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    Enlace Atómico: Capítulo 1

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    Andie Acosta
    The document compares the melting points of various materials based on their bonding type. Materials with ionic bonding like NaCl have higher melting points than materials with covalent bonding like carbon or polyethylene. Copper which has metallic bonding has a higher melting point than argon with secondary bonding from induced dipoles. Water with permanent dipole secondary bonding has a melting point of 0 degrees Celsius. The document also categorizes various materials based on their bonding characteristics, listing metals as having metallic bonding, ceramics and glasses as having ionic or covalent bonding, polymers as having covalent and secondary bonding, and semiconductors as having covalent or covalent/ionic bonding.

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    Enlace Atómico: Capítulo 1

    Uploaded by

    Andie Acosta
    15 views34 pages
    The document compares the melting points of various materials based on their bonding type. Materials with ionic bonding like NaCl have higher melting points than materials with covalent bonding like carbon or polyethylene. Copper which has metallic bonding has a higher melting point than argon with secondary bonding from induced dipoles. Water with permanent dipole secondary bonding has a melting point of 0 degrees Celsius. The document also categorizes various materials based on their bonding characteristics, listing metals as having metallic bonding, ceramics and glasses as having ionic or covalent bonding, polymers as having covalent and secondary bonding, and semiconductors as having covalent or covalent/ionic bonding.

    Original Description:

    Enlace atomico

    Original Title

    Clase2.pptx

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    The document compares the melting points of various materials based on their bonding type. Materials with ionic bonding like NaCl have higher melting points than materials with covalent bonding like carbon or polyethylene. Copper which has metallic bonding has a higher melting point than argon with secondary bonding from induced dipoles. Water with permanent dipole secondary bonding has a melting point of 0 degrees Celsius. The document also categorizes various materials based on their bonding characteristics, listing metals as having metallic bonding, ceramics and glasses as having ionic or covalent bonding, polymers as having covalent and secondary bonding, and semiconductors as having covalent or covalent/ionic bonding.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pdf or txt
    15 views34 pages

    Enlace Atómico: Capítulo 1

    Uploaded by

    Andie Acosta
    The document compares the melting points of various materials based on their bonding type. Materials with ionic bonding like NaCl have higher melting points than materials with covalent bonding like carbon or polyethylene. Copper which has metallic bonding has a higher melting point than argon with secondary bonding from induced dipoles. Water with permanent dipole secondary bonding has a melting point of 0 degrees Celsius. The document also categorizes various materials based on their bonding characteristics, listing metals as having metallic bonding, ceramics and glasses as having ionic or covalent bonding, polymers as having covalent and secondary bonding, and semiconductors as having covalent or covalent/ionic bonding.

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    of 34

    Enlace

    Atmico
    Captulo 1

    Bond strength as exhibited by mel3ng temperature

    Comparison of mel6ng points for some of the representa


    materials
    Material

    Bonding Type

    Mel6ng Poin

    NaCl

    Ionic

    801

    C (diamond)

    Covalent

    3550

    PolyeHhylene (-
    C2H4-)

    Covalent and
    secondary

    120*

    Cu

    Metallic

    1084.87

    Ar

    Secondary (induced -189


    dipole)

    H2O

    Secondary
    0
    (permanent dipole)

    *because of the irregulary of the polymeric structure of polyethylene, it


    have a precise mel6ng point. Instead, it soUens with incrasing temperatu
    120 oC. In this case, the 120 oC vaue is a service temperature rather th
    mel6ng point.

    Bond in various materials


    Material Type

    Bonding Character

    Example

    Metal

    Metallic

    Iron (Fe) and ferrous alloys

    Ceramics and glasses

    Ionic/covalent

    Silica (SiO2): crystalline and


    nanocrystalline

    Polymers

    Covalent and secondary


    Polyethylene (-C2H4-)

    Semiconductors

    Covalent or covalent/ionic

    Silicon (Si) cadmium sulde


    (CdS)

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