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Skin Depth Equation Formula
Skin Depth Equation Formula
In the case of a microstrip layout (to the right), the current concentrates
nearest to the substrate dielectric material, although current does also concentrate at the other
surfaces as well (redder regions). For a solid wire (to the left), the current concentrates on the outer
surface. For this reason, when skin depth is shallow, the solid conductor can be replaced with a hollow
tube with no perceivable loss of performance. Choice of a plating material can degrade performance
(increase attenuation) if its bulk resistivity is greater than that of the copper.
Most common conductors have a relative permeability of very near 1, so for copper, aluminum, etc., a
value of 4* 10-7 H/m can safely be assumed. Magnetic materials like iron, cobalt, nickel, mumetals,
and permalloy can have relative permeabilities of hundreds or thousands.
The
equation
for
calculating
(click here table
(click here for a skin depth calculator)
the
skin
of
depth
is
calculated
given
here:
values)