suitable for precise temperature control applications. A thermoelectric module
can also be used for power generation. In this mode, a temperature differential applied across the
module will generate a current.
A practical thermoelectric module generally consists of two or more elements of n and ptype doped semiconductor material that is connected electrically in series and thermally in
parallel. These thermoelectric elements and their electrical interconnects typically are mounted
between two ceramic substrates. The substrates hold the overall structure together mechanically
and electrically insulate the individual elements from one another and from external mounting
surfaces. Most thermoelectric modules range in size from approximately 2.5-50 mm (0.1 to 2.0
inches) square and 2.5-5mm (0.1 to 0.2 inches) in height. A variety of different shapes, substrate
materials, metallization patterns and mounting options are available. The schematic diagram
above shows a typical thermoelectric module assembly.
Both N-type and P-type Bismuth Telluride thermoelectric materials are used in a
thermoelectric cooler. This arrangement causes heat to move through the cooler in one direction
only while the electrical current moves back and forth alternately between the top and bottom
substrates through each N and P element. N-type material is doped so that it will have an excess
of electrons (more electrons than needed to complete a perfect molecular lattice structure) and Ptype material is doped so that it will have a deficiency of electrons (fewer electrons than are
necessary to complete a perfect lattice structure).
The extra electrons in the N material and the "holes" resulting from the deficiency of
electrons in the P material are the carriers which move the heat energy through the thermoelectric
material.

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Most thermoelectric cooling modules are fabricated with an equal number of N-type and
P-type elements where one N and P element pair form a thermoelectric "couple." For example,
the module illustrated above has two pairs of N and P elements and is termed a "two-couple
module".
Fig. no. 6.2.1 Schematics of (a) geometry of a TEC and (b) heat flow in the TEC.
Cooling capacity (heat actively pumped through the thermoelectric module) is proportional to the
magnitude of the applied DC electric current and the thermal conditions on each side of the

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module. By varying the input current from zero to maximum, it is possible to regulate the heat
flow and control the surface temperature.
Thermoelectric modules offer many advantages including:
No moving parts
Small and lightweight
Maintenance-free
Acoustically silent and electrically quiet
Heating and cooling with the same module (including temperature cycling)
Wide operating temperature range
Highly precise temperature control (to within 0.1C)
Operation in any orientation, zero gravity and high G- levels
Environmentally friendly
Sub-ambient cooling
Cooling to very low temperatures (-80C)

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6.2.1: Physical orientation of the module:
Fig. no. 6.2.1 Orientation of TEC module
The answer has to do with the heat that is conducted through the wires. The ends of the
wires that are attached to the power source will be at or near ambient temperature. If those wires
go to the cold side of a module, heat will be conducted from the warm end of the wires into the
cold side. Copper is an excellent conductor of heat! That parasitic heat load robs the module of
some of its useful cooling capacity. So, by placing the wires on the hot side this loss is
eliminated.
6.2.2: Locating the Positive Wire:

If the module has a red and a black wire, locating the positive wire is simplethe red
wire is the positive lead. Positive current flowing into this wire will cause heat to flow from the
cold side of the module into the hot side of the module.

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Fig. no. 6.2.1 TEC
module
6.2.3: Selection of
TEC module:
Th=30
ITEM PART Number
DIMENSIONS
Imax
Tmax
Vmax
Qmax
WI
LI
WII
LII
Mm
3.3
66
0.82
1.60
10
10
10
10
4.4
TEC1-00703
TEC1-01703
2.00
3.90
15
15
15
15
4.4
TEC1-02303
2.83
4.80
15
20
15
20
4.4
TEC1-03103
3.66
7.20
20
20
20
20
4.4
TEC1-03503
4.13
7.30
15
30
15
30
4.4
TEC1-04903
5.78
10.00
25
25
25
25
4.4
TEC1-06303
7.43
13.20
20
40
20
40
4.4
TEC1-07103
8.40
16.40
30
30
30
30
4.4
TEC1-07903
9.30
16.60
20
50
20
50
4.4
10
TEC1-12703
15.00
29.30
40
40
40
40
4.4
11
TEC1-19903
23.40
41.80
40
40
40
40
4.4
12
TEC1-24103
28.80
55.60
55
55
55
55
4.8
13
TEC1-00704
0.82
1.80
10
10
10
10
4.1
14
TEC1-01704
2.00
4.00
15
15
15
15
4.1
15
TEC1-02304
2.83
6.40
15
20
15
20
4.1
16
TEC1-03104
3.66
7.30
20
20
20
20
4.1
17
TEC1-03504
4.13
9.50
15
30
15
30
4.1
3.3
4.0
67
66

