PROBLEM 1.

41
KNOWN: Hot plate-type wafer thermal processing tool based upon heat transfer modes by conduction through gas within the gap and by radiation exchange across gap. FIND: (a) Radiative and conduction heat fluxes across gap for specified hot plate and wafer temperatures and gap separation; initial time rate of change in wafer temperature for each mode, and (b) heat fluxes and initial temperature-time change for gap separations of 0.2, 0.5 and 1.0 mm for hot plate temperatures 300 < Th < 1300C. Comment on the relative importance of the modes and the influence of the gap distance. Under what conditions could a wafer be heated to 900C in less than 10 seconds? SCHEMATIC:

ASSUMPTIONS: (1) Steady-state conditions for flux calculations, (2) Diameter of hot plate and wafer much larger than gap spacing, approximating plane, infinite planes, (3) One-dimensional conduction through gas, (4) Hot plate and wafer are blackbodies, (5) Negligible heat losses from wafer backside, and (6) Wafer temperature is uniform at the onset of heating. PROPERTIES: Wafer: = 2700 kg/m , c = 875 J/kgK; Gas in gap: k = 0.0436 W/mK. ANALYSIS: (a) The radiative heat flux between the hot plate and wafer for Th = 600C and Tw = 20 C follows from the rate equation,
4 4 q = Th Tw = 5.67 108 W / m 2 K 4 rad
3

(( 600 + 273)

( 20 + 273 )

)K

= 32.5 kW / m 2

< <

The conduction heat flux through the gas in the gap with L = 0.2 mm follows from Fouriers law,

( 600 20 ) K = 126 kW / m2 Th Tw q = 0.0436 W / m K cond = k L 0.0002 m

The initial time rate of change of the wafer can be determined from an energy balance on the wafer at the instant of time the heating process begins,

E E = E in out st

dT E = c d w st dt i

where E = 0 and E = q or q . Substituting numerical values, find out in rad cond

dTw dt

q 32.5 103 W / m 2 = rad = = 17.6 K / s i,rad cd 2700 kg / m3 875 J / kg K 0.00078 m

< <

dTw dt

q = cond = 68.6 K / s cd i,cond

Continued ..

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PROBLEM 1.41 (Cont.)

(b) Using the foregoing equations, the heat fluxes and initial rate of temperature change for each mode can be calculated for selected gap separations L and range of hot plate temperatures Th with Tw = 20C.

400
Initial rate of change, dTw/dt (K.s^-1)

200

300 Heat flux (kW/m^2)

150

200

100

100

50

0 300 500 700 900 1100 1300

0 300 500 700 900 1100 1300

Hot plate temperature, Th (C)

Hot plate temperature, Th (C) q''rad q''cond, L = 1.0 mm q''cond, L = 0.5 mm q''cond, L = 0.2 mm
q''rad q''cond, L = 1.0 mm q''cond, L = 0.5 mm q''cond, L = 0.2 mm

In the left-hand graph, the conduction heat flux increases linearly with Th and inversely with L as expected. The radiative heat flux is independent of L and highly non-linear with Th, but does not approach that for the highest conduction heat rate until Th approaches 1200C. The general trends for the initial temperature-time change, (dTw/dt)i, follow those for the heat fluxes. To reach 900C in 10 s requires an average temperature-time change rate of 90 K/s. Recognizing that (dTw/dt) will decrease with increasing Tw, this rate could be met only with a very high Th and the smallest L.

Excerpts from this work may be reproduced by instructors for distribution on a not-for-profit basis for testing or instructional purposes only to students enrolled in courses for which the textbook has been adopted. Any other reproduction or translation of this work beyond that permitted by Sections 107 or 108 of the 1976 United States Copyright Act without the permission of the copyright owner is unlawful.