The document reports on the serigrafía superior and copper bottom layers of a PCB board at different times on January 29th, 2011. It notes that the serigrafía superior layer was processed at 1:43 am and 1:45 am, and that the copper bottom layer was processed at 1:43 am and 1:45 am, with both layers being reflected after processing.
The document reports on the serigrafía superior and copper bottom layers of a PCB board at different times on January 29th, 2011. It notes that the serigrafía superior layer was processed at 1:43 am and 1:45 am, and that the copper bottom layer was processed at 1:43 am and 1:45 am, with both layers being reflected after processing.
The document reports on the serigrafía superior and copper bottom layers of a PCB board at different times on January 29th, 2011. It notes that the serigrafía superior layer was processed at 1:43 am and 1:45 am, and that the copper bottom layer was processed at 1:43 am and 1:45 am, with both layers being reflected after processing.