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PCB Manufacture Photoresist Method
PCB Manufacture Photoresist Method
1, removing film, photosensitive film is sandwiched between two layers of film, tear up the side of the first little difficult
to tear, try a few on the line
2, then foil, copper clad laminates little cleaning can paste level, try not to bubble
3, stickers, ready, irons a little heat, not too hot, fixed effect
4 printed circuit board film, it is recommended that the film can achieve the highest degree of fine, if not accuracy
requirements with sulfuric acid paper print.
5, exposure, circuit diagram printed on the photo plate (Note: The dry film is negative, so anti-white print, which is
contrary to our usual plate) for about 30 minutes with ordinary energy-saving lamps, exposure machine 1 minute on
the line, the sun never tried, it should be about 15 minutes, the exposure process obviously, because the
photosensitive film will change color, from light-colored dark blue exposure. You will easily see the circuit diagram is
shown in the board.
6, developing, torn off another layer of protective film and put it into the developer (developer 1:100 watered, 10 grams
against 1 liter of water), developing with a cotton swab and a little harder to wipe the board
7, etching Needless to say
8, after etching, stripping, mold release agent watered one sixty or 70, the board bulb within minutes
7. Clamp the printed transparency film by the polymethyl methacrylate glass.
10. The distance between the lamp and the glass is about 10cm.
11. Preparing to develop. (20g photoresist dry film developer mixes with 800ml 30 water)
12. Put the plate into the develop solution and brush it gently.
17. Preparing the materials of etching. (200g etching powder mixes with 800ml 100 water)
18. Begin to etching. Put the plate into the etching solution. The temperature of the solution had better in 50 above.
19. Preparing the materials of remove. (50g photoresist resist remover powder mixes with 1000ml water)