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Slide Presentasi 1
Slide Presentasi 1
PROSES PERANCANGAN
Sandra Prasetyo 13106144
Ahmad 23110088
OUTLINE
Thermal conductivity
●
Property of a material that indicates its ability to conduct heat
Thermal Expansion
●
The tendency of matter to change in volume in response to a change in temperature
THERMAL EXPANSION-THERMAL CONDUCTIVITY
CHART (CHART 10)
Polymers have large values of α, roughly 10 times greater than those of metals
and almost 100 times greater than ceramics. It caused by Van Der Walls bond is
anharmonic (weak).
Diamond, silicon, and silica (SiO2) have covalent bonds which have low
anharmonicity , giving them low expansion coefficients.
Model
●
Function : Force loop (frame) for precision device
●
Objective : Maximize positional accuracy (minimize distortion)
●
Constraints : Must tolerate heat flux ,Must tolerate vibration
Step in determination
Choose
material which
have large
value of M1
THERMAL EXPANSION-MODULUS CHART (CHART 11)
Thermal Stress is the stress which appears in body when it is
heated or cooled.
It depends :
Modulus (E)
when heat transfer at the surface is poor and the thermal conductivity of the solid is
high (thereby reducing thermal gradients) the thermal stress is less than in
equation 1 by factor A
Thermal shock
resistance