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    ThermalFusion 400 is a supreme thermal compound that has high thermal conductivity and low thermal resistance, helping to improve CPU and GPU cooling. It is non-curing, non-corrosive, and non-electrically conductive to avoid short circuits. ThermalFusion 400 is gray, has a thermal conductivity of 2.89 W/m-K, and is packaged in 200-unit cartons for effective thermal dissipation and bonding applications.

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    File 1220863145526

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    ThermalFusion 400 is a supreme thermal compound that has high thermal conductivity and low thermal resistance, helping to improve CPU and GPU cooling. It is non-curing, non-corrosive, and non-electrically conductive to avoid short circuits. ThermalFusion 400 is gray, has a thermal conductivity of 2.89 W/m-K, and is packaged in 200-unit cartons for effective thermal dissipation and bonding applications.

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    ThermalFusion 400 is a supreme thermal compound that has high thermal conductivity and low thermal resistance, helping to improve CPU and GPU cooling. It is non-curing, non-corrosive, and non-electrically conductive to avoid short circuits. ThermalFusion 400 is gray, has a thermal conductivity of 2.89 W/m-K, and is packaged in 200-unit cartons for effective thermal dissipation and bonding applications.

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    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
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    28 views1 page

    File 1220863145526

    Uploaded by

    rohan55
    ThermalFusion 400 is a supreme thermal compound that has high thermal conductivity and low thermal resistance, helping to improve CPU and GPU cooling. It is non-curing, non-corrosive, and non-electrically conductive to avoid short circuits. ThermalFusion 400 is gray, has a thermal conductivity of 2.89 W/m-K, and is packaged in 200-unit cartons for effective thermal dissipation and bonding applications.

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    of 1

    ThermalFusion

    400
    RG-TF4-TGU1-GP

    ThermalFusion 400 is a supreme


    thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and nonelectrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.

    Features
    High Thermal Conductivity Low Thermal Resistance Non-Curing Non-Corrosive Non-Electrical Conductive

    Specifications
    Color Specific Gravity (25) Thermal Conductivity (W/m-K) Volume Resistivity (ohm-cm) Gray 3.5 2.89 2.0E+10 Packaging Information
    EAN Code UPC Code Carton Size Cuft Units / Carton 4719512013182 884102002687 485 x 400 x 405 mm 2.77 200

    Thermal Resistance (-cm/W) 0.032 Bond Line Thickness (mm) Volatile Content (%) Net Weight (g) 0.008 <0.1 4

    2008

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