Electronics Manufacturing Processes

Manufacture of Electronics Components

Manufacture of Printed Circuit Boards (PCBs)
Assembly of components on PCBs

Electronics Manufacturing Processes

Manufacture of Electronics Components

Manufacture of Printed Circuit Boards (PCBs)
Assembly of components on PCBs

Electronics Component Manufacture

Electronics Components
Mechanical and Electro-mechanical:
PCB mounted DIP switches, mains switches, disc drives
Passive Solid State Devices:
Resistors, Capacitors
Active Solid State Devices:
Transistors, Diodes, Thermionic valves, FETs and MOSFETs

Passive devices: resistors

Carbon Composite Resistor
Slug leads mold bake seal
- cheap, poor tolerance, rugged

Wire-wound resistor
wind wire leads mold seal
- high power, low resistance, high frequency apps

Film resistor
Film is cut by laser high precision
- low frequency applications

Passive devices: capacitors

Tabbed tubular paper capacitor

Disk-ceramic capacitor

Tubular ceramic capacitors

Active devices: Silicon wafer production

Raw Si:

Quartzite (SiO2) + Carbon (C) + Heat + catalysts Si + CO2

Pure Si:

Si + HCl SiCl4 + Hydrogen Fractional distillation

SiCl4 + H2 + catalysts Si + HCl

Pure Monocrystalline Si:

Melt pure Si, Seed crystal drawn out slowly
Typical Single Crystal Ingot sizes:
1-2m long, 8cm / 15cm / 30 cm diameter

Ingot sliced (Diamond saw)

Active Devices: Doping pure silicon

Silicon

Dopant: Phosphorus, N-type

Dopant: Aluminum, P-type

Doping processes:
Diffusion (heat wafer in atmosphere with atoms of dopant)
Ion implantation (ions of dopant are accelerated, bombard surface)
Diode (showing doping)

Active components: Transistors

NPN transistor

MOSFET
Metal-Oxide Silicon
Field Effect Transistor

Active components: Integrated Circuits

Monolithic IC: Entire circuit made on a single crystal wafer
Hybrid IC: Monolithic IC + other components directly assembled into it

Hybrid micro-circuit film components

Active components: ICs..

Depositing films of materials on substrate to make circuits
Thin Film Processes:
Form components on circuits by vacuum evaporation, sputtering, or anodization
Film thickness is 5 m
Thick Film Processes (silk-screening)
Print liquid or paste through a screen (mask) onto substrate firing (baking)
Film thickness is ~ 10 m

Silk-screening

ICs: Resistive elements deposition

Subtractive
process

Additive
process

vacuum deposition

Diffused Junction Process

- Photolithography is the most

commonly used process
- Photoresists:
positive: more soluble when exposed
negative: less soluble when exposed
- Feature size = f(wavelength)
small features need low radiation
- Mask = = Artwork
- Projection:
- Direct: mask scale is 1:1
- Reducing: mask scale is 10:1

Packaging of components
- Packaging puts the chip (silicon) into a protective case
- Package provides external connections that are spaced conveniently
(at distance, arranged in array) for soldering

Exploded view of TO package

Packaging of components

Structure of a Surface mount component

SOIC package
Small Outline IC

Avoiding possible heat damage to IC during soldering:

- Solder a chip carrier to the PCB
- Insert chip into carrier
IC
Chip carrier

Integrated Circuit (IC) Manufacture

- Slicing the Silicon ingot
- Fabrication of ICs (Lithography, Sputtering, diffused junction, )
- Testing each IC on the slice

[source: www.towajapan.co.jp]

- Dicing (cutting each chip out with a diamond saw)

- Packaging

Packaging
- Make leadframe

Steps in Lead Frame Manufacture:

(1) Cut copper strips
(2) Clean in a chemical bath
(3) laminate a layer of photoresist
(4) Expose photoresist through mask
(5) Develop and etch
(6) Remove lamination
(7) Plate internal regions with gold/silver
Dual Inline Package and its lead-frame

- Die attachment (chip bonded to leadframe using epoxy)

- Wire bonding (ultrasonic welding)
- Encapsulation (moisture resistant coating)
- Molding (plastic package)

- Marking (chip number, co. name, marked on package [laser, silkscreen])

- DTFS: deflash, trim the leadframe, form the leads, singulate (cut dambars)
- Leadfinishing: electroplating the leads

Electronics Manufacturing Processes

Manufacture of Electronics Components

Manufacture of Printed Circuit Boards (PCBs)
Assembly of components on PCBs

PCB Manufacture
Typical PCB

copper connections
protective covering
insulated substrate

Types of PCB's
single-side, double-side and multi-layer
Which type to use ?
(a) Circuit complexity
(b) Available space
(c) Cost

Manufacturing glass reinforced epoxy resin copper-clad boards

Boards are produced in "clean-rooms"
Manufacturing process: hot-pressing
Place copper sheet on the lower plate
Place few layers of glass cloth impregnated with epoxy on top
[IF two-sided PCB's]: Place copper sheet on above
Press between steel plates in a steam-heated hydraulic press (~7,000,000 Pa)
Water cooling to 25 C
Trim to clean out extruded epoxy
Punch/Drill holes for alignment
Make circuit on PCB (lithography)
Drill through holes (for component leads)

Multi-layer PCBs
Similar process as single layer, but takes several steps

Schematics and features on

Multi-layer PCBs

Electronics Manufacturing Processes

Manufacture of Electronics Components

Manufacture of Printed Circuit Boards (PCBs)
Assembly of components on PCBs

PCB Assembly
- Insert leaded component into holes on PCB
- Solder
- Protective coating

Manual electronics assembly

Automated electronics assembly

Automated PCB Assembly

Component inputs:

Leaded Component

ICs, components with no wire leads

PCB Manufacture
Surface mount chip assembly:
- Silk-screening to apply solder paste on the board
- Automated assembly of components (>30,000 components per hour)
- IR or Wave soldering

Automatic soldering
Step 1. Application of the solder resist
Cover PCB with solder resist except Lands
Land

Step 2. Flux application

Foam fluxing

Spray fluxing

Ultrasonic Spray fluxing

Automatic soldering..

Step 3. Solder Application

Dual wave solder bath
Dip soldering

Automatic soldering..

Step 4. Automatic removal of solder bridges: Hot air-jet knives

air-jet
SOLDER
WAVE

Hot air jet knife

Types of circuit boards

Special considerations
for SMT boards