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Data
2015-16
18
TEC1-04904
5.78
13.50
25
25
25
25
4.1
19
TEC1-06304
7.43
17.50
20
40
20
40
4.1
20
TEC1-07104
8.40
16.70
30
30
30
30
4.1
21
TEC1-07904
9.30
22.10
20
50
20
50
4.1
22
TEC1-12704
15.00
30.00
40
40
40
40
4.1
23
TEC1-19904
23.40
55.00
40
40
40
40
4.1
24
TEC1-24104
28.80
56.90
55
55
55
55
4.7
25
TEC1-00705
0.82
2.30
10
10
10
10
3.9
26
TEC1-01705
2.00
5.60
15
15
15
15
3.9
27
TEC1-02305
2.83
8.05
15
20
15
20
3.9
28
TEC1-03105
3.66
10.30
20
20
20
20
3.9
29
TEC1-03505
4.13
12.20
15
30
15
30
3.9
30
TEC1-04905
5.78
17.10
25
25
25
25
3.9
31
TEC1-06305
7.43
22.00
20
40
20
40
3.9
32
TEC1-07105
8.40
23.70
30
30
30
30
3.9
33
TEC1-07905
9.30
27.60
20
50
20
50
3.9
34
TEC1-12705
15.00
42.50
40
40
40
40
3.9
35
TEC1-16105
19.00
53.80
50
50
50
50
4.1
4.0
67
66
5.0
67
Th=30
ITEM PART Number
DIMENSIONS
Imax
Tmax
Vmax
Qmax
WI
LI
WII
LII
Mm
5.0
67
23.40
66.60
40
40
40
40
3.8
28.80
80.60
55
55
55
55
4.2
66
0.82
1.60
10
10
10
10
3.8
36
TEC1-19905
37
TEC1-24105
38
TEC1-00706
39
TEC1-01706
2.00
6.90
15
15
15
15
3.8
40
TEC1-02306
2.83
9.60
15
20
15
20
3.8

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Data
2015-16
41
TEC1-03106
3.66
12.50
20
20
20
20
3.8
42
TEC1-03506
4.13
14.70
15
30
15
30
3.8
43
TEC1-04906
5.78
20.50
25
25
25
25
3.8
44
TEC1-06306
7.43
26.40
20
40
20
40
3.8
45
TEC1-07106
8.40
28.70
30
30
30
30
3.8
46
TEC1-07906
9.30
33.00
20
50
20
50
3.8
47
TEC1-12706
15.00
51.40
40
40
40
40
3.8
48
TEC1-24106
28.80
101.00
55
55
55
55
4.4
49
TEC1-00707
0.82
2.70
10
10
10
10
3.5
50
TEC1-01707
2.00
8.10
15
15
15
15
3.5
51
TEC1-02307
2.83
11.70
15
20
15
20
3.5
52
TEC1-03107
3.66
14.70
20
20
20
20
3.5
53
TEC1-03507
4.13
17.10
15
30
15
30
3.5
54
TEC1-04907
5.78
24.00
25
25
25
25
3.5
55
TEC1-06307
7.43
30.80
20
40
20
40
3.5
TEC1-07107
8.40
33.60
30
30
30
30
3.5
57
TEC1-07907
9.30
38.70
20
50
20
50
3.5
58
TEC1-12707
15.00
60.00
40
40
40
40
3.5
59
TEC1-24107
28.80
118.00
55
55
55
55
4.1
60
TEC1-00708
0.82
3.70
10
10
10
10
3.5
61
TEC1-01708
2.00
9.20
15
15
15
15
3.5
62
TEC1-02308
2.83
12.80
15
20
15
20
3.5
63
TEC1-03108
3.66
16.80
20
20
20
20
3.5
64
TEC1-03508
4.13
19.60
15
30
15
30
3.5
65
TEC1-04908
5.78
27.40
25
25
25
25
3.5
66
TEC1-06308
7.43
35.20
20
40
20
40
3.5
56
6.0
6.0
7.0
8.0
66
67
66
66

P a g e | 28
2015-16
67
TEC1-07108
8.40
38.50
30
30
30
30
3.5
68
TEC1-07908
9.30
44.20
20
50
20
50
3.5
69
TEC1-12708
15.00
68.90
40
40
40
40
3.5
70
TEC1-24108
28.80
129.00
55
55
55
55
4.1
Th=30
ITEM PART Number
DIMENSIONS
Imax
Tmax
Vmax
Qmax
WI
Mm
LI
WII
LII
71
TEC1-00710
0.82
4.80
10
10
10
10
3.4
72
TEC1-01710
2.00
11.50
15
15
15
15
3.4
73
TEC1-02310
2.83
15.50
15
20
15
20
3.4
74
TEC1-03110
3.66
20.20
20
20
20
20
3.4
75
TEC1-03510
4.13
24.50
15
30
15
30
3.4
76
TEC1-04910
5.78
32.50
25
25
25
25
3.4
77
TEC1-06310
7.43
41.90
20
40
20
40
3.4
78
TEC1-07110
8.40
47.30
30
30
30
30
3.4
79
TEC1-07910
9.30
52.50
20
50
20
50
3.4
80
TEC1-12710
15.00
85.00
40
40
40
40
3.4
81
TEC1-12712
15.00
95.00
40
40
40
40
3.2
82
TEC1-06309
7.43
37.70
20
40
20
40
83
TEC1-07109
8.40
42.50
30
30
30
30
84
TEC1-01708
2.00
9.50
20
20
20
20
4.6
3.66
16.80
25
25
25
25
4.6
30
30
30
30
4.6
38
38
38
38
4.6
44
44
44
44
4.6
50
50
50
50
4.6
85
86
87
88
89
TEC1-03108
10.0
66
12.0
64
9.0
66
8.0
66
TEC1-07108
8.0
66
8.40
38.00
TEC1-12708
8.0
66
15.00
69.00

P a g e | 29
Data
2015-16
90
TEC1-01710
2.00
11.50
TEC1-03110
3.66
20.20
TEC1-07110
8.40
47.30
95
TEC1-12710
15.00
96
TEC1-01712
TEC1-03112
91
92
10.0
93
94
97
98
20
20
20
20
4.2
25
25
25
25
4.2
30
30
30
30
4.2
38
38
38
38
4.2
44
44
44
44
4.2
85.00
50
50
50
50
4.2
2.00
13.50
20
20
20
20
3.66
25.00
25
25
25
25
30
30
30
30
8.40
56.70
38
38
38
38
44
44
44
44
15.00
102.00
50
50
50
50
7.43
50.00
20
40
20
40
11.00
75.00
30
40
30
40
3.2
66
66
99
100
TEC1-07112
101
TEC1-12712
102
TEC1-06312
103
TEC1-09412
12.0
64
Th=30
ITEM PART Number
DIMENSIONS
Imax
Tmax
Vmax
Qmax
WI
Mm
TEC1-01714
2.00
15.80
TEC1-03114
3.66
28.80
TEC1-07114
8.40
65.90
109
TEC1-12714
15.00
110
TEC1-01718
111
TEC1-03118
104
105
106
107
108
14.0
18.0
LI
WII
LII
20
20
20
20
3.9
25
25
25
25
3.9
30
30
30
30
3.9
38
38
38
38
3.9
44
44
44
44
3.9
118.00
50
50
50
50
3.9
2.00
20.00
20
20
20
20
3.6
3.66
36.60
25
25
25
25
3.6
30
30
30
30
3.6
66
65
112

P a g e | 30
Data
2015-16
113
38
38
38
38
3.6
44
44
44
44
3.6
150.00
50
50
50
50
3.6
2.00
22.60
20
20
20
20
3.4
3.66
41.20
25
25
25
25
3.4
30
30
30
30
3.4
TEC1-07120
8.40
94.40
38
38
38
38
3.4
44
44
44
44
3.4
121
TEC1-12720
15.00
169.00
50
50
50
50
3.4
122
TEC1-01709
2.00
10.10
23
23
23
23
5.3
123
TEC1-03109
3.66
18.50
30
30
30
30
5.3
124
TEC1-07109
8.40
42.50
46
46
46
46
5.3
125
TEC1-12709
16.00
80.00
62
62
62
62
5.3
126
TEC1-01730
2.00
34.00
23
23
23
23
4.4
127
TEC1-03130
3.66
64.20
30
30
30
30
4.4
128
TEC1-07130
8.40
145.00
46
46
46
46
4.4
129
TEC1-12730
16.00
253.00
62
62
62
62
4.8
130
TEC1-19911
23.40
150.00
40
40
40
40
3.2
131
TEC1-03130
3.50
64.20
35
35
35
35
132
TEC1-07130
8.40
145.00
55
55
55
55
5.3
133
TEC1-03140
3.50
85.50
35
35
35
35
4.5
134
TEC1-07140
8.40
190.00
55
55
55
55
4.8
135
TEC1-03150
3.50
106.90
35
35
35
35
4.2
136
TEC1-07150
8.40
245.00
55
55
55
55
4.5
LII
TEC1-07118
8.40
83.80
115
TEC1-12718
15.00
116
TEC1-01720
TEC1-03120
114
117
118
119
120
20.0
ITEM PART Number
9.0
65
66
67
30.0
65
11.0
63
30.0
66
40.0
66
50.0
66
Th=30
Imax
DIMENSIONS
Tmax
Vmax

P a g e | 31
Qmax
WI
LI
WII
Data
2015-16
137
TEC1-03160
138
TEC1-07160
139
TEC1-03180
140
TEC1-07180
141
TEC1-03140
142
TEC1-07140
143
TEC1-03150
144
TEC1-07150
145
TEC1-03160
146
TEC1-07160
147
TEC1-03180
60.0
63
80.0
63
40.0
66
50.0
__
60.0
__
80.0
__
Mm
3.50
128.30
35
35
35
35
8.40
290.00
55
55
55
55
4.3
3.50
171.00
35
35
35
35
3.8
8.40
390.00
55
55
55
55
4.1
3.50
85.50
40
40
40
40
4.8
8.40
190.00
62
62
62
62
5.1
3.50
106.90
40
40
40
40
4.4
8.40
245.00
62
62
62
62
4.7
3.50
106.90
40
40
40
40
4.2
8.40
245.00
62
62
62
62
4.5
3.50
171.00
40
40
40
40
4.0
6.3: Aluminium heat source:

The Aluminium heat source is nothing but a finned part of aluminum, this heat source is
used to give heat to TEC module, as there is a limitation for heat supplement if excess heat is
supplied to Tec module it will make damage to module & hence we cant give heat directly but
through the heat source, the heat source is a finned aluminum part having number of fins, the fins
are straight in nature and are equally spaced, reason behind using the fins is that it increases the
heat transfer rate and also it uniformly distributes the heat and gives to Tec module. Also the
material used for fins is aluminum which also increases the heat transfer rate.

P a g e | 32
2015-16
Fig. no. 6.3.1 Old CPU cooler
6.4: Thermal paste:

Thermal grease (also called thermal gel, thermal compound, thermal paste, heat paste,
heat sink paste or heat sink compound) is a viscous fluid substance, originally with properties
akin to grease, which increases the thermal conductivity of a thermal interface by filling
microscopic air-gaps present due to the imperfectly flat and smooth surfaces of the components;
the compound has far greater thermal conductivity than air (but far less than metal).
In electronics, it is often used to aid a component's thermal dissipation via a heat sink.
For comparison, the approximate thermal conductivities of various materials relevant to heat sink
in W/(mK) are:
Air 0.024
Water 0.58
Thermal grease about 0.5 to 10

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2015-16
Unbranded grease typically 0.8;[1] some silver-and graphite-based greases claim about 9
Aluminum oxide (surface layer on pure aluminum exposed to air) 35
Zinc oxide (used in diaper rash ointment) 35
Steel About 40, varies for different types
Sodium Fluoride (primary active ingredient in most toothpastes) 132
Aluminum 220
Copper 390
Silver 420
Natural Diamond 2000
These figures vary slightly between sources, and depend upon purity, etc. of the material.
Other units are sometimes used, obviously giving different numerical values. These are bulk
thermal conductivities; the thermal resistance of a particular interface (e.g., a CPU, a thin layer
of compound, and a heat sink) is given by the thermal resistance, the temperature rise caused by
dissipating 1 W, in K/W or, equivalently, C/W. For example, a thermal pad of specified area and
thickness will be rated by its thermal resistance. A typical value for a pad for a microprocessor is
roughly 0.2 C/W per square inch, dependent upon thickness and decreasing at high pressure
An informal comparative test of thermal greases was made, examining the thermal resistance
in C/W for a heater simulating a processor, with a very thin layer of grease, rather than the bulk
conductivity. The procedure used was explained in detail; a heater and sensor was used so that
power dissipation and temperature were known accurately and consistently.
A Thermaltake Volcano 6Cu+ heat sink was used, with a copper disc of 4 cm diameter in
contact with the heat source, an area of 12.6 square centimeters (1.95 sq in).

P a g e | 34
2015-16
The temperature rise without any grease was 0.66 C/W. Using all greases from standard
types to silver-based ones gave results fairly close to 0.50 C/W. A very thin layer of grease gave
slightly better results than a thick one. Just about any wet paste produced similar results
toothpaste actually gave slightly better results, but of course would cause corrosion and dry out
in hours if used in practice. tap water, before evaporating, gave excellent results: 0.41 C/W could be due to the heat used up in evaporating the water.
6.4.1: Purpose:
Thermal grease is primarily used in the electronics and computer industries to assist a
heat sink to draw heat away from a semiconductor component such as an integrated circuit or
transistor.
Thermally conductive paste improves the efficiency of a heat sink by filling air gaps that
occur when the imperfectly flat and smooth surface of a heat generating component is pressed
against the similar surface of a heat sink, air being approximately 8000 times less efficient at
conducting heat than, for example, aluminum (a common heat sink material). Surface
imperfections and departure from perfect flatness inherently arise from limitations in
manufacturing technology and range in size from visible and tactile flaws such as machining
marks or casting irregularities to sub-microscopic ones not visible to the naked eye. Thermal
conductivity and "conformability" (i.e., the ability of the material to conform to irregular
surfaces) are the important characteristics of thermal grease. Both high-power handling
transistors, such as those in an audio amplifier, and high-speed integrated circuits, such as the
central processing unit (CPU) of a personal computer, generate sufficient heat to benefit from the
use of thermal grease to improve the effectiveness of a heat sink.

P a g e | 35
2015-16
The need for heat sink compound can be minimized or removed by lapping the surfaces
of the hot component and the matching heat sink face so that they are virtually perfectly flat and
mirror-smooth. Computer over clockers, who increase computer speed by measures which
increase heat production, resort to lapping and other extreme cooling methods such as watercooling.
6.4.2: Properties:
The metal oxide and nitride particles suspended in silicone thermal compounds have
thermal conductivities of up to 220 W/(mK). In comparison, the thermal conductivity of metals
used particle additions, copper is 380 W/(mK), silver 429 and aluminum 237. The typical
thermal conductivities of the silicone compounds are 0.7 to 3 W/(mK). Silver thermal
compounds may have a conductivity of 3 to 8 W/(mK) or more.
In compounds containing suspended particles, the properties of the fluid may well be the
most important. As seen by the thermal conductivity measures above, the conductivity is closer
to that of the fluid components rather than the ceramic or metal components. Other properties of
fluid components that are important for thermal grease might be:
1. How well it fills the gaps and conforms to both the component's and the heat sink's
uneven surfaces.
2. How well it adheres to those surfaces
3. How well it maintains its consistency over the required temperature range
4. How well it resists drying out or flaking over time
5. Whether it degrades with oxidation or breaks down over time

P a g e | 36
2015-16
The compound must have a suitable consistency to apply easily and remove all excess to leave
only the minimum needed.
6.4.3 Application and removal:

Computer processor heat sink utilizes a variety of designs to promote better thermal
transfer between components. Some thermal grease has durability up to at least 8 years. Flat and
smooth surfaces may use a small line method to apply material, and exposed heat-pipe surfaces
will be best prepared with multiple lines.
Excess grease separating the metal surfaces more than the minimum necessary to exclude
air gaps will only degrade conductivity, increasing the risk of overheating. Silver-based thermal
grease can also be either slightly electrically conductive or capacitive; if some flows onto the
circuits it can cause malfunctioning and damage.
Over time, some thermal greases may dry out, have reduced heat transferring capabilities,
or set like glue and make it difficult to remove the heat sink. If too much force is applied the
processor may be damaged. Heating the grease by turning the processor on for a short period
often softens the adhesion. Another method to use can be by turning the heat sink slowly instead
of lifting it up. It is recommended that thermal grease be re-applied with each removal of the heat
sink.

P a g e | 37
2015-16
Silicone oil-based thermal grease can be removed from a component or heat sink with an
alcohol (such as rubbing alcohol) or acetone. Special-purpose cleaners are made for removing
heat sink grease and cleaning the surfaces.
7. CALCULATIONS
Input:
Heat source temperature: 54o C
Heat sink temperature: 22oC
Power input from candle: 25W
Output:
For 32o C temperature;
Voltage: 3VDC
Current: 0.8Amp
Power output: 2.4W
For 67o C temperature difference;
i.
Voltage: 6VDC

P a g e | 38
2015-16
ii.
Current: 1.2Amp
iii.
Power output:7.2W (for power input from two candle)
Efficiency:
For 32o C temperature difference
Efficiency = output / input
= 2.4 / 25 *100
Efficiency = 9.6 %
8. BILL OF MATERIAL
Sr. No.
Component Name
Quantity
Cost (Rs.)
CPU-cooler (cold side): Antec A-40
1350/-
Aluminium heat source
50/-
TEC-module: TEC12-706
300/-
DC Motor
50/-
Thermal paste
35/-
Stand of wood
50/-
TOTAL

P a g e | 39
1835/-
2015-16
9. APPLICATIONS
Applications for thermoelectric modules cover a wide spectrum of product areas. These
include equipment used by military, medical, industrial, consumer, scientific/laboratory, and
telecommunications organizations. It includes a range from simple food and beverage coolers
for an afternoon picnic to extremely sophisticated temperature control systems in missiles and
space vehicles. Typical applications for thermoelectric modules include: avionics, calorimeters,
cold chambers, cold plates, compact heat exchangers, constant temperature baths, dehumidifiers,
dew point hygrometers, electronics package cooling, environmental analyzers, heat density
measurement, immersion coolers, integrated circuit cooling, infrared detectors, infrared seeking
missiles, microprocessor cooling, power generators, refrigerators and onboard refrigeration
systems (aircraft, automobile, boat, hotel, among others).
Most suitable applications:

1.
2.
3.
4.
5.
In computer CPU for cooling of processor.

In house for lighting purpose by using gas waste heat with help of plate.
Mobile charging by candle.
Battery charging by solar energy.
Battery charging by using exhaust heat from silencer.

P a g e | 40
2015-16
10.
CONCLUSION
Thermoelectric systems are solid-state heat devices that either convert heat directly into
electricity or transform electric power into thermal power for heating or cooling. The operation
principles are the Seebeck and Peltier effects and the devices offer several advantages over other
technologies.
Applications for thermoelectric modules cover a wide spectrum of product areas. These
include equipment used by military, medical, industrial, consumer, scientific/laboratory, and
telecommunications organizations. Each application will have its own set of requirements that
likely will vary in level of importance. Nowadays the applications are restricted to small thermal
systems but the trend in recent years has been for larger thermoelectric systems. So, the
thermoelectricity is one important field for the development of environmentally friendly thermal
systems and the researches of new thermoelectric materials with large Seebeck coefficient and
appropriate technology could make a breakthrough in the applications of thermoelectric devices
in many applications.

P a g e | 41
2015-16
11.
CASE STUDY
1) Case study on solar energy:

Solar energy is freely and readily available from the sun to all of us. As the project can
use any free or waste heat, we tried it for solar energy. Firstly we tried for the optical lenses, but
because of their unavailability, we used Fresnel lens which has more concentrating ability than
the optical lenses. The solar heat utilization system can be improved by utilizing the solar
tracking device which will absorb the maximum intensity of the solar radiations.
The following image shows the practical set up we made for the testing purpose;
Input (free energy):

Output:

P a g e | 42
2015-16
Voltage: 1.3VDC
Current: 0.3Amp
Power output: 0.39W
2) Case study on waste heat from cooking in kitchen:

The heat from burnt gas of
cooking is also one type of waste heat and we had a trail on the gas waste heat. We had
fabricated a cover which will cover the top of the stand and arrests the waste heat leaving the
burner. The fin like plates will carry the waste heat from the burner and the upper covering will
not allow the burnt gases to leave the burner without utilization. The image showed is the bottom
view of the element. The fabricate design is as shown on following image;
Input (gas waste heat):

Output:
Voltage: 1.1VDC

P a g e | 43
2015-16
Current: 0.2Amp
Power output: 2.4W
12.
FUTURE SCOPE
The main disadvantage of this system is that we have to put both the junctions very near
to each other by which the cold side becomes hot after some time for natural cooling. So
for this problem, the thermoelectric material to be used must be such that the distance
between the cold and hot can be easily adjusted.
For using solar energy, a specially designed CPU cooler is to be developed and also the
solar tracking device must be installed to change the direction of the hot side for
absorbing maximum intensity of solar energy.
The Z material can also be used for obtaining maximum efficiency.

P a g e | 44
2015-16
13.
REFERANCES
1. From web:
i.
http://www.google.com/url?
sa=t&rct=j&q=&esrc=s&source=web&cd=1&ved=0CB0QFjAAah
UKEwjfs4-Fia7IAhXKcI4KHVyfDV0&url=http%3A%2F
%2Fwww.instructables.com%2Fid%2FThermoelectric-Fan-Drivenby-a-Candle%2F&usg=AFQjCNF3jNee2i_ZHQpkD-
ii.
H0ezzKX4yGuQ
https://www.google.com/search?q=thermoelectric+fan&ie=utf8&oe=utf-8&rls=org.mozilla:en-US:official&client=firefoxbeta&channel=np&source=hp&gfe_rd=cr&ei=u9sTVrj3M8qFoAOr
_ruQDg#channel=np&q=thermoelectric+generator+fan
2. From books:
i.
Engineering thermodynamics. P. K. Nag

P a g e | 45
2015-16
14.
PHOTO GALLERY

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2015-16

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2015-16

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2015-16

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15.
ACHIEVEMENTS
Winner:
EMPIRE 2016a NATIONAL LEVEL EVENT arranged by Electrical, Computer Science &
Electronics Telecommunication Engineering Department of SBGI engineering college.
Participation:
QUANTUM 2016, a NATIONAL LEVEL TECHNICAL event arranged by

mechanical department of RIT College of engineering.

A Project Report ON: "Thermoelectric Power"

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Thermoelectric power

Under the Guidance of

DEPARTMENT OF MECHANICAL ENGINEERING

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic Sangli.

Mr. Patil Sourabh Shital

Mr. Patil Rakesh Dileep(Roll No-3752)

Mr. V.N. Bargale

Mr. Patil Sanket Dhananjay.

Latthe Education Societys Polytechnic, Sangli.

Thermoelectric power generator device

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic, Sangli.

Fig.no.2.1 TEC as Refrigerator & Power generator

Latthe Education Societys Polytechnic, Sangli.

2.1: THE PELTIER AND SEEBECK EFFECTS:

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic, Sangli.

Fig no2.1 Peltier Effect

Fig. no. 2.2 Seebeck effect

3. THERMOELECTRIC POWER GENERATOR DEVICE

Fig. no. 3.1.1 Schematic of a thermoelectric power generator

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic, Sangli.

Good thermal paste to maximize temperature difference

Low voltage motor, around 5V. I prefer it to be quite (low dB)

Fan with high air flow at low RPM

Latthe Education Societys Polytechnic, Sangli.

Fig. Setup of Experiment

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic, Sangli.

Fig. no. 6.1.1 Schematic diagram of Antec A-40 CPU cooler

48(L) x 100(W) x 125(H)mm

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic, Sangli.

Fig. no. 6.1.2 Antec A-40 CPU cooler

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic, Sangli.

Thermoelectric modules offer many advantages including:

Small and lightweight

Acoustically silent and electrically quiet

Wide operating temperature range

Highly precise temperature control (to within 0.1C)

Operation in any orientation, zero gravity and high G- levels

Cooling to very low temperatures (-80C)

Latthe Education Societys Polytechnic, Sangli.

Fig. no. 6.2.1 Orientation of TEC module

6.2.2: Locating the Positive Wire:

Latthe Education Societys Polytechnic, Sangli.

Fig. no. 6.2.1 TEC

ITEM PART Number

Latthe Education Societys Polytechnic, Sangli.

ITEM PART Number

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic, Sangli.

Latthe Education Societys Polytechnic, Sangli.

ITEM PART Number

Latthe Education Societys Polytechnic, Sangli.

ITEM PART Number

Latthe Education Societys Polytechnic, Sangli.