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  • Computer Hardware Heat Dispersal 17-19 of 19

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    This document discusses heat dispersal techniques for computer chips. It describes heat sinks, which are made of aluminum and expand the surface area of small chips to dissipate heat passively through 100% reliable means. It also describes fans, which can be added to heat sinks and use electricity to actively draw in cold air and blow out hot air in order to cope with various system demands, though they can become noisy depending on fan speed and are powered by the motherboard or power supply unit.

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    computer hardware heat dispersal 17-19 of 19

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    This document discusses heat dispersal techniques for computer chips. It describes heat sinks, which are made of aluminum and expand the surface area of small chips to dissipate heat passively through 100% reliable means. It also describes fans, which can be added to heat sinks and use electricity to actively draw in cold air and blow out hot air in order to cope with various system demands, though they can become noisy depending on fan speed and are powered by the motherboard or power supply unit.

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    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pptx, pdf, or txt
    33 views3 pages

    Computer Hardware Heat Dispersal 17-19 of 19

    Uploaded by

    api-302622116
    This document discusses heat dispersal techniques for computer chips. It describes heat sinks, which are made of aluminum and expand the surface area of small chips to dissipate heat passively through 100% reliable means. It also describes fans, which can be added to heat sinks and use electricity to actively draw in cold air and blow out hot air in order to cope with various system demands, though they can become noisy depending on fan speed and are powered by the motherboard or power supply unit.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pptx, pdf, or txt
    of 3

    Heat Dispersal

    www.bcotcomputerscience.co.uk

    H E AT S I N K
    Use to expand the
    surface area of small
    chips
    Made from Aluminum
    Passive heats sinks
    100% reliable
    Active heat sinks use
    electricity, and use a
    built in fan.

    FA N S
    Can be used on top of
    heat sinks
    Draw cold air in, blows hot
    air out.
    Different sizes to cope
    with demands of system
    Can be noisy depending
    on the fan speed.
    Can be powered by the
    motherboard or the PSU

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