Failure Analysis & Reliability test Lab

NFME Reliability Test Lab

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Failure Analysis & Reliability test Lab

1.)Pressure Cooker TestPCT:

Reference: JESD22-A102 Purpose: To detect moisture related defect Condition: 121C/100%RH/ 2ATM, 96H&168H Produce: ENVRON Model:PSV-511 Quantity: 1

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Failure Analysis & Reliability test Lab

2) . Temperature Humidity StorageTHS:

Reference: EIA/JESD22-A101 Purpose: To detect moisture related defect Condition: 85C/85%RH, 168H and more Produce: ESPEC Model:ER-02KA PH-1KTH Quantity: 4

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Failure Analysis & Reliability test Lab

3.) High temperature Storage (HTS):

Reference: JESD22-A103 Purpose: To accelerate the diffusion of inter-metallic(Au/Al,Sn/Au),and confirm whether to cause open failure Condition: 150C, 168H and more Produce: TABAIESPEC TOKYO GZESPEC etc. Model:HPS-212 WFO-450SD SPTPH-101W PH-201 SMO-3 etc. Quantity:6

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Failure Analysis & Reliability test Lab

4.) High Accelerated Stress Test (HAST):

Reference: JESD22-A110 Purpose: To evaluate on the device resistance to high humidity and temperature (with pressure) under specified bias condition. Condition: 130C,85%RH, 96H/100H, Bias or un-bias

Produce:HIRAYAMA Model:PC-422R8 Quantity:1

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Failure Analysis & Reliability test Lab

5.) Solderability :
Reference: JESD22-B102&Mil883 Purpose: to provide a means of determining of the solderability of device package terminations that are intended to be jointed to another surface using solder or attachment Condition: 93C,8H (steam aging ) 150C,16H(HTS) 215C&245C, 5sec(Sn63/Pb37, Sn96.5/Ag3/Cu0.5)

Produce:METRONELEC GOOT Model: MENISCO ST60 POT100C Quantity: 2(manual)+1(automatic)

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Failure Analysis & Reliability test Lab

6.) Temperature Cycle (T/C) :

Reference: EIA/JESD22-A104 Purpose: to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low temperature extremes. Condition: -65C~+150C 30min/C(Normal)

Produce: WEISS HANK TEST Model: 3X120/80-20-220

ES-B4C Quantity:2

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Failure Analysis & Reliability test Lab

7.) Scanning Acoustic Microscope (SAM) :

Reference: J-STD020 Purpose: To determine the delamination Condition: N/A Produce: SONIX Model: UHR2000 FUSION Quantity: 2

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Failure Analysis & Reliability test Lab

8). convection Reflow

Reference:Jstd22A020 Purpose: simulate reflow

soldering process Condition: different condition according the PKG size and the plating mode Produce: Speedline / Cookson Model: omniflex 7 BRAVO 8 Quantity: 2

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Failure Analysis & Reliability test Lab

9). XRF
content of five elements (Cd,Pb,Cr,Br,Hg) in RoHS standard Produce: JEOL Model: JSX-3400R Quantity: 1
Purpose: To determine the

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