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  • 2468 V 33 Stackup

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    greentea601
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    This document contains a 12 layer PCB stackup specification. It lists the material and thickness for each layer, including dielectric, trace width and copper thickness. Layer functions include signals, power planes, and grounds. Controlled impedances aim for 51 ohms and 50 ohms for microstrip and stripline configurations respectively.

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    2468v33stackup

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    This document contains a 12 layer PCB stackup specification. It lists the material and thickness for each layer, including dielectric, trace width and copper thickness. Layer functions include signals, power planes, and grounds. Controlled impedances aim for 51 ohms and 50 ohms for microstrip and stripline configurations respectively.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pdf or txt
    19 views1 page

    2468 V 33 Stackup

    Uploaded by

    greentea601
    This document contains a 12 layer PCB stackup specification. It lists the material and thickness for each layer, including dielectric, trace width and copper thickness. Layer functions include signals, power planes, and grounds. Controlled impedances aim for 51 ohms and 50 ohms for microstrip and stripline configurations respectively.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    Download as pdf or txt
    of 1

    B2468V33 PCB STACKUP

    Fukun Tang
    University of Chicago
    Tel:773-702-7801
    Fax:773-702-2971
    tang@mentor.uchicago.edu

    File Name: 2468v33stackup.xls, 2468v33stackup.pdf


    12 Layers PCB Stackup

    Dielectric Trace Cu Controlled


    Material Thickness Width Thickness Dielectric Impedanc
    Layer Artwork Layer Name Type (mils) (mils) (mils) Constant e (Ohms) Description
    1 artwork_1 Top, Signal_1 Conductive . 7 0.7 . 51 Microstrip
    Dielectric 5 . . 4.7 . Core/Pre-preg
    2 artwork_2 VCC25A Conductive . 1.4 . Plane
    Dielectric 8 . . 4.7 . Core/Pre-preg
    3 artwork_3 Inner, Signal_2 Conductive . 7 0.7 . 50 Unbalanced Stripline
    Dielectric 5 . . 4.7 . Core/Pre-preg
    4 artwork_4 Inner, Signal_3 Conductive . 7 0.7 . 50 Unbalanced Stripline
    Dielectric 8 . . 4.7 . Core/Pre-preg
    5 artwork_5 VDD Conductive . . 1.4 . Plane
    Dielectric 5 . . 4.7 . Core/Pre-preg
    6 artwork_6 GROUND Conductive . . 1.4 . Plane
    Dielectric 5 4.7 Core/Pre-preg
    7 Artwork_7 AGNDA, AGNDB Conductive 1.4 Plane
    Dielectric 5 4.7 Core/Pre-preg
    8 Artwork_8 VCC30A, VCC30B Conductive 1.4 Plane
    Dielectric 8. . 4.7 . Core/Pre-preg
    9 artwork_9 Inner, Signal_4 Conductive . 7 0.7 . 50 Unbalanced Stripline
    Dielectric 5. . 4.7 . Core/Pre-preg
    10 artwork_10 Inner, Signal_5 Conductive . 7 0.7 . 50 Unbalanced Stripline
    Dielectric 8. . 4.7 . Core/Pre-preg
    11 artwork_11 VCC25B Conductive . 1.4 . Plane
    Dielectric 5. . . Core/Pre-preg
    12 artwork_12 Bot, Signal_6 Conductive . 7 0.7 4.7 51 Microstrip
    Notes: Total board thickness: 0.070 +/- 0.01 mils
    Cotrolled impedence is 50 ohms +/- 10%

